Integrated quantum well lasers for wavelength division multiplexing

Claim 2

A process of fabricating an integrated quantum well laser structure which has a plurality of quantum well lasers for providing a plurality of light beams each having a different wavelength, the process steps comprising: (a) providing a gallium arsenide substrate having a planar surface and patterning the substrate so that a spatial variation in epitaxial growth rates will occur; (b) growing over said surface a first cladding layer; (c) growing over said cladding layer an active sandwich layer which includes growing alternating thin layers of Al x Ga 1-x As and Al y Ga 1-y As followed by a final Al x Ga 1-x As layer, said active sandwich layer having a controlled variation in thickness over the surface of said cladded substrate wherein said thickness is different from one to the next of said plurality of quantum well lasers; (d) growing a second cladding layer over said active sandwich layer; (e) growing a gallium arsenide layer over said second cladding layer; (f) locating the position of the individual multiple lasers in the structure and etching away the unwanted layer material between the individual lasers down to the substrate to create voids between the individual lasers; and, (g) refilling the voids by growing further cladding material into the voids to thereby provide isolation between the individual quantum well lasers.

Claim 3

A process of fabricating an integrated quantum well laser structure which has a plurality of quantum well lasers for providing a plurality of light beams each having a different wavelength, the process steps comprising: (a) providing a single crystal semiconductor substrate having a planar surface and patterning the substrate so that a spatial variation in epitaxial growth rates will occur; (b) growing over said surface a first cladding layer; (c) growing over said cladding layer an active sandwich layer which includes growing alternating thin layers of narrow band-gap well layers and wide band-gap barrier layers and a final narrow band-gap well layer, said active sandwich layer having a controlled variation in thickness over the surface of said cladded substrate wherein said thickness is different from one to the next of said plurality of quantum well lasers; (d) growing a second cladding layer over said active sandwich layer; (e) growing a conductive layer over said second cladding layer; (f) locating the position of the individual multiple lasers in the structure and etching away the unwanted layer material between the individual lasers down to the substrate to create voids between the individual lasers; and, (g) refilling the voids by growing further cladding material into the voids to thereby provide isolation between the individual quantum well lasers.

Claim 4

A process of fabricating an integrated quantum well laser structure which has a plurality of quantum well lasers for providing a plurality of light beams each having a different wavelength, the process steps comprising: (a) providing a single crystal semiconductor substrate having a planar surface and patterning the substrate so that a spatial variation in epitaxial growth rates will occur; (b) growing over said surface a first cladding layer; (c) growing over said cladding layer an active sandwich layer which includes growing alternating thin layers of narrow band-gap well layers and wide band-gap barrier layers and a final narrow band-gap well layer, said active sandwich layer having a controlled variation in thickness over the surface of said cladded substrate wherein said thickness is different from one to the next of said plurality of quantum well lasers; (d) growing a second cladding layer over said active sandwich layer; (e) growing a conductive layer over said second cladding layer; (f) locating the position of the individual multiple lasers in the structure and etching away the unwanted layer material between the individual lasers down to the substrate to create voids between the individual lasers; and, (g) refilling the voids by growing further cladding material into the voids to thereby provide isolation between the individual quantum well lasers.