US4130454A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Etchant and process of etching with the same
Assignee: Individual
•
Filing: 1977-09-30
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Granted: 1978-12-19
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Expires: 1997-09-30
Abstract
Abstract This invention is directed to an etchant and to a process for its use. The etchant comprises a synergistic combination of hydrogen peroxide and molybdenum as oxidants in acidic solution. The combination of oxidants provides for sustained etching at an exalted rate. The etchant is useful for etching metals, especially copper and its alloys, and is particularly useful in the manufacture of printed circuit boards.
Inventors
- 👤 Oleh B. Dutkewych
- 👤 Charles A. Gaputis
- 👤 Michael Gulla
- 👤 Leonard R. Levy
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 10:52
CPC Classifications
C; C23; C23F; C23F1/00; C23F1/10; C23F1/14; C23F1/16; C23F1/18
Claims Analysis
Total Claims: 21
Claim 1
Independent Claim
57 words
An etchant comprising an acid solution of an oxidant combination of a peroxide and molybdenum, the peroxide being present in an amount sufficient to oxidize the molybdenum and provide sustained etching and the molybdenum being present in an amount sufficient to exalt the etch rate to a rate in excess of that achievable by the peroxide alone.
Claim 2
Dependent Claim
57 words
An etchant comprising an acid solution of an oxidant combination of a peroxide and molybdenum, the peroxide being present in an amount sufficient to oxidize the molybdenum and provide sustained etching and the molybdenum being present in an amount sufficient to exalt the etch rate to a rate in excess of that achievable by the peroxide alone.
Claim 3
Dependent Claim
17 words
The etchant of claim 1 where the peroxide to molybdenum ratio is at least 1 to 1.
Claim 4
Dependent Claim
31 words
The etchant of claim 2 where the concentration of the peroxide varies between 0.1 and 10 moles per liter and the molybdenum concentration varies between 0.01 and 1.0 moles per liter.
Claim 5
Dependent Claim
33 words
The etchant of claim 2 where the concentration of the peroxide varies between 0.5 and 2.5 moles per liter and the concentration of the molybdenum varies between 0.02 and 0.5 moles per liter.
Claim 6
Dependent Claim
11 words
The etchant of claim 2 where the peroxide is hydrogen peroxide.
Claim 7
Dependent Claim
11 words
The etchant of claim 5 where the acid is sulfuric acid.
Claim 8
Dependent Claim
62 words
An etchant comprising an acid solution of an oxidizing combination of hydrogen peroxide and molybdenum, the peroxide being present in an amount of from about 0.1 to 10 moles per liter and the molybdenum being present in an amount of from about 0.01 to 1 moles per liter, the ratio of the peroxide to the molybdenum being at least 1 to 1.
Claim 9
Dependent Claim
62 words
An etchant comprising an acid solution of an oxidizing combination of hydrogen peroxide and molybdenum, the peroxide being present in an amount of from about 0.1 to 10 moles per liter and the molybdenum being present in an amount of from about 0.01 to 1 moles per liter, the ratio of the peroxide to the molybdenum being at least 1 to 1.
Claim 10
Dependent Claim
11 words
The etchant of claim 7 where the acid is sulfuric acid.
Claim 11
Dependent Claim
44 words
The etchant of claim 8 where the concentration of the acid varies between 0.01 and 2.5 Normal, the concentration of the peroxide varies between 0.1 and 10 moles per liter and the concentration of the molybdenum varies between 0.01 and 1.0 moles per liter.
Claim 12
Dependent Claim
58 words
The etchant of claim 9 where the concentration of the acid varies between 0.5 and 1.5 Normal, the concentration of the peroxide varies between 0.5 and 2.5 moles per liter, the concentration of the molybdenum varies between 0.02 and 0.5 moles per liter and the ratio of the peroxide to the molybdenum is at least 1.2 to 1.
Claim 13
Dependent Claim
71 words
An etchant comprising an oxidant combination in a sulfuric acid solution, said oxidant combination comprising hydrogen peroxide and molybdenum, the sulfuric acid concentration varying between 0.01 and 2.5 moles per liter, the hydrogen peroxide concentration varying between about 0.1 and 10 moles per liter, the molybdenum concentration varying between about 0.02 and 0.5 moles per liter and the ratio of the peroxide to the molybdenum being at least 1 to 1.
Claim 14
Dependent Claim
71 words
An etchant comprising an oxidant combination in a sulfuric acid solution, said oxidant combination comprising hydrogen peroxide and molybdenum, the sulfuric acid concentration varying between 0.01 and 2.5 moles per liter, the hydrogen peroxide concentration varying between about 0.1 and 10 moles per liter, the molybdenum concentration varying between about 0.02 and 0.5 moles per liter and the ratio of the peroxide to the molybdenum being at least 1 to 1.
Claim 15
Dependent Claim
58 words
The etchant of claim 11 where the concentration of the acid varies between 0.5 and 1.5 Normal, the concentration of the peroxide varies between 0.5 and 2.5 moles per liter, the concentration of the molybdenum varies between 0.02 and 0.5 moles per liter and the ratio of the peroxide to the molybdenum is at least 1.2 to 1.
Claim 16
Dependent Claim
17 words
A process for etching a metal comprising contact of the metal with the etchant of claim 1.
Claim 17
Dependent Claim
17 words
A process for etching a metal comprising contact of the metal with the etchant of claim 7.
Claim 18
Dependent Claim
17 words
A process for etching a metal comprising contact of the metal with the etchant of claim 11.
Claim 19
Dependent Claim
10 words
The process of claim 15 where the metal is copper.
Claim 20
Dependent Claim
48 words
In a process for the manufacture of a printed circuit board including the steps of applying a resist over a copper cladding and removing unwanted copper by etching, the improvement comprising etching said unwanted copper with the etchant of claim 11 to leave a pattern of copper behind.
Claim 21
Dependent Claim
20 words
The process of claim 17 including the steps of removing said resist and applying solder over the remaining patterned copper.
References Cited (Backward Citations)
US2377593A
Cited
US2441300A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1981-12-18 | 1982-06-19 | 1982-12-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1985-12-18 | 1986-06-19 | 1986-12-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1989-12-18 | 1990-06-19 | 1990-12-19 | $7700.00 | Window Closed / Lapsed |