Method for etching copper and composition useful therein

Claim 2

A composition of matter comprising an aqueous solution containing sulfuric acid and between about 0.004 and about 0.02 moles per mole sulfuric acid of an additive compound corresponding to the formula: ##STR5## where R is selected from the group consisting of hydrogen and an amino group corresponding to the formula: ##STR6## where R 1 and R 2 are independently selected from the group consisting of hydrogen and formyl.

Claim 3

A composition as set forth in claim 1 wherein R comprises an amino group.

Claim 4

A composition as set forth in claim 1 wherein one of R 1 and R 2 is hydrogen and the other of R 1 and R 2 is formyl.

Claim 5

A composition as set forth in claim 1 further comprising at least about 0.5 moles hydrogen peroxide per mole of sulfuric acid.

Claim 6

A composition as set forth in claim 1 further comprising between about 0.003 and about 0.05 moles per mole sulfuric acid of an aryl sulfonic acid stabilizing agent selected from the group consisting of phenol sulfonic acid, toluene sulfonic acid, xylene sulfonic acid, and alkali metal salts of said aryl sulfonic acids.

Claim 7

A composition as set forth in claim 5 wherein said stabilizing agent comprises phenol sulfonic acid or an alkali metal salt thereof.

Claim 8

A composition as set forth in claim 5 comprising an etching solution adapted for the etching of copper, said etching solution containing between about 8% and about 12% by weight sulfuric acid and further comprising at least about 0.5 moles hydrogen peroxide per mole sulfuric acid.

Claim 9

A composition as set forth in claim 7 further comprising between about 5 and about 8 ounces copper ion per gallon of solution.

Claim 10

A composition as set forth in claim 1 comprising a concentrate adapted to be mixed with hydrogen peroxide to produce an etching solution for the etching of copper, said concentrate composition containing between about 40% and about 60% sulfuric acid.

Claim 11

A composition as set forth in claim 9 further comprising between about 0.003 and about 0.05 moles per mole sulfuric acid of an aryl sulfonic acid stabilizing agent selected from the group consisting of phenol sulfonic acid, toluene sulfonic acid, xylene sulfonic acid, and alkali metal salts of said aryl sulfonic acids.

Claim 12

An aqueous composition adapted to be mixed with hydrogen peroxide to provide a solution for etching copper, the preparation of said composition comprising mixing sulfuric acid, phenol sulfonic acid or alkali metal salt thereof in a proportion of between about 0.003 and about 0.05 moles per mole of sulfuric acid, aminoquanidine or an aminoguanidine in a proportion of between about 0.004 and about 0.02 moles per mole sulfuric acid, and formic acid in a proportion of between about 0.004 and about 0.02 moles per mole sulfuric acid, the sulfuric acid concentration in the resulting mixture being between about 40% and about 60% by weight.

Claim 13

An aqueous composition adapted to be mixed with hydrogen peroxide to provide a solution for etching copper, the preparation of said composition comprising mixing sulfuric acid, phenol sulfonic acid or alkali metal salt thereof in a proportion of between about 0.003 and about 0.05 moles per mole of sulfuric acid, aminoquanidine or an aminoguanidine in a proportion of between about 0.004 and about 0.02 moles per mole sulfuric acid, and formic acid in a proportion of between about 0.004 and about 0.02 moles per mole sulfuric acid, the sulfuric acid concentration in the resulting mixture being between about 40% and about 60% by weight.

Claim 14

A process for etching copper, comprising contacting the surface of a copper article with an etching composition at a temperature of at least about 120° F., said etching composition comprising between about 8% and about 12% by weight sulfuric acid, at least about 0.5 moles hydrogen peroxide per mole sulfuric acid, and between about 0.004 and about 0.02 moles per mole sulfuric acid of an additive corresponding to the formula ##STR7## where R is selected from a group consisting of hydrogen and an amino group corresponding to the formula: ##STR8## where R 1 and R 2 are independently selected from the group consisting of hydrogen and formyl.

Claim 15

A process for etching copper, comprising contacting the surface of a copper article with an etching composition at a temperature of at least about 120° F., said etching composition comprising between about 8% and about 12% by weight sulfuric acid, at least about 0.5 moles hydrogen peroxide per mole sulfuric acid, and between about 0.004 and about 0.02 moles per mole sulfuric acid of an additive corresponding to the formula ##STR7## where R is selected from a group consisting of hydrogen and an amino group corresponding to the formula: ##STR8## where R 1 and R 2 are independently selected from the group consisting of hydrogen and formyl.

Claim 16

A process as set forth in claim 12 wherein R comprises an amino group.

Claim 17

A process as set forth in claim 13 wherein one of R 1 and R 2 is hydrogen and the other of R 1 and R 2 is formyl.

Claim 18

A process as set forth in claim 12 wherein said etching solution further comprises between about 0.003 and about 0.05 moles per mole sulfuric acid of an aryl sulfonic acid stabilizing agent selected from a group consisting of phenol sulfonic acid, toluene sulfonic acid, xylene sulfonic acid, and alkali metal salts of said aryl sulfonic acids.

Claim 19

A process as set forth in claim 15 wherein said stabilizing agent comprises phenolsulfonic acid or an alkali metal salt thereof.

Claim 20

A process as set forth in claim 12 wherein said etching solution further comprises between about 5 and about 8 ounces copper ion per gallon of solution.

