Patent US3497216A successfully refreshed from Google Patents.
US4656208A
Expired / Lapsed
US
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Thermosetting epoxy resin compositions and thermosets therefrom
Assignee: Hexcel Corp
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Filing: 1985-04-17
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Granted: 1987-04-07
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Expires: 2005-04-17
Abstract
Abstract Described are novel thermosetting epoxy resin compositions suitable for making cured resins, prepregs and stiff, tough thermoset composites. The thermosetting compositions comprise a polyepoxide component, an amine hardener and a specified amount of certain aromatic oligomers containing functional groups which are reactive with the polyepoxide and/or hardener under curing conditions for the composition. The cured resins have a multiphase morphology which comprises at least one glassy continuous phase and at least one glassy discontinuous phase and have a fracture toughness, K IC , of at least 1.0 MPam 1/2 .
Inventors
- 👤 Sung G. Chu
- 👤 Harold Jabloner
- 👤 Brian J. Swetlin
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 23:12
CPC Classifications
C; C08; C08G; C08G59/00; C08G59/18; C08G59/40; C08G59/50; C08G59/5033; C08G59/56; C08J; C08J5/00; C08J5/24; C08J5/241; C08J5/243; C08K; C08K7/00; C08K7/02; C08K7/04; C08L; C08L63/00; C08L81/00; C08L81/08; C08J2363/00; H; H05; H05K; H05K1/00; H05K1/02; H05K1/03; H05K1/0313; H05K1/032; H05K1/0326; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10S525/00; Y10S525/906; Y10T; Y10T428/00; Y10T428/24; Y10T428/24802; Y10T428/24917
Claims Analysis
Total Claims: 24
Claim 1
Independent Claim
124 words
A thermosetting epoxy resin composition comprising: (a) a polyepoxide component having on average more than one epoxide group per molecule and a glass transition temperature below about 50° C., (b) an amount of an amine hardener having a molecular weight below 750 sufficient to provide from 0.8 to 1.5 equivalents of active hydrogen atoms per one equivalent of epoxide groups in the composition, and (c) from 20 to 50% by weight of the composition of an aromatic oligomer having a number average molecular weight between about 2,000 and about 10,000, a glass transition temperature between about 125° C. and 250° C. and at least 1.4 functional groups which are reactive with (a) or (b), or (a) and (b) under curing conditions for the composition.
Claim 2
Dependent Claim
124 words
A thermosetting epoxy resin composition comprising: (a) a polyepoxide component having on average more than one epoxide group per molecule and a glass transition temperature below about 50° C., (b) an amount of an amine hardener having a molecular weight below 750 sufficient to provide from 0.8 to 1.5 equivalents of active hydrogen atoms per one equivalent of epoxide groups in the composition, and (c) from 20 to 50% by weight of the composition of an aromatic oligomer having a number average molecular weight between about 2,000 and about 10,000, a glass transition temperature between about 125° C. and 250° C. and at least 1.4 functional groups which are reactive with (a) or (b), or (a) and (b) under curing conditions for the composition.
Claim 3
Dependent Claim
13 words
The composition of claim 1 wherein the amine hardener comprises an aromatic amine.
Claim 4
Dependent Claim
13 words
The composition of claim 2 wherein the oligomer contains sulfone bridged diphenylene units.
Claim 5
Dependent Claim
30 words
The composition of claim 3 wherein the oligomer also contains hydrocarbon bridged diphenylene units and the number of sulfone bridged diphenylene units exceeds the number of hydrocarbon bridged diphenylene units.
Claim 6
Dependent Claim
17 words
The composition of claim 2 wherein the polyepoxide component has on average 2 to 4 epoxide groups.
Claim 7
Dependent Claim
10 words
The composition of claim 5 wherein the hardener is 4,4'-diaminodiphenylsulfone.
