Patent US4654965A successfully refreshed from Google Patents.
US4654965A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of manufacturing liquid crystal display unit
Assignee: Ricoh Co Ltd
•
Filing: 1985-07-16
•
Granted: 1987-04-07
•
Expires: 2005-07-16
Abstract
Abstract A panel board on which a liquid crystal display device and a printed-circuit board on which an electric circuit for driving the liquid crystal display device are electrically and mechanically connected to each other by an electrically conductive heat-sealing connector. When joining the panel board and the printed-circuit board, the heat-sealing connector is heated by a heating head applied against the panel board or infrared radiation applied through the panel board.
Inventors
- 👤 Kiyohiro Uehara
- 👤 Shigeyuki Sakai
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-06 09:54
CPC Classifications
G; G02; G02F; G02F1/00; G02F1/01; G02F1/13; G02F1/133; G02F1/1333; G02F1/1345; G02F1/13452; G21; G21C; G21C17/00; H; H05; H05K; H05K3/00; H05K3/36; H05K3/361; H05K2201/00; H05K2201/01; H05K2201/0104; H05K2201/0112; H05K2201/02; H05K2201/0203; H05K2201/0263; H05K2201/0272; H05K2201/10; H05K2201/10613; H05K2201/10954; H05K2201/10977; H05K2203/00; H05K2203/15; H05K2203/1581; H05K3/30; H05K3/303; H05K3/305; H05K3/32; H05K3/321; Y; Y02; Y02E; Y02E30/00; Y02E30/30; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49126
Claims Analysis
Total Claims: 47
Claim 1
Independent Claim
98 words
An electrical connection circuit for connecting signal wires of a display device to connection points on a printed-circuit board comprising: a heat-sealing connector disposed on the printed-circuit board and contacting said connection points; and an energy-transparent panel board made of a resin sheet on which the display device is mounted, said panel board being disposed on the heat-sealing connector so that an electrically conductive path is formed between the connection points of said printed circuit board and said signal wires of the display device; wherein the heat-sealing connector is heated by energy passed through said energy-transparent panel board.
Claim 2
Dependent Claim
98 words
An electrical connection circuit for connecting signal wires of a display device to connection points on a printed-circuit board comprising: a heat-sealing connector disposed on the printed-circuit board and contacting said connection points; and an energy-transparent panel board made of a resin sheet on which the display device is mounted, said panel board being disposed on the heat-sealing connector so that an electrically conductive path is formed between the connection points of said printed circuit board and said signal wires of the display device; wherein the heat-sealing connector is heated by energy passed through said energy-transparent panel board.
Claim 3
Dependent Claim
24 words
An electrical connection circuit according to claim 1 wherein said panel board is transparent to infrared radiation and said heat-sealing connector absorbs infrared radiation.
Claim 4
Dependent Claim
29 words
An electrical connection circuit according to claim 1 wherein said panel board is transparent to directly applied heat and said heat-sealing connector absorbs heat passed through the panel board.
Claim 5
Independent Claim
90 words
A method of connecting a printed circuit board to a panel board on which a liquid crystal display device is mounted, comprising the steps of: (a) forming said panel board as a sheet made of synthetic resin; (b) sandwiching an electrically conductive heat-sealing connector between said printed-circuit board and said panel board; and (c) applying heat to said heat-sealing connector through said resin sheet of said panel board to cause said heat-sealing connector to be thermally fused for joining said printed circuit board and said panel board and wires thereon.
Claim 6
Independent Claim
90 words
A method of connecting a printed circuit board to a panel board on which a liquid crystal display device is mounted, comprising the steps of: (a) forming said panel board as a sheet made of synthetic resin; (b) sandwiching an electrically conductive heat-sealing connector between said printed-circuit board and said panel board; and (c) applying heat to said heat-sealing connector through said resin sheet of said panel board to cause said heat-sealing connector to be thermally fused for joining said printed circuit board and said panel board and wires thereon.
Claim 7
Dependent Claim
15 words
A method according to claim 1, wherein the heat is applied by a heating head.