Claim 21

A process for preparation of a printed circuit board comprising the steps of: applying a layer comprising a photoresist over the surface of a copper sheet, the opposite surface of said copper sheet being adhered to a substrate element constituted of a material having a high dielectric strength; exposing said photoresist layer to electromagnetic energy through a photographic transparency or stencil having a pattern therein corresponding to the desired configuration of a circuit to be produced on said substrate element, thereby altering the susceptibility to removal by a developing agent of the photoresist of said layer in the areas thereof struck by electromagnetic energy and producing in said layer a pattern of photoresist material which is complementary to said circuit pattern and which may be removed by said developing agent to expose portions of said copper sheet which are not part of said circuit; applying said developing agent to said resist layer to remove said resist from said sheet in said complementary pattern; and contacting with an etching solution the copper exposed by the removal of said photoresist, thereby dissolving and removing copper from said substrate in said complementary pattern, said etching solution comprising between about 8% and about 12% by weight sulfuric acid, at least about 0.5 moles hydrogen peroxide per mole of sulfuric acid, and between about 0.004 and about 0.02 moles per mole sulfuric acid of an additive compound corresponding to the formula: ##STR9## where R is selected from a group consisting of hydrogen and an amino group corresponding to the formula: ##STR10## where R 1 and R 2 are independently selected from the group consisting of hydrogen and formyl.

Claim 22

A process for preparation of a printed circuit board comprising the steps of: applying a layer comprising a photoresist over the surface of a copper sheet, the opposite surface of said copper sheet being adhered to a substrate element constituted of a material having a high dielectric strength; exposing said photoresist layer to electromagnetic energy through a photographic transparency or stencil having a pattern therein corresponding to the desired configuration of a circuit to be produced on said substrate element, thereby altering the susceptibility to removal by a developing agent of the photoresist of said layer in the areas thereof struck by electromagnetic energy and producing in said layer a pattern of photoresist material which is complementary to said circuit pattern and which may be removed by said developing agent to expose portions of said copper sheet which are not part of said circuit; applying said developing agent to said resist layer to remove said resist from said sheet in said complementary pattern; and contacting with an etching solution the copper exposed by the removal of said photoresist, thereby dissolving and removing copper from said substrate in said complementary pattern, said etching solution comprising between about 8% and about 12% by weight sulfuric acid, at least about 0.5 moles hydrogen peroxide per mole of sulfuric acid, and between about 0.004 and about 0.02 moles per mole sulfuric acid of an additive compound corresponding to the formula: ##STR9## where R is selected from a group consisting of hydrogen and an amino group corresponding to the formula: ##STR10## where R 1 and R 2 are independently selected from the group consisting of hydrogen and formyl.

Claim 23

A process as set forth in claim 18 wherein R comprises an amino group.

Claim 24

A process as set forth in claim 19 wherein one of R 1 and R 2 is hydrogen and the other of R 1 and R 2 is formyl.

Claim 25

A process as set forth in claim 18 wherein said etching solution further comprises between about 0.003 and about 0.05 moles per mole sulfuric acid of an aryl sulfonic acid stabilizing agent selected from a group consisting of phenol sulfonic acid, toluene sulfonic acid, xylene sulfonic acid, and alkali metal salts of said aryl sulfonic acids.

Claim 26

A process as set forth in claim 21 wherein said stabilizing agent comprises phenolsulfonic acid or an alkali metal salt thereof.

Claim 27

A process as set forth in claim 18 wherein said etching solution further comprises between about 5 and about 8 ounces copper ion per gallon of solution.

Claim 28

A process as set forth in claim 23 wherein said etching solution is used repetitively for etching copper from the copper sheets on a series of said substrates, thereby progressively increasing the copper ion content in said solution, said process further comprising the steps of cooling said solution to cause crystallization of copper sulfate, and separating the copper sulfate precipitate from the resultant slurry.

Claim 29

A process for preparing a composition adapted for use in the etching of copper, said process comprising mixing sulfuric acid, a guanidine or guanidine derivative additive compound in a proportion of between about 0.004 and about 0.02 moles per mole sulfuric acid, and formic acid in a proportion of between about 0.004 and about 0.02 moles per mole sulfuric acid, said additive compound comprising a carbamidine compound or a salt of a carbamidine compound corresponding to the formula: ##STR11## where R is selected from the group consisting of hydrogen and an amino group corresponding to the formula: ##STR12## where R 1 and R 2 are independently selected from the group consisting of hydrogen and formyl.

Claim 30

A process for preparing a composition adapted for use in the etching of copper, said process comprising mixing sulfuric acid, a guanidine or guanidine derivative additive compound in a proportion of between about 0.004 and about 0.02 moles per mole sulfuric acid, and formic acid in a proportion of between about 0.004 and about 0.02 moles per mole sulfuric acid, said additive compound comprising a carbamidine compound or a salt of a carbamidine compound corresponding to the formula: ##STR11## where R is selected from the group consisting of hydrogen and an amino group corresponding to the formula: ##STR12## where R 1 and R 2 are independently selected from the group consisting of hydrogen and formyl.

Claim 31

A process as set forth in claim 25 wherein R comprises an amino group.

Claim 32

A process as set forth in claim 24 further comprising incorporating in said mixture an aryl sulfonic acid stabilizing agent selected from the group consisting of phenol sulfonic acid, toluene sulfonic acid, xylene sulfonic acid, and alkali metal salts of said aryl sulfonic acids.

Claim 33

A process as set forth in claim 27 wherein said stabilizing agent comprises phenol sulfonic acid or alkali metal salt thereof.

Claim 34

A process as set forth in claims 25 further comprising incorporating hydrogen peroxide into said mixture in a proportion of at leat about 0.5 moles per mole of sulfuric acid.