Patent US4659436A successfully refreshed from Google Patents.
US4659436A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Particulate diamond-coated metal article with high resistance to stress cracking and process therefor
Assignee: Augustus Worx Inc
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Filing: 1986-02-24
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Granted: 1987-04-21
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Expires: 2006-02-24
Abstract
Abstract A metallic substrate which is to be electroplated with a metal other than copper for use in high stress applications, such as band saw blades, is given improved resistance to stress fracture by electroplating with copper from an alkaline solution prior to the noncuprous metal.
Inventors
- 👤 Marvin A. Kaylor
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-06 17:36
CPC Classifications
B; B23; B23D; B23D61/00; B23D61/12; B23D61/127; C; C25; C25D; C25D15/00; Y; Y10; Y10T; Y10T428/00; Y10T428/12; Y10T428/12493; Y10T428/12535; Y10T428/12625; Y10T428/12771; Y10T428/12861; Y10T428/12903; Y10T428/1291
Claims Analysis
Total Claims: 20
Claim 1
Independent Claim
48 words
In a method for depositing a particulate abrasive on a metallic substrate by electroplating thereon a metal other than copper with said particulate abrasive dispersed therein, the improvement comprising electroplating said metallic substrate with copper from an alkaline solution containing copper ions prior to depositing said particulate abrasive.
Claim 2
Dependent Claim
48 words
In a method for depositing a particulate abrasive on a metallic substrate by electroplating thereon a metal other than copper with said particulate abrasive dispersed therein, the improvement comprising electroplating said metallic substrate with copper from an alkaline solution containing copper ions prior to depositing said particulate abrasive.
Claim 3
Dependent Claim
61 words
A method according to claim 1 in which said electroplating with copper is begun by electrolytically precipitating copper onto said metallic substrate from a first alkaline electroplating bath containing copper cyanide and an alkali metal cyanide in which at least about 15% of said alkali metal cyanide is free alkali metal cyanide, at a cathode efficiency of less than about 50%.
Claim 4
Dependent Claim
61 words
A method according to claim 1 in which said electroplating with copper is begun by electrolytically precipitating copper onto said metallic substrate from a first alkaline electroplating bath containing copper cyanide and an alkali metal cyanide in which at least about 25% of said alkali metal cyanide is free alkali metal cyanide, at a cathode efficiency of less than about 30%.
Claim 5
Dependent Claim
93 words
A method according to claim 1 in which said electroplating with copper is comprised of: (a) electrolytically depositing a preliminary layer of copper onto said metallic substrate from a first alkaline plating bath containing copper cyanide and an alkali metal cyanide in which at least about 15% of said alkali metal cyanide is free alkali metal cyanide, at a cathode efficiency of less than about 50%; and electrolytically depositing a further layer of copper over said preliminary layer from a second alkaline plating bath at a cathode efficiency of at least about 75%.
Claim 6
Dependent Claim
94 words
A method according to claim 1 in which said electroplating with copper is comprised of: (a) electrolytically depositing a preliminary layer of copper onto said metallic substrate from a first alkaline plating bath containing copper cyanide and an alkali metal cyanide in which at least about 25% of said alkali metal cyanide is free alkali metal cyanide, at a cathode efficiency of less than about 30%; and (b) electrolytically depositing a further layer of copper over said preliminary layer from a second alkaline plating bath at a cathode efficiency of at least about 95%.
Claim 7
Independent Claim
36 words
A method according to claims 4 or 5 further comprising heating said substrate to a temperature of about 300° F. to about 500° F. for about 1 to about 5 hours between steps (a) and (b).
Claim 8
Dependent Claim
25 words
A method according to claim 1 in which the copper layer produced by said electroplating with copper is at least about 0.1 mil in thickness.
Claim 9
Dependent Claim
27 words
A method according to claim 1 in which the copper layer produced by said electroplating with copper is about 0.2 mil to about 1.0 mil in thickness.
Claim 10
Dependent Claim
27 words
A method according to claim 1 in which the copper layer produced by said electroplating with copper is about 0.3 mil to about 0.5 mil in thickness.
Claim 11
Dependent Claim
23 words
A method according to claim 1 further comprising anodically electrocleaning said metallic substrate with an alkaline solution prior to said electroplating with copper.
Claim 12
Independent Claim
160 words
A method for depositing particulate diamond on a metallic substrate, comprising: (a) descaling said substrate in an alkaline solution; (b) electrolytically depositing a preliminary layer of copper onto said metallic substrate from a first alkaline plating bath containing copper cyanide and an alkali metal cyanide in which at least about 25% of said alkali metal cyanide is free alkali metal cyanide, at a cathode efficiency of less than about 30%; (c) heating said metallic substrate with said preliminary layer deposited thereon to a temperature of about 300° F. to about 500° F. for about 1 to about 5 hours; (d) electrolytically depositing further copper over said preliminary layer from a second alkaline plating bath containing copper ions at a cathode efficiency of at least about 95%, to thicken said preliminary layer to a total thickness of about 0.2 mil to about 1.0 mil; (e) electrolytically depositing a layer of metal other than copper incorporating diamond particles over said thickened layer.
Claim 13
Independent Claim
160 words
A method for depositing particulate diamond on a metallic substrate, comprising: (a) descaling said substrate in an alkaline solution; (b) electrolytically depositing a preliminary layer of copper onto said metallic substrate from a first alkaline plating bath containing copper cyanide and an alkali metal cyanide in which at least about 25% of said alkali metal cyanide is free alkali metal cyanide, at a cathode efficiency of less than about 30%; (c) heating said metallic substrate with said preliminary layer deposited thereon to a temperature of about 300° F. to about 500° F. for about 1 to about 5 hours; (d) electrolytically depositing further copper over said preliminary layer from a second alkaline plating bath containing copper ions at a cathode efficiency of at least about 95%, to thicken said preliminary layer to a total thickness of about 0.2 mil to about 1.0 mil; (e) electrolytically depositing a layer of metal other than copper incorporating diamond particles over said thickened layer.
Claim 14
Dependent Claim
15 words
A method according to claim 10 in which said metal other than copper is nickel.
Claim 15
Dependent Claim
36 words
A composite metal article comprising: a metallic substrate; an intermediate layer of copper applied by electroplating from an alkaline solution containing copper ions; and an outer layer of a metal other than copper applied by electroplating.
Claim 16
Dependent Claim
36 words
A composite metal article comprising: a metallic substrate; an intermediate layer of copper applied by electroplating from an alkaline solution containing copper ions; and an outer layer of a metal other than copper applied by electroplating.
Claim 17
Dependent Claim
17 words
A composite metal article according to claim 13 in which said metal other than copper is nickel.
Claim 18
Dependent Claim
23 words
A composite metal article according to claim 13 in which said intermediate layer of copper is at least about 0.1 mil in thickness.
Claim 19
Dependent Claim
36 words
A composite metal article according to claim 13 in which said intermediate layer of copper is about 0.2 mil to about 1.0 mil in thickness, and said outer layer of metal contains abrasive particles dispersed therein.
Claim 20
Dependent Claim
38 words
A composite metal article according to claim 13 in which said intermediate layer of copper is about 0.3 mil to about 0.5 mil in thickness, and said outer layer of metal is nickel with abrasive particles dispersed therein.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1990-04-20 | 1990-10-20 | 1991-04-21 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1994-04-20 | 1994-10-20 | 1995-04-21 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1998-04-20 | 1998-10-20 | 1999-04-21 | $7700.00 | Window Closed / Lapsed |