Patent US1189754A successfully refreshed from Google Patents.
Patent US4644385A successfully refreshed from Google Patents.
US4644385A
Expired / Lapsed
US
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Cooling module for integrated circuit chips
Assignee: Hitachi Ltd
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Filing: 1984-10-26
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Granted: 1987-02-17
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Expires: 2004-10-26
Abstract
Abstract This invention concerns a cooling module for integrated circuit chips, characterized in that it is provided with cooling members through which a coolant circulates, and which are connected directly, or via insulating plates, to a plurality of integrated circuit chips mounted on a wiring substrate, and pipes which introduce the coolant into the cooling members and which have a resiliency which is high enough to enable the pipes to expand and contract in the direction perpendicular to the wiring substrate.
Inventors
- 👤 Keiichirou Nakanishi
- 👤 Minoru Yamada
- 👤 Akira Masaki
- 👤 Kuninori Imai
- 👤 Katuaki Chiba
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 14:06
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/40; H10W40/47; H10W40/70; H10W40/77; H10W40/772; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20
Claims Analysis
Total Claims: 21
Claim 1
Independent Claim
144 words
A cooling module for integrated circuit chips, comprising a plurality of integrated circuit chips mounted on a wiring substrate, a plurality of cooling members which are placed on each of said integrated circuit chips and which are provided with internal spaces through which a coolant circulates, first pipe means connected to each of said cooling members so as to introduce said coolant thereinto, second pipe means connected to each of said cooling members so as to withdraw coolant therefrom, wherein said first and second pipe means have resilient bellows expandable in a direction perpendicular to a surface of said wiring substrate so that said pipe means can expand and contract in the direction perpendicular to the surface of said wiring substrate, and a coolant channel connected to said first and second pipe means so as to introduce and withdraw said coolant thereinto and therefrom
Claim 2
Dependent Claim
144 words
A cooling module for integrated circuit chips, comprising a plurality of integrated circuit chips mounted on a wiring substrate, a plurality of cooling members which are placed on each of said integrated circuit chips and which are provided with internal spaces through which a coolant circulates, first pipe means connected to each of said cooling members so as to introduce said coolant thereinto, second pipe means connected to each of said cooling members so as to withdraw coolant therefrom, wherein said first and second pipe means have resilient bellows expandable in a direction perpendicular to a surface of said wiring substrate so that said pipe means can expand and contract in the direction perpendicular to the surface of said wiring substrate, and a coolant channel connected to said first and second pipe means so as to introduce and withdraw said coolant thereinto and therefrom
Claim 3
Dependent Claim
39 words
The cooling module according to claim 1, wherein each of said cooling members consists of a cooling block with said spaces therein, and fins provided in said spaces so as to be in thermal contact with said cooling block.
Claim 4
Dependent Claim
27 words
The cooling module according to claim 2, wherein said cooling block is made of a material which has an electrical insulating property and a high thermal conductivity.
Claim 5
Dependent Claim
16 words
The cooling module according to claim 3, wherein said cooling block is made of silicon carbide.
Claim 6
Dependent Claim
34 words
The cooling module according to claim 2, wherein a surface of said cooling block which faces the corresponding integrated circuit chip is provided with projections which extend so as to surround said circuit chip.
Claim 7
Dependent Claim
42 words
The cooling module according to claim 5, wherein free end portions of said projections provided on said cooling block are placed in contact with the surface of said wiring substrate so as to reduce the pressure applied to said integrated circuit chip.
Claim 8
Dependent Claim
27 words
The cooling module according to claim 5, wherein said projections provided on said cooling block surround only part of a side surface of said integrated circuit chip.
Claim 9
Dependent Claim
46 words
The cooling module according to claim 1, wherein said cooling module also includes a flat plate which is provided between said cooling members and said integrated circuit chips, and which is made of a material which has an electrical insulating property and a high thermal conductivity.
Claim 10
Dependent Claim
33 words
The cooling module according to claim 8, wherein each said cooling member is mounted on said flat plate and is made of a material which has electrical conductivity and a high thermal conductivity.
Claim 11
Dependent Claim
15 words
The cooling module according to claim 9, wherein said cooling member is made of copper.
Claim 12
Dependent Claim
28 words
The cooling module according to claim 10, wherein the surface of said cooling member which faces said integrated circuit chip is provided with projections surrounding said circuit chip.
Claim 13
Dependent Claim
42 words
The cooling module according to claim 11, wherein free end portions of said projections provided on said cooling member are placed in contact with the surface of said wiring substrate so as to reduce the pressure applied to said integrated circuit chip.
Claim 14
Dependent Claim
27 words
The cooling module according to claim 11, wherein said projections provided on said cooling member surround only part of a side surface of said integrated circuit chip.
Claim 15
Dependent Claim
35 words
The cooling module according to claim 8, wherein each said cooling member is placed on said flat plate and is made of a material which has an electrical insulating property and a high thermal conductivity.
Claim 16
Dependent Claim
16 words
The cooling module according to claim 14, wherein said cooling member is made of silicon carbide.
Claim 17
Dependent Claim
16 words
The cooling module according to claim 8, wherein said flat plate is made of silicon carbide.
Claim 18
Dependent Claim
20 words
The cooling module according to claim 1, wherein the cooling members have fins formed integrally at a lower wall thereof.
Claim 19
Dependent Claim
163 words
A multi-chip module comprising a wiring substrate, a plurality of integrated circuit chips mounted on said wiring substrate, a plurality of cooling members which are placed on each of said integrated circuit chips and which are provided with internal spaces through which a coolant circulates, first pipe means connected to each of said cooling members so as to introduce said coolant thereinto, second pipe means connected to each of said cooling members so as to withdraw said coolant therefrom, said first and second pipe means having resilient bellows expandable in a direction perpendicular to a surface of said wiring substrate so that said pipe means can expand and contract in the direction perpendicular to said wiring substrate, and a casing which has a cap opposite said wiring substrate which is provided with a hollow space acting as a channel for the introduction of said coolant into said first and second pipe means and side walls, and which seals in said integrated circuit chips.
Claim 20
Dependent Claim
163 words
A multi-chip module comprising a wiring substrate, a plurality of integrated circuit chips mounted on said wiring substrate, a plurality of cooling members which are placed on each of said integrated circuit chips and which are provided with internal spaces through which a coolant circulates, first pipe means connected to each of said cooling members so as to introduce said coolant thereinto, second pipe means connected to each of said cooling members so as to withdraw said coolant therefrom, said first and second pipe means having resilient bellows expandable in a direction perpendicular to a surface of said wiring substrate so that said pipe means can expand and contract in the direction perpendicular to said wiring substrate, and a casing which has a cap opposite said wiring substrate which is provided with a hollow space acting as a channel for the introduction of said coolant into said first and second pipe means and side walls, and which seals in said integrated circuit chips.
Claim 21
Dependent Claim
51 words
The multi-chip module according to claim 18, wherein said multi-chip module also includes flat plates which are each provided between one of said cooling members and one of said integrated circuit chips, and which are each made of a material which has an electrical insulating property and a high thermal conductivity.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1990-02-16 | 1990-08-18 | 1991-02-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1994-02-16 | 1994-08-18 | 1995-02-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1998-02-16 | 1998-08-18 | 1999-02-17 | $7700.00 | Window Closed / Lapsed |