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Patent US4634619A successfully refreshed from Google Patents.
US4634619A
Expired / Lapsed
US
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Process for electroless metal deposition
Assignee: Surface Technology Inc
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Filing: 1984-02-10
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Granted: 1987-01-06
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Expires: 2004-02-10
Abstract
Abstract Disclosed herein are processes for the electroless (chemical) plating of substrates incorporating polyelectrolytes to increase the catalytic site density prior to the electroless (chemical) metal deposition step.
Inventors
- 👤 Deborah J. Lindsay
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 16:10
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/38; H05K3/381; C; C23; C23C; C23C18/00; C23C18/16; C23C18/18; C23C18/1851; C23C18/1872; C23C18/1886; C23C18/1893; C23C18/20; C23C18/2006; C23C18/2046; C23C18/2073; C23C18/2086; C23C18/22; C23C18/24; C23C18/28; C23C18/30; H05K3/10; H05K3/18; H05K3/181
Claims Analysis
Total Claims: 31
Claim 1
Independent Claim
139 words
A process for the metallization of a substrate by electroless plating or chemical plating comprising a. contacting said substrate with a composition comprising and adsorption modifier, said modifier being a polyelectrolyte, thereby providing a path for the increased catalytic site density, b. rinsing said substrate to remove excess adsorption modifier, and thereafter without the use of a sensitizing step c. contacting said treated substrate with a catalytic composition, said composition comprising a catalytic metal capable of electroless plating initiation, which directly or serving as a precursor leads to the catalytic sites which are capable of electroless plating initiation and wherein said non-noble catalytic metal may be either in the elemental state, an alloy, a compound, or a soluble complex, and mixtures thereof, and then d. contacting said substrate with a compatible electroless plating bath to deposit a metallic layer.
Claim 2
Dependent Claim
139 words
A process for the metallization of a substrate by electroless plating or chemical plating comprising a. contacting said substrate with a composition comprising and adsorption modifier, said modifier being a polyelectrolyte, thereby providing a path for the increased catalytic site density, b. rinsing said substrate to remove excess adsorption modifier, and thereafter without the use of a sensitizing step c. contacting said treated substrate with a catalytic composition, said composition comprising a catalytic metal capable of electroless plating initiation, which directly or serving as a precursor leads to the catalytic sites which are capable of electroless plating initiation and wherein said non-noble catalytic metal may be either in the elemental state, an alloy, a compound, or a soluble complex, and mixtures thereof, and then d. contacting said substrate with a compatible electroless plating bath to deposit a metallic layer.
Claim 3
Dependent Claim
12 words
The process according to claim 1 wherein said catalytic metal is copper.
Claim 4
Dependent Claim
16 words
The process according to claim 1 wherein said catalytic metal is part of a colloidal product.
Claim 5
Dependent Claim
14 words
The process according to claim 1 wherein said substrate is a printed circuitry substrate.
Claim 6
Dependent Claim
14 words
The process according to claim 4 wherein said printed circuitry substrate further contains through-holes.
Claim 7
Dependent Claim
11 words
The process according to claim 1 wherein said substrate is glass.
Claim 8
Dependent Claim
14 words
The process according to claim 1 wherein said substrate is a semiconductor type material.
Claim 9
Dependent Claim
13 words
The process according to claim 1 wherein said electroless plating is of copper.
Claim 10
Dependent Claim
13 words
The process according to claim 1 wherein said polyelectrolyte is a cationic flocculant.
Claim 11
Dependent Claim
17 words
The process according to claim 1 wherein said catalytic composition is a colloidal dispersion comprising of copper.
Claim 12
Dependent Claim
13 words
The process according to claim 1 wherein said polyelectrolyte is an anionic type.
Claim 13
Dependent Claim
15 words
The process according to claim 1 wherein said adsorption modifier is used above room temperature.
Claim 14
Dependent Claim
20 words
The process according to claim 1 wherein said adsorption modifier is used in the concentration range of 0.05% to 15%.
Claim 15
Dependent Claim
16 words
The process according to claim 1 wherein said catalytic metal is part of a soluble complex.
Claim 16
Dependent Claim
12 words
The process according to claim 14 wherein said soluble complex comprises Cu(I).
Claim 17
Dependent Claim
11 words
The process according to claim 1 wherein said substrate is ABS.
Claim 18
Dependent Claim
14 words
The process according to claim 1 wherein said electroless plating bath is chemical plating.
Claim 19
Dependent Claim
131 words
A process for the metallization of a printed circuitry substrate by electroless plating or chemical plating comprising a. contacting said substrate with a composition comprising a polyelectrolyte, thereby providing a path for the increased catalytic site density, b. rinsing said substrate to remove excess adsorption modifier, and thereafter without the use of a sensitizing step c. contacting said treated substrate with a catalytic composition, said composition comprising a non-noble metal capable of electroless plating initiation, which directly or serving as a precursor leads to the catalytic sites which are capable of electroless plating initiation and wherein said non-noble metal may either be in the elemental state, an alloy, compound, or soluble complex, and mixtures thereof, and d. contacting said substrate with a compatible electroless plating bath to deposit a metallic layer.
Claim 20
Dependent Claim
131 words
A process for the metallization of a printed circuitry substrate by electroless plating or chemical plating comprising a. contacting said substrate with a composition comprising a polyelectrolyte, thereby providing a path for the increased catalytic site density, b. rinsing said substrate to remove excess adsorption modifier, and thereafter without the use of a sensitizing step c. contacting said treated substrate with a catalytic composition, said composition comprising a non-noble metal capable of electroless plating initiation, which directly or serving as a precursor leads to the catalytic sites which are capable of electroless plating initiation and wherein said non-noble metal may either be in the elemental state, an alloy, compound, or soluble complex, and mixtures thereof, and d. contacting said substrate with a compatible electroless plating bath to deposit a metallic layer.
Claim 21
Dependent Claim
13 words
The process according to claim 18 wherein said electroless plating bath is copper.
Claim 22
Dependent Claim
13 words
The process according to claim 18 wherein said polyelectrolyte is a cationic flocculant.
Claim 23
Dependent Claim
13 words
The process according to claim 18 wherein said polyelectrolyte is an anionic flocculant.
Claim 24
Dependent Claim
12 words
The process according to claim 18 wherein said polyelectrolyte is a coagulant.
Claim 25
Dependent Claim
12 words
The process according to claim 18 wherein said polyelectrolyte is anionic type.
Claim 26
Dependent Claim
12 words
The process according to claim 18 wherein said polyelectrolyte is cationic type.
Claim 27
Dependent Claim
13 words
The process according to claim 18 wherein said substrate is a copper laminate.
Claim 28
Dependent Claim
12 words
The process according to claim 18 wherein said substrate further containing through-holes.
Claim 29
Dependent Claim
15 words
The process according to claim 18 wherein said catalytic composition comprises a dispersion of copper.
Claim 30
Dependent Claim
12 words
The process according to claim 18 wherein said metallic layer is copper.
Claim 31
Dependent Claim
13 words
The process according to claim 18 wherein said polyelectrolyte is a non-ionic type.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1990-01-05 | 1990-07-07 | 1991-01-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1994-01-05 | 1994-07-07 | 1995-01-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1998-01-05 | 1998-07-07 | 1999-01-06 | $7700.00 | Window Closed / Lapsed |