Patent US4655162A successfully refreshed from Google Patents.
US4655162A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device manufacturing apparatus
Assignee: Nikon Corp
•
Filing: 1985-03-01
•
Granted: 1987-04-07
•
Expires: 2005-03-01
Abstract
Abstract The present invention provides a semiconductor device manufacturing apparatus which, in processing wafers with processing liquid, prevents dust contamination of a wafer surface to be processed, enables fine control of processing liquid temperature, enables the wafer surface to be processed uniformly, permits use of only a small amount of processing liquid, and can be adapted for mixed solvents. The apparatus according to the present invention comprises a cup containing the processing liquid, vacuum chuck means holding the wafer by suction on the upper surface of the wafer, and means by which the wafer surface is brought into dynamic contact with the processing liquid.
Inventors
- 👤 Masaomi Kameyama
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 04:06
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/04; H10P72/0448; H10P72/70; H10P72/78
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
91 words
A semiconductor device manufacturing apparatus comprising: a cup containing processing liquid; vacuum chuck means positioned above said cup and adapted for fixing by suction the upper non-processed face of a wafer to be processed; and displacing means for displacing at least one of said cup and said chuck means thereby causing relative approaching or distancing of said cup and said chuck means, said displacing means having rotary means for causing said cup or chuck means to effect a planetary motion about an axis perpendicular to the processed face of the wafer.
Claim 2
Dependent Claim
91 words
A semiconductor device manufacturing apparatus comprising: a cup containing processing liquid; vacuum chuck means positioned above said cup and adapted for fixing by suction the upper non-processed face of a wafer to be processed; and displacing means for displacing at least one of said cup and said chuck means thereby causing relative approaching or distancing of said cup and said chuck means, said displacing means having rotary means for causing said cup or chuck means to effect a planetary motion about an axis perpendicular to the processed face of the wafer.
Claim 3
Dependent Claim
17 words
An apparatus according to claim 1, further comprising first control means for intermittently driving said rotary means.
Claim 4
Dependent Claim
21 words
An apparatus according to claim 1, further comprising second control means for alternating the direction of rotation of said rotary means.
References Cited (Backward Citations)
US1550685A
Cited
US1911124A
Cited
US2169805A
Cited
US3755011A
Cited
US3903841A
Cited
US4006707A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1990-04-06 | 1990-10-06 | 1991-04-07 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1994-04-06 | 1994-10-06 | 1995-04-07 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1998-04-06 | 1998-10-06 | 1999-04-07 | $7700.00 | Window Closed / Lapsed |