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US4650698A Expired / Lapsed US ⏱️ 0.0 years remaining

Method of forming a thin film of a metal or metal compound on a substrate

Assignee: Toshiba Corp
•
Filing: 1985-09-26
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Granted: 1987-03-17
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Expires: 2005-09-26
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Abstract

Abstract A method of forming with good reproducibility a high-quality thin film of a metal or metal compound by a vapor growth method on a substrate placed in a quartz reaction tube which has the steps of, prior to the formation of the thin film forming an intermediate film of a material having good adhesion with both quartz, and the metal or metal compound on the inner wall of the reaction tube, and forming a film of the metal or metal compound for the thin film on the intermediate film.

Inventors

  • 👤 Takahiko Moriya
  • 👤 Saburo Nakada

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-24 00:23
CPC Classifications
C; C03; C03C; C03C17/00; C03C17/34; C03C17/36; C03C17/3602; C03C17/3607; C03C17/3636; C03C17/3649; C23; C23C; C23C16/00; C23C16/02; C23C16/0272; C23C16/44; C23C16/4401; C23C16/4404; H; H10; H10P; H10P14/00; H10P14/40; H10P14/42

Claims Analysis

Total Claims: 9
Claim 1
Independent Claim 109 words
A method for forming a thin film of a metal or a metal compound on a substrate comprising Ge, GeAs, Si or sapphire, comprising the sequential steps of forming an intermediate film consisting of one of silicon or a metal silicide on an inner wall of a quartz reaction tube through a vapor growth method; then forming a film of the metal or metal compound other than that of said intermediate film on said intermediate film through a vapor growth method; and thereafter disposing said substrate in said reaction tube; and forming the thin film of the metal or metal compound by a vapor growth method on said substrate.
Claim 2
Independent Claim 109 words
A method for forming a thin film of a metal or a metal compound on a substrate comprising Ge, GeAs, Si or sapphire, comprising the sequential steps of forming an intermediate film consisting of one of silicon or a metal silicide on an inner wall of a quartz reaction tube through a vapor growth method; then forming a film of the metal or metal compound other than that of said intermediate film on said intermediate film through a vapor growth method; and thereafter disposing said substrate in said reaction tube; and forming the thin film of the metal or metal compound by a vapor growth method on said substrate.
Claim 3
Dependent Claim 26 words
A method according to claim 1, wherein the metal silicide is a material selected from the group consisting of tungsten silicide, molybdenum silicide and titanium silicide.
Claim 4
Dependent Claim 52 words
A method according to claim 1, wherein said intermediate film comprises a two-layer structure having a first film of a material having good adhesion with quartz and a second film of a material having good adhesion with the metal or metal compound, said first film being sufficiently adhered to said second film.
Claim 5
Dependent Claim 24 words
A method according to claim 1, wherein the metal is a member selected from the group consisting of tungsten, molybdenum, tantalum, titanium and aluminum.
Claim 6
Dependent Claim 28 words
A method according to claim 1, wherein the metal compound is a member selected from the group consisting of tungsten silicide, molybdenum silicide, tantalum silicide and titanium silicide.
Claim 7
Dependent Claim 12 words
The method of claim 1 wherein said intermediate film consists of silicon.
Claim 8
Dependent Claim 21 words
The method of claim 6, wherein said metal is selected from the group consisting of tungsten, molybdenum, tantalum, titanium and aluminum.
Claim 9
Dependent Claim 25 words
The method of claim 6, wherein the metal compound is selected from the group consisting of tungsten silicide, molybdenum silicide, tantalum silicide and titanium silicide.

References Cited (Backward Citations)

US2884894A Cited
DE1086510B Cited
GB940972A Cited
GB940971A Cited
US4180596A Cited
US4391846A Cited
JPS56155589A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1990-03-16 1990-09-15 1991-03-17 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1994-03-16 1994-09-15 1995-03-17 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1998-03-16 1998-09-15 1999-03-17 $7700.00 Window Closed / Lapsed

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