Claim 8
Dependent Claim
20 words
A method according to claim 1, wherein said connector comprises a hot-melt adhesive and an electrically conductive material mixed therein.
Claim 9
Dependent Claim
17 words
A method according to claim 1, wherein said heat-sealing connector is in the form of a sheet.
Claim 10
Dependent Claim
17 words
A method according to claim 1, wherein said heat-sealing connector is in the form of a block.
Claim 11
Dependent Claim
23 words
A method according to claim 1, wherein an integrated circuit for driving the liquid crystal display device is mounted on said printed-circuit board.
Claim 12
Dependent Claim
33 words
A method according to claim 1, wherein said printed-circuit board is made of a material selected from the group consisting of glass, epoxy resin, polyimide, polyester, paper, phenolic resin, triazine resin, and ceramics.
Claim 13
Dependent Claim
17 words
A method according to claim 1, wherein said panel board comprises a sheet film of synthetic resin.
Claim 14
Dependent Claim
34 words
A method according to claim 11, wherein said panel board is made of a material selected from the group consisting of polyethylene terephthalate, polybutylene terephthalate, polyether sulfone, polycarbonate resin, polysulfone, polyimide, acetate, and polyester.
Claim 15
Dependent Claim
27 words
A method according to claim 1, wherein said heat-sealing connector comprises an electrically conductive heat-sealing layer composed of an infrared-absorbing electrically conductive material and a hot-melt adhesive.
Claim 16
Dependent Claim
31 words
A method according to claim 1, wherein said heat-sealing connector comprises an electrically conductive heat-sealing layer composed of an electrically conductive material, an electrically nonconductive infrared absorbent, and a hot-melt adhesive.
Claim 17
Dependent Claim
22 words
A method according to claim 13 or 14, wherein said electrically conductive material is in the form of electrically conductive fine particles.
Claim 18
Dependent Claim
17 words
A method according to claim 13 or 14, wherein said electrically conductive material comprises an organic conductor.
Claim 19
Dependent Claim
32 words
A method according to claim 16, wherein said organic conductor is made of a material selected from the group consisting of graphite or electrically conductive carbon black having a sufficient infrared-absorbing ability.
Claim 20
Dependent Claim
20 words
A method according to claim 13 or 14, wherein said electrically conductive material is in the form of metal particles.
Claim 21
Dependent Claim
27 words
A method according to claim 18, wherein said metal particles are made of a material selected from the group consisting of copper, aluminum, nickel, cobalt, and silver.
Claim 22
Dependent Claim
15 words
A method according to claim 13, wherein said heat-sealing connector further comprises an infrared absorbent.
Claim 23
Dependent Claim
24 words
A method according to claim 20, wherein said infrared absorbent is in the form of electrically conductive fine particles capable of absorbing infrared radiation.
Claim 24
Dependent Claim
27 words
A method according to claim 21, wherein said particles are made of a material selected from carbon black, an organic black pigment, titanium dioxide, and silicon dioxide.
Claim 25
Dependent Claim
30 words
A method according to claim 13, or 14, wherein said hot-melt adhesive basically comprises a thermoplastic resin capable of being fused in a temperature range from 100° to 180° C.
Claim 26
Dependent Claim
42 words
A method according claim 14, wherein said electrically conductive heat-sealing layer comprises 1 part by weight of said hot-melt adhesive, 10 through 30 parts by weight of said electrically conductive material, and 5 through 20 parts by weight of said infrared absorbent.
Claim 27
Dependent Claim
26 words
A method according to claim 13 or 14, wherein said electrically conductive infrared-absorbing layer is formed in advance on said panel board and/or said printed-circuit board.
Claim 28
Dependent Claim
45 words
A method according to claim 4, wherein said heat-sealing connector comprises an insulating substrate, a plurality of spaced electrically conductive heat-sealing layers disposed on said insulating substrate, and a plurality of insulating paint layers disposed on said insulating substrate between said electrically conductive heat-sealing layers.
Claim 29
Dependent Claim
20 words
A method according to claim 26, wherein each of said electrically conductive heat-sealing layers contains an infrared-absorbing electrically conductive material.
