Dynamic memory with intermediate column derode

Claim 2

A semiconductor read/write memory device comprising: an array of rows and columns of read/write memory cells, with a plurality of differential sense amplifiers connected to columns of the array, each said sense amplifier having a pair of sense nodes, each sense node connected to a column, a plurality of intermediate input/output buffer and decode means coupled between said sense nodes of said sense amplifiers and data I/O terminal means, to write data to both of said sense nodes of a differential sense amplifier but to read data from only one of said sense nodes of a differential sense amplifier.

Claim 3

A device according to claim 1 wherein said plurality of intermediate input/output buffer and decode means includes a plurality of segmented dual-rail intermediate I/O buffers.

Claim 4

A device according to claim 2 wherein each of said plurality of intermediate input/output buffer and decode means includes a buffer circuit, and includes a first decoder, said first decoder receiving a part of a column address from terminals of said device.

Claim 5

In a semiconductor memory device formed in a single semiconductor intetrated circuit: an array of rows and columns of memory cells; row address means coupled to said rows for selecting one row in response to a row address input; a data I/O line for said array: a plurality of segmented intermediate I/O lines for said array; a plurality of first intermediate I/O buffer means including first column-select means, each of said plurality being coupled to a different group of said columns of the array and coupled to one of said plurality of segmented intermediate I/O lines, a plurality of second intermediate I/O buffer means including second column-select means, each of said plurality being coupled between one of said plurality of segmented intermediate I/O lines and said data I/O line; and column address means having first and second outputs coupled to said first and second column-select means, respectively, and receiving a column address.

Claim 6

In a semiconductor memory device formed in a single semiconductor intetrated circuit: an array of rows and columns of memory cells; row address means coupled to said rows for selecting one row in response to a row address input; a data I/O line for said array: a plurality of segmented intermediate I/O lines for said array; a plurality of first intermediate I/O buffer means including first column-select means, each of said plurality being coupled to a different group of said columns of the array and coupled to one of said plurality of segmented intermediate I/O lines, a plurality of second intermediate I/O buffer means including second column-select means, each of said plurality being coupled between one of said plurality of segmented intermediate I/O lines and said data I/O line; and column address means having first and second outputs coupled to said first and second column-select means, respectively, and receiving a column address.

Claim 7

A device according to claim 4 wherein said data I/O line is single-rail, and each of said segmented intermediate I/O lines is a dual-rail, true and complement, pair of lines.

Claim 8

A device according to claim 4 wherein said memory cells are dynamic one-transistor cells, and wherein said memory device includes a plurality of differential sense amplifiers, each of said sense amplifiers being connected to one of said columns.

Claim 9

A device according to claim 6 wherein each of said first buffer means is coupled to one of the sense amplifiers of one of the columns for single-ended read and dual-ended write operations.

Claim 10

A device according to claim 4 wherein only one of said first buffer means and only one of said second buffer means is activated by a given column address.

Claim 11

A device according to claim 8 wherein the capacitance of each of said segmented intermediate I/O lines is less than that of said data I/O line.

Claim 12

A semiconductor memory device comprising: an array of N memory cells arranged in rows and columns, where N is a power of 2; said array being partitioned into M subarrays, where M is an integer and each subarray contains N/M of said memory cells arranged in rows and columns; at least M data I/O lines; address input means producing a multibit row address and a multibit column address; row decoder means receiving said row address and having an output coupled to said rows in said subarrays, each said subarray containing a plurality of R intermediate data I/O segment lines, where R is a power of 2; each of said segment lines being selectively coupled to a plurality of S of said columns of said subarray, where S is a power of 2, by a first Y-selector which receives a part of said column address; each of said M data I/O lines being selectively coupled to said R segment lines by a second Y-selector which receives another part of said column address.

Claim 13

A semiconductor memory device comprising: an array of N memory cells arranged in rows and columns, where N is a power of 2; said array being partitioned into M subarrays, where M is an integer and each subarray contains N/M of said memory cells arranged in rows and columns; at least M data I/O lines; address input means producing a multibit row address and a multibit column address; row decoder means receiving said row address and having an output coupled to said rows in said subarrays, each said subarray containing a plurality of R intermediate data I/O segment lines, where R is a power of 2; each of said segment lines being selectively coupled to a plurality of S of said columns of said subarray, where S is a power of 2, by a first Y-selector which receives a part of said column address; each of said M data I/O lines being selectively coupled to said R segment lines by a second Y-selector which receives another part of said column address.

Claim 14

A device according to claim 10 wherein each of said segment lines is a dual-rail pair of lines, and wherein each of said data I/O lines is a single-rail line.

Claim 15

A device according to claim 10 wherein said array contains B rows and C columns, where B and C are integral powers of 2 and C is greater than B.

