US4631571A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device for use in a large scale integration circuit
Assignee: NEC Corp
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Filing: 1984-03-14
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Granted: 1986-12-23
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Expires: 2004-03-14
Abstract
Abstract An output signal is derived from an output buffer to an external lead in a semiconductor device. In general, the output buffer is constructed using an MOS transistor and is located near a bonding pad on the chip. Therefore, the number of bonding pads which can be formed on the chip is limited by the output buffer space. The present invention provides the output buffer with a tapered or tiered shape which reduces the pitch between bonding pads. Thus, a large number of bonding pads (output buffers) can be integrated in a semiconductor chip according to the present invention.
Inventors
- 👤 Fusao Tsubokura
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 00:33
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/90; H10D; H10D84/00; H10D84/90; H10D84/998; H10W20/00; H10W20/40; H10W20/41; H10W20/427; H10W72/951; H10W72/952
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
113 words
A semiconductor device comprising an output buffer element having an MOS transistor and a bonding pad on a semiconductor chip, said MOS transistor having a source region, a gate electrode and a drain region, said source region having a first end portion, an intermediate portion narrower than said first end portion and a second end portion narrower than said intermediate portion, said second end portion being adjacent to said bonding pad and near a peripheral side of said semiconductor chip, said first end portion being positioned far from said peripheral side of said semiconductor chip, and said gate electrode and said drain region being elongated along and in parallel with said source region.
Claim 2
Dependent Claim
113 words
A semiconductor device comprising an output buffer element having an MOS transistor and a bonding pad on a semiconductor chip, said MOS transistor having a source region, a gate electrode and a drain region, said source region having a first end portion, an intermediate portion narrower than said first end portion and a second end portion narrower than said intermediate portion, said second end portion being adjacent to said bonding pad and near a peripheral side of said semiconductor chip, said first end portion being positioned far from said peripheral side of said semiconductor chip, and said gate electrode and said drain region being elongated along and in parallel with said source region.
Claim 3
Dependent Claim
78 words
A semiconductor device comprising two output buffer transistors and a bonding pad, each of said two output buffer transistors being formed in a tapered or tiered shape pattern in a plan view and being elongated on a semiconductor chip, said bonding pad being located between said two output buffer transistors and being positioned near one end portion of said two output buffer transistors, said one end portion having a width smaller than that of the other end portion.
Claim 4
Dependent Claim
78 words
A semiconductor device comprising two output buffer transistors and a bonding pad, each of said two output buffer transistors being formed in a tapered or tiered shape pattern in a plan view and being elongated on a semiconductor chip, said bonding pad being located between said two output buffer transistors and being positioned near one end portion of said two output buffer transistors, said one end portion having a width smaller than that of the other end portion.
Claim 5
Dependent Claim
101 words
In a semiconductor output buffer device having a MOS transistor and a bonding pad on a semiconductor chip, said MOS transistor having a source region, a gate electrode and a drain region, the improvement comprising: an elongated source region having a first end portion and a second end portion narrower than said first end portion, said second end portion being positioned proximate to said bonding pad and said first end portion being positioned inwardly on said chip from said bonding pad, said gate electrode and said drain region being elongated and disposed in parallel with an edge of said source region.
Claim 6
Dependent Claim
101 words
In a semiconductor output buffer device having a MOS transistor and a bonding pad on a semiconductor chip, said MOS transistor having a source region, a gate electrode and a drain region, the improvement comprising: an elongated source region having a first end portion and a second end portion narrower than said first end portion, said second end portion being positioned proximate to said bonding pad and said first end portion being positioned inwardly on said chip from said bonding pad, said gate electrode and said drain region being elongated and disposed in parallel with an edge of said source region.
Claim 7
Dependent Claim
16 words
The device of claim 3 wherein said elongated source region is configured in a tiered shape.
Claim 8
Dependent Claim
16 words
The device of claim 3 wherein said elongated source region is configured in a tapered shape.
Claim 9
Dependent Claim
24 words
The device of claim 3 wherein said second end portion of said source region is positioned proximate to a peripheral edge of said chip.
Claim 10
Dependent Claim
24 words
The device of claim 1 further comprising an intermediate portion of said source region disposed between said first end portion and said second end.
Claim 11
Dependent Claim
80 words
A semiconductor device comprising an output buffer element including an MOS transistor and a bonding pad on a semiconductor chip, said MOS transistor having a source region, a gate electrode and a drain region, said source region having first and second end portions, said second end portion disposed near said bonding pad near a side of said chip, said first end portion being disposed inwardly from said side, and said second end portion being narrower than said first end portion.
Claim 12
Dependent Claim
80 words
A semiconductor device comprising an output buffer element including an MOS transistor and a bonding pad on a semiconductor chip, said MOS transistor having a source region, a gate electrode and a drain region, said source region having first and second end portions, said second end portion disposed near said bonding pad near a side of said chip, said first end portion being disposed inwardly from said side, and said second end portion being narrower than said first end portion.
Claim 13
Dependent Claim
43 words
The device of claim 1 wherein said source region has a tiered edge on a side proximate to said bonding pad extending from said first end to said second end and has a straight edge on an opposite side from said tiered edge.
Claim 14
Dependent Claim
55 words
The device of claim 1 where said source region has an angularly tapered edge extending from said first end to said second end with respect to said side of said chip and is normal with respect to said side of said chip on an opposite side of said source region from said anularly tapered edge.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1989-12-22 | 1990-06-23 | 1990-12-23 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1993-12-22 | 1994-06-23 | 1994-12-23 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1997-12-22 | 1998-06-23 | 1998-12-23 | $7700.00 | Window Closed / Lapsed |