Claim 8
Dependent Claim
24 words
The composition of claim 5 wherein the functional groups are one or more groups selected from primary amine, secondary amine, hydroxyl and epoxide groups.
Claim 9
Dependent Claim
151 words
A thermosetting epoxy resin composition which cures into a thermoset having a multiphase morphology and a fracture toughness, K IC , of at least 1.0 MPam 1/2 , said composition comprising (1) at least one polyepoxide compound having at least 2 epoxide groups per molecule and a glass transition temperature below about 20° C., (2) an amount of an aromatic diamine hardener having a molecular weight below 750 sufficient to provide from 0.8 to 1.5 equivalents of active hydrogen atoms per one equivalent of epoxide groups in the composition, and (3) from 20 to 50% by weight of the composition of an aromatic oligomer having a number average molecular weight between about 2,000 and about 10,000, a glass transition temperature between about 125° C. and 250° C. and at least about 1.7 functional groups which are reactive with (a) or (b) or (a) and (b) under curing conditions for the composition.
Claim 10
Dependent Claim
151 words
A thermosetting epoxy resin composition which cures into a thermoset having a multiphase morphology and a fracture toughness, K IC , of at least 1.0 MPam 1/2 , said composition comprising (1) at least one polyepoxide compound having at least 2 epoxide groups per molecule and a glass transition temperature below about 20° C., (2) an amount of an aromatic diamine hardener having a molecular weight below 750 sufficient to provide from 0.8 to 1.5 equivalents of active hydrogen atoms per one equivalent of epoxide groups in the composition, and (3) from 20 to 50% by weight of the composition of an aromatic oligomer having a number average molecular weight between about 2,000 and about 10,000, a glass transition temperature between about 125° C. and 250° C. and at least about 1.7 functional groups which are reactive with (a) or (b) or (a) and (b) under curing conditions for the composition.
Claim 11
Dependent Claim
13 words
The composition of claim 8 wherein the oligomer contains sulfone bridged diphenylene units.
Claim 12
Dependent Claim
30 words
The composition of claim 9 wherein the oligomer also contains hydrocarbon bridged diphenylene units and the number of sulfone bridged diphenylene units exceeds the number of hydrocarbon bridged diphenylene units.
Claim 13
Dependent Claim
12 words
The composition of claim 10 wherein the aromatic diamine hardener is 4,4'-diaminodiphenylsulfone.
Claim 14
Dependent Claim
24 words
The composition of claim 10 wherein the functional groups are one or more groups selected from primary amine, secondary amine, hydroxyl and epoxide groups.
Claim 15
Dependent Claim
14 words
A prepreg comprising the composition of claim 1 and high strength filaments or fibers.
Claim 16
Dependent Claim
14 words
A prepreg comprising the composition of claim 8 and high strength filaments or fibers.
Claim 17
Dependent Claim
9 words
A cured resin of the composition of claim 1.
Claim 18
Dependent Claim
9 words
A cured resin of the composition of claim 8.
Claim 19
Dependent Claim
15 words
A composite comprising the cured composition of claim 1 and high strength filaments or fibers.
Claim 20
Dependent Claim
15 words
A composite comprising the cured composition of claim 8 and high strength filaments or fibers.
Claim 21
Dependent Claim
11 words
A circuit board structure comprising the cured resin of claim 15.
Claim 22
Dependent Claim
17 words
A circuit board structure comprising the cured composition of claim 1 and high strength filaments or fibers.
Claim 23
Dependent Claim
11 words
A laminate comprising layers formed from the prepreg of claim 13.
Claim 24
Dependent Claim
11 words
A circuit board structure comprising the cured laminate of claim 21.
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| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
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| 3.5 Years (Year 4) | 1990-04-06 | 1990-10-06 | 1991-04-07 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1994-04-06 | 1994-10-06 | 1995-04-07 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1998-04-06 | 1998-10-06 | 1999-04-07 | $7700.00 | Window Closed / Lapsed |