US4647339A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Production of semiconductor devices
Assignee: British Telecommunications PLC
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Filing: 1985-05-21
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Granted: 1987-03-03
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Expires: 2005-05-21
Abstract
Abstract Onto the surface of an initial semiconductor structure 1, 2, 3, 4 is deposited a layer of an organic material 5 having a window 9. Layers 6', 7', and 8' are deposited on the exposed surface of the semiconductor, of which 8' is an ion-beam resisting material. Corresponding layers 6, 7, and 8 are deposited on the organic material. The organic material is then lifted off together with layers 6, 7, and 8. Ion-beam milling of the semiconductor material to either side of 8' followed by removal of any remnant of 8' results in a structure having an elevated semiconductor portion carrying an electrode 6', 7'. Preferred materials are gallium arsenide for layers 1 and 3, gallium aluminium arsenides for layers 2 and 4, titanium for layers 6' and 8', and gold for layer 7'. The invention can be applied to the production of rib waveguide electrooptic devices, including phase modulators.
Inventors
- 👤 Andrew J. N. Houghton
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 04:57
CPC Classifications
H; H10; H10D; H10D64/00; H10D64/01; H10D64/011; G; G02; G02F; G02F1/00; G02F1/01; G02F1/015; G02F1/025; H10P; H10P50/00; H10P50/20; H10P76/00; H10P76/20; H10P76/202
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
137 words
A process for fabricating a semiconductor structure including an elevated semiconductor portion, which portion carries an electrode on its uppermost surface, which comprises the steps of (i) providing on the semiconductor surface of an initial semiconductor structure a layer of an organic material having a window corresponding in position to the desired elevated portion; (ii) applying a layer or layers of material for constituting the electrode and further a layer of ion-beam resisting material to the portion of the semiconductor surface exposed by the window; (iii) treating the product of step (ii) in such manner as to remove the organic material and therewith any of the materials applied to the organic material in the course of step (ii); and (iv) ion-beam milling the exposed portions of the semiconductor material so as to produce the desired elevated portion.
Claim 2
Dependent Claim
137 words
A process for fabricating a semiconductor structure including an elevated semiconductor portion, which portion carries an electrode on its uppermost surface, which comprises the steps of (i) providing on the semiconductor surface of an initial semiconductor structure a layer of an organic material having a window corresponding in position to the desired elevated portion; (ii) applying a layer or layers of material for constituting the electrode and further a layer of ion-beam resisting material to the portion of the semiconductor surface exposed by the window; (iii) treating the product of step (ii) in such manner as to remove the organic material and therewith any of the materials applied to the organic material in the course of step (ii); and (iv) ion-beam milling the exposed portions of the semiconductor material so as to produce the desired elevated portion.
Claim 3
Dependent Claim
24 words
A process according to claim 1, wherein the surface of the initial semiconductor structure of step (i) is gallium arsenide or gallium aluminium arsenide.
Claim 4
Dependent Claim
25 words
A process according to claim 1, wherein the surface of the initial semiconductor structure of step (i) is indium phosphide or gallium indium arsenide phosphide.
Claim 5
Dependent Claim
31 words
A process according to any preceding claim, wherein in step (ii) a layer or layers of material for constituting the electrode are deposited at least one of which is of metal.
Claim 6
Dependent Claim
43 words
A process according to any of claims 1 to 3, wherein in step (ii) two or more layers of material for constituting the metal electrode are deposited the first of which materials is titanium and the second or last of which is gold.
Claim 7
Dependent Claim
18 words
A process according to claim 1, 2 or 3, wherein the ion-beam resisting material is titanium or chromium.
Claim 8
Dependent Claim
31 words
A process according to claim 1, 2, or 3, wherein after step (iv) is completed some of the ion-beam resisting material remains and this material is removed in a further step.
Claim 9
Dependent Claim
17 words
A process according to claim 7, wherein the remaining ion-beam resistant material is removed by plasma etching.
Claim 10
Dependent Claim
26 words
A process according to any of claims 1 to 3, wherein step (iv) is continued until after all of the ion-beam resisting material has been removed.
Claim 11
Dependent Claim
20 words
A process according to claim 1, 2, or 3, wherein the organic material is a photoresist or an electron-beam resist.
Claim 12
Dependent Claim
123 words
A process for fabricating a semiconductor structure capable of producing a controlled optical phase shift along an elevated semiconductor portion thereof which portion carries an electrode on its uppermost surface, said process comprising: providing a layered semiconductor structure having a doped layer of a first type between doped layers of a second type; applying at least one shaped area of material on top of said layered structure located where said elevated portion is desired, said material constituting said electrode and also forming an ion beam resisting surface over said shaped area; and ion-beam milling said structure with said material thereon sufficiently to remove the upper layer of said second type and a portion of said first type layer except under said shaped area.
Claim 13
Dependent Claim
123 words
A process for fabricating a semiconductor structure capable of producing a controlled optical phase shift along an elevated semiconductor portion thereof which portion carries an electrode on its uppermost surface, said process comprising: providing a layered semiconductor structure having a doped layer of a first type between doped layers of a second type; applying at least one shaped area of material on top of said layered structure located where said elevated portion is desired, said material constituting said electrode and also forming an ion beam resisting surface over said shaped area; and ion-beam milling said structure with said material thereon sufficiently to remove the upper layer of said second type and a portion of said first type layer except under said shaped area.
Claim 14
Dependent Claim
21 words
A process according to claim 1, wherein the surface of the initial semiconductor structure of step (i) is indium gallium arsenide.
Claim 15
Dependent Claim
135 words
A process for fabricating a semiconductor structure including an elevated semiconductor portion, which portion carries an electrode on its uppermost surface, which comprises the steps of: (i) providing on the semiconductor surface of an initial semiconductor structure a layer of an organic material having a window corresponding in position to the desired elevated portion; (ii) applying a layer or layers of material for constituting the electrode and forming an ion-beam resisting surface to the portion of the semiconductor surface exposed by the window; (iii) treating the product of step (ii) in such manner as to remove the organic material and therewith any of the materials applied to the organic material in the course of step (ii); and (iv) ion-beam milling the exposed portions of the semiconductor material so as to produce the desired elevated portion.
Claim 16
Dependent Claim
135 words
A process for fabricating a semiconductor structure including an elevated semiconductor portion, which portion carries an electrode on its uppermost surface, which comprises the steps of: (i) providing on the semiconductor surface of an initial semiconductor structure a layer of an organic material having a window corresponding in position to the desired elevated portion; (ii) applying a layer or layers of material for constituting the electrode and forming an ion-beam resisting surface to the portion of the semiconductor surface exposed by the window; (iii) treating the product of step (ii) in such manner as to remove the organic material and therewith any of the materials applied to the organic material in the course of step (ii); and (iv) ion-beam milling the exposed portions of the semiconductor material so as to produce the desired elevated portion.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1990-03-02 | 1990-09-01 | 1991-03-03 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1994-03-02 | 1994-09-01 | 1995-03-03 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1998-03-02 | 1998-09-01 | 1999-03-03 | $7700.00 | Window Closed / Lapsed |