Claim 30
Dependent Claim
24 words
A method according to claim 26, wherein each of said electrically conductive heat-sealing layers contains an electrically conductive material and a nonconductive infrared absorbent.
Claim 31
Dependent Claim
18 words
A method according to claim 26, wherein each of said insulating paint layers contains a nonconductive infrared absorbent.
Claim 32
Dependent Claim
16 words
A method according to claim 26, wherein said insulating substrate comprises a film of synthetic resin.
Claim 33
Dependent Claim
29 words
A method according to claim 30, wherein said film is made of a material selected from the group consisting of polyester, polyamide, polyvinyl chloride, polycarbonate, polysulfone, and polyether sulfone.
Claim 34
Dependent Claim
27 words
A method according to claim 4, wherein said heat-sealing connector comprises an insulating substrate and an infrared-absorbing electrically conductive heat-sealing layer disposed fully over said insulating substrate.
Claim 35
Dependent Claim
39 words
A method according to claim 4, wherein said heat-sealing connector comprises a block in the form of a rectangular parallelepiped, infrared-absorbing electrically conductive heat-sealing layers, and nonconductive heat-sealing layers which are alternately disposed on a surface of said block.
Claim 36
Dependent Claim
36 words
A method according to claim 4, wherein said heat-sealing connector is prepared by coating an electrically conductive material and a hot-melt adhesive on an insulating substrate, and drying the coated electrically conductive material and hot-melt adhesive.
Claim 37
Dependent Claim
23 words
A method according to claim 34, wherein a coating agent containing an infrared absorbent is additionally coated and dried on said insulating substrate.
Claim 38
Dependent Claim
26 words
A method according to claim 34 or 35, wherein said electrically conductive material, said hot-melt adhesive, and said coating agent are coated by screen process printing.
Claim 39
Independent Claim
107 words
A method of connecting a printed-circuit board on which a driver IC is disposed centrally to a panel board on which a liquid crystal display device is mounted, comprising the steps of: (a) placing said printed-circuit board at opposite ends thereof on an assembling jig with said driver IC facing downwardly; (b) positioning a connector on wiring members exposed on the back of said printed-circuit board opposite to said opposite ends; (c) thereafter placing signal wire portions of said panel on said connector; (d) holding a heating head against said panel board; and (e) applying heat from said heating head to said connector through said panel board.
Claim 40
Independent Claim
107 words
A method of connecting a printed-circuit board on which a driver IC is disposed centrally to a panel board on which a liquid crystal display device is mounted, comprising the steps of: (a) placing said printed-circuit board at opposite ends thereof on an assembling jig with said driver IC facing downwardly; (b) positioning a connector on wiring members exposed on the back of said printed-circuit board opposite to said opposite ends; (c) thereafter placing signal wire portions of said panel on said connector; (d) holding a heating head against said panel board; and (e) applying heat from said heating head to said connector through said panel board.
Claim 41
Independent Claim
113 words
A method of connecting a printed circuit board to a panel board on which a liquid crystal display device is mounted, comprising the steps of: (a) sandwiching an electrically conductive heat-sealing connector between said printed-circuit board and said panel board; and (b) applying heat to said heat-sealing connector through said panel board to cause said heat-sealing connector to be thermally fused for joining said printed circuit board and said panel board and wires thereon, wherein said heat-sealing connector comprises an electrically conductive heat-sealing layer composed of an infrared-absorbing electrically conductive material and a hot-melt adhesive, and wherein said heat sealing connector is heated by exposure to infrared radiation produced by a laser beam.
Claim 42
Independent Claim
113 words
A method of connecting a printed circuit board to a panel board on which a liquid crystal display device is mounted, comprising the steps of: (a) sandwiching an electrically conductive heat-sealing connector between said printed-circuit board and said panel board; and (b) applying heat to said heat-sealing connector through said panel board to cause said heat-sealing connector to be thermally fused for joining said printed circuit board and said panel board and wires thereon, wherein said heat-sealing connector comprises an electrically conductive heat-sealing layer composed of an infrared-absorbing electrically conductive material and a hot-melt adhesive, and wherein said heat sealing connector is heated by exposure to infrared radiation produced by a laser beam.
