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US4628589A Expired / Lapsed US ⏱️ 0.0 years remaining

Method for fabricating stacked CMOS structures

Assignee: Texas Instruments Inc
•
Filing: 1984-09-28
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Granted: 1986-12-16
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Expires: 2004-09-28
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Abstract

Abstract In stacked CMOS, a single gate in first level polysilicon is used to address both an n-channel device in the substrate and an overlayed p-channel device. To self-align the p-channel polycrystalline silicon device to the gate, a layer of polycrystalline silicon is deposited over the integrated circuit, followed by spinning on a layer of doped oxide which is then etched back to expose the polycrystalline silicon over the gate region. Thermally annealing the integrated circuit causes dopant from the doped layer to diffuse into the polycrystalline layer, thereby forming self-aligned source and drain structures.

Inventors

  • 👤 Ravishankar Sundaresan

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-30 12:13
CPC Classifications
H; H10; H10D; H10D84/00; H10D84/01; H10D84/02; H10D84/03; H10D84/038; H10D88/00; H10D88/01

Claims Analysis

Total Claims: 9
Claim 1
Independent Claim 115 words
A method for fabricating a self-aligned stacked CMOS structure, comprising the steps of: (a) forming source and drain regions having a first conductivity type in a substrate having a second conductivity type; (b) forming an insulated gate region on an upper surface of the substrate; (c) forming a layer of polycrystalline silicon over the substrate and the gate region; (d) forming doped regions adjacent the polycrystalline layer above the source and drain regions; and (e) causing dopant from the doped regions to diffuse into the polycrystalline layer, wherein doped polycrystalline regions are formed above the source and drain regions, and wherein polycrystalline above the gate region is not doped by diffusion from the doped regions.
Claim 2
Independent Claim 115 words
A method for fabricating a self-aligned stacked CMOS structure, comprising the steps of: (a) forming source and drain regions having a first conductivity type in a substrate having a second conductivity type; (b) forming an insulated gate region on an upper surface of the substrate; (c) forming a layer of polycrystalline silicon over the substrate and the gate region; (d) forming doped regions adjacent the polycrystalline layer above the source and drain regions; and (e) causing dopant from the doped regions to diffuse into the polycrystalline layer, wherein doped polycrystalline regions are formed above the source and drain regions, and wherein polycrystalline above the gate region is not doped by diffusion from the doped regions.
Claim 3
Dependent Claim 19 words
The method of claim 1, wherein the first conductivity type is n-type, and the second conductivity type is p-type.
Claim 4
Dependent Claim 19 words
The method of claim 1, wherein the first conductivity type is p-type, and the second conductivity type is n-type.
Claim 5
Dependent Claim 14 words
The method of claim 1, wherein the doped regions comprise boron doped silicate glass.
Claim 6
Dependent Claim 16 words
The method of claim 1, wherein the doped regions comprise phosphorus or arsenic doped silicate glass.
Claim 7
Dependent Claim 53 words
The method of claim 1, wherein step (d) comprises the steps of: (f) forming a doped layer over the polycrystalline layer; and (g) anisotropically etching the doped layer until the polycrystalline layer above the gate region is exposed, wherein sidewall regions of the doped layer are left above the source and drain regions.
Claim 8
Dependent Claim 13 words
The method of claim 6, wherein the doped layer comprises boron doped glass.
Claim 9
Dependent Claim 19 words
The method of claim 1, further comprising the subsequent step of removing said doped regions after said step (e).

References Cited (Backward Citations)

US988181A Cited
US3899373A Cited
US4239559A Cited
US4467518A Cited
US4505024A Cited
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US4502202A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1989-12-15 1990-06-16 1990-12-16 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1993-12-15 1994-06-16 1994-12-16 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1997-12-15 1998-06-16 1998-12-16 $7700.00 Window Closed / Lapsed

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