Photosensitive curable resin composition

Claim 1

An organosilicon-containing polyamic acid which is a reaction product of the reactants: (a-1) an organosilicon compound represented by the general formula (CH.sub.2 ═CR--R.sup.2.sub.d --).sub.a (H.sub.2 N--R.sup.3 --).sub.b R.sup.1.sub.c SiO.sub.(4-a-b-c)/2, in which R is a hydrogen atom or a methyl group, R 1 is an unsubstituted monovalent hydrocarbon group selected from the class consisting of alkyl, aryl, and alkoxy, a monovalent hydrocarbon group selected from the class consisting of alkyl, aryl, and alkoxy substituted with halogen, glycidyloxy, and cyano, R 2 is a divalent organic group selected from the class consisting of polymethylene groups of the formula --CH 2 ) p , in which p is a positive integer, propylene group of the formula --CH 2 --CHMe--, in which Me is a methyl group, 1,4-phenylene group and an ester group of the formula --CO--O--C 3 H 6 --, R 3 is a divalent hydrocarbon group, a and b are each a positive number not exceeding 3 and c is zero or a positive number not exceeding 2 with the proviso that a+b+c is a positive number not exceeding 4 and d is zero or 1; (a-2) a tetracarboxylic acid dianhydride represented by the general formula ##STR5## in which R 4 is a tetravalent hydrocarbon group; and (a-3) a polyamino compound represented by the general formula H.sub.2 N--R.sup.5 --NH.sub.2, which is a diamino compounds, or (H.sub.2 N).sub.2 --R.sup.6 --R.sup.7 --NH.sub.2, which is a diaminoamide compound, in which R 5 is a divalent organic group, R 6 is a tervalent hydrocarbon group and R 7 is a sulfonyl group -- SO 2 -- or a carbonyl group --CO--; in an organic solvent.