Claim 16

A device according to claim 12 wherein each of said subarrays contains C/M columns; wherein C/M is greater than R; and C/M is greater than S.

Claim 17

A device according to claim 10 wherein each of said columns includes a pair of bit lines with a differential sense amplifier between the pair of bit lines.

Claim 18

A device according to claim 14 wherein each of said pairs of bit lines is coupled through said first and second y-selectors to one of said data I/O lines by a dual-rail write path and by a single-rail read path.

Claim 19

A device according to claim 15 wherein said memory cells are dynamic one-transistor read/write cells.

Claim 20

A device according to claim 16 wherein said address input means receives a row address and a column address in time multiplex.

Claim 21

A device according to claim 17 wherein said row address is gated into said row address decoder only by an address strobe, but said column address is applied to said first and second selectors without said address strobe.

Claim 22

A device according to claim 17 wherein each of said segment lines is a dual rail, true and complement, pair of lines.

Claim 23

A device according to claim 19 wherein the capacitance of each of said segment lines is much less than that of each of said data I/O lines.

Claim 24

A semiconductor dynamic memory device formed in a semiconductor bar, comprising: an array of N dynamic memory cells arranged in B rows and C columns of cells; a plurality of differential sense amplifiers; each column being connected to one of said differential sensing amplifiers; said array being partitioned into M subarrays, where each subarray contains N/M of said memory cells arranged in rows and C/M columns; where N, M, B and C are integers and powers of 2, and N>C>B>M, and √N>b; at least M single-rail data I/O lines; an address input means on said bar receiving an address input from external to said bar and producing a multibit row address and a multibit column address, row decoder means on said bar receiving said row address and having an output coupled to said rows in said subarrays, column decoder means on said bar receiving said column address and having at least first and second outputs, a plurality of R segment lines, where R is an integer and R>M<C, each of said segment lines being selectively coupled by first buffer means to a plurality of S of said sense amplifiers of said C/M columns of said subarray, said first buffer means including first Y-selector means which receives said first output of said column decoder means, where S is a power of 2 and C/M>S; each of said M data I/O lines being selectively coupled by second buffer means to a plurality of said segment lines of a subarray, said second buffer means including second Y-selector means which receives said second output of said column decoder means.

Claim 25

A semiconductor dynamic memory device formed in a semiconductor bar, comprising: an array of N dynamic memory cells arranged in B rows and C columns of cells; a plurality of differential sense amplifiers; each column being connected to one of said differential sensing amplifiers; said array being partitioned into M subarrays, where each subarray contains N/M of said memory cells arranged in rows and C/M columns; where N, M, B and C are integers and powers of 2, and N>C>B>M, and √N>b; at least M single-rail data I/O lines; an address input means on said bar receiving an address input from external to said bar and producing a multibit row address and a multibit column address, row decoder means on said bar receiving said row address and having an output coupled to said rows in said subarrays, column decoder means on said bar receiving said column address and having at least first and second outputs, a plurality of R segment lines, where R is an integer and R>M<C, each of said segment lines being selectively coupled by first buffer means to a plurality of S of said sense amplifiers of said C/M columns of said subarray, said first buffer means including first Y-selector means which receives said first output of said column decoder means, where S is a power of 2 and C/M>S; each of said M data I/O lines being selectively coupled by second buffer means to a plurality of said segment lines of a subarray, said second buffer means including second Y-selector means which receives said second output of said column decoder means.

Claim 26

A device according to claim 21 wherein each of said segment lines is a dual-rail, true and complement pair of lines.

Claim 27

A device according to claim 21 wherein said first and second buffer means provide dual-rail write to said sense amplifiers, and single-rail read from said sense amplifiers.

Claim 28

A device according to claim 21 wherein each of said columns includes a pair of bit lines with a differential sense amplifier between the pair of bit lines.

Claim 29

A device according to claim 24 wherein each of said pairs of bit lines is coupled through said first and second buffer means to one of said data I/O lines by a dual-rail write path and by a single-rail read path.

Claim 30

A device according to claim 25 wherein said memory cells are dynamic one-transistor read/write cells.

Claim 31

A device according to claim 26 wherein said address input means receives said address input as a row address and a column address in time multiplex.

Claim 32

A device according to claim 27 wherein said row address is gated into said row address decoder only by an address strobe, but said column address produces said first and second outputs to said first and second selector means without said address strobe.

Claim 33

A device according to claim 28 wherein each of said segment lines is a dual rail, true and complement, pair of lines.

Claim 34

A device according to claim 29 wherein the capacitance of each of said segment lines is much less than that of each of said data I/O lines, to thereby reduce the loading of said bit lines by coupling through said first buffer means.