Claim 43
Independent Claim
117 words
A method of connecting a printed circuit board to a panel board on which a liquid crystal display device is mounted, comprising the steps of: (a) sandwiching an electrically conductive heat-sealing connector between said printed-circuit board and said panel board; and (b) applying heat to said heat-sealing connector through said panel board to cause said heat-sealing connector to be thermally fused for joining said printed circuit board and said panel board and wires thereon, wherein said heat-sealing connector comprises an electrically conductive heat-sealing layer composed of an electrically conductive material, an electrically nonconductive infrared absorbent and a hot-melt adhesive, and wherein said heat sealing connector is heated by exposure to infrared radiation produced by a laser beam.
Claim 44
Independent Claim
117 words
A method of connecting a printed circuit board to a panel board on which a liquid crystal display device is mounted, comprising the steps of: (a) sandwiching an electrically conductive heat-sealing connector between said printed-circuit board and said panel board; and (b) applying heat to said heat-sealing connector through said panel board to cause said heat-sealing connector to be thermally fused for joining said printed circuit board and said panel board and wires thereon, wherein said heat-sealing connector comprises an electrically conductive heat-sealing layer composed of an electrically conductive material, an electrically nonconductive infrared absorbent and a hot-melt adhesive, and wherein said heat sealing connector is heated by exposure to infrared radiation produced by a laser beam.
Claim 45
Independent Claim
190 words
A method of connecting a printed circuit board to a panel board on which a liquid crystal display device is mounted, comprising the steps of: (a) sandwiching an electrically conductive heat-sealing connector between said printed-circuit board and said panel board; and (b) applying heat to said heat-sealing connector through said panel board to cause said heat-sealing connector to be thermally fused for joining said printed circuit board and said panel board and wires thereon, wherein said heat-sealing connector is prepared by coating an electrically conductive material and a hot-melt adhesive on an insulating substrate, and drying the coated electrically conductive material and hot-melt adhesive, and additionally coating and drying a coating agent containing an infrared absorbent on said insulating substrate, and wherein said hot-melt adhesive is made of a polyester-based material, said heat-sealing connector being prepared by uniformly dispersing 20% by weight of metal particles as the electrically conductive material in said hot-melt adhesive to produce a dispersion, uniformly mixing 10% by weight of a black dye as the infrared absorbent into said dispersion, and coating the resultant dispersion on said insulating substrate as a plurality of spaced heat-sealing layers.
Claim 46
Independent Claim
190 words
A method of connecting a printed circuit board to a panel board on which a liquid crystal display device is mounted, comprising the steps of: (a) sandwiching an electrically conductive heat-sealing connector between said printed-circuit board and said panel board; and (b) applying heat to said heat-sealing connector through said panel board to cause said heat-sealing connector to be thermally fused for joining said printed circuit board and said panel board and wires thereon, wherein said heat-sealing connector is prepared by coating an electrically conductive material and a hot-melt adhesive on an insulating substrate, and drying the coated electrically conductive material and hot-melt adhesive, and additionally coating and drying a coating agent containing an infrared absorbent on said insulating substrate, and wherein said hot-melt adhesive is made of a polyester-based material, said heat-sealing connector being prepared by uniformly dispersing 20% by weight of metal particles as the electrically conductive material in said hot-melt adhesive to produce a dispersion, uniformly mixing 10% by weight of a black dye as the infrared absorbent into said dispersion, and coating the resultant dispersion on said insulating substrate as a plurality of spaced heat-sealing layers.
Claim 47
Dependent Claim
24 words
A method according to claim 40, wherein each of said heat-sealing layers has a width of 20 micrometers and a thickness of 25 micrometers.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1990-04-06 | 1990-10-06 | 1991-04-07 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1994-04-06 | 1994-10-06 | 1995-04-07 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1998-04-06 | 1998-10-06 | 1999-04-07 | $7700.00 | Window Closed / Lapsed |