Patent US4625228A successfully refreshed from Google Patents.
US4625228A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Multi-layer electrical support substrate
Assignee: WC HERAEUS A OF GERMANY GmbH LLC
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Filing: 1984-10-17
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Granted: 1986-11-25
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Expires: 2004-10-17
Abstract
Abstract To prevent defoliation or splitting-off of an aluminum or aluminum alloy which is roll-plated on a copper or copper alloy base, an intermediate nickel layer having less than 0.05% contaminants is applied beneath the aluminum layer. If the base is a copper alloy, an intermediate copper layer which is of an oxygen-free copper or copper alloy is placed between the base and the nickel layer. Typical dimensions are: base copper layer (1, 13): 0.25 mm; oxygen-free copper layer (7, 15): 0.005 to 0.01 mm; nickel layer with less than 0.05% contaminants or impurities: about 0.01 mm; AlSi 0.5 aluminum alloy: 0.005 to 0.006 mm.
Inventors
- 👤 Albrecht Bischoff
- 👤 Holger Eisentraut
- 👤 Joachim Schmidt
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 15:46
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/456; H10W70/457; H01; H01B; H01B1/00; H01B1/02
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
90 words
A multi-layer support substrate for an electrical component, particularly for semiconductor elements or chips, said substrate having, at least in the region of support for said component, a base portion made of copper or copper alloy, and a plating layer pattern of aluminum or aluminum alloy, applied to the base portion by roll-on plating, said plating layer pattern supporting said electrical component, and comprising, in accordance with the invention, a layer of nickel having less than 0.05% impurities, or contaminants, located between the base portion and the rolled-on plating layer.
Claim 2
Dependent Claim
90 words
A multi-layer support substrate for an electrical component, particularly for semiconductor elements or chips, said substrate having, at least in the region of support for said component, a base portion made of copper or copper alloy, and a plating layer pattern of aluminum or aluminum alloy, applied to the base portion by roll-on plating, said plating layer pattern supporting said electrical component, and comprising, in accordance with the invention, a layer of nickel having less than 0.05% impurities, or contaminants, located between the base portion and the rolled-on plating layer.
Claim 3
Dependent Claim
41 words
Support substrate according to claim 1, in which the base portion comprises a copper alloy; and wherein, in accordance with the invention; a layer of oxygen-free copper is positioned between the layer of nickel and said base portion comprising copper alloy.
Claim 4
Dependent Claim
39 words
Support substrate according to claim 2, wherein the thickness of the oxygen-free copper intermediate layer is between 5 to 50% of the sum of the thicknesses of the layers forming: the base; the nickel layer, and the plating layer.
Claim 5
Dependent Claim
12 words
Support substrate according to claim 1, wherein the base portion comprises CuFe2.
Claim 6
Dependent Claim
12 words
Support substrate according to claim 2, wherein the base portion comprises CuFe2.
Claim 7
Dependent Claim
12 words
Support substrate according to claim 3, wherein the base portion comprises CuFe2.
Claim 8
Dependent Claim
17 words
Support substrate according to claim 1, wherein the plating layer comprises AlSi containing 0.5 to 1% silicon.
Claim 9
Dependent Claim
17 words
Support substrate according to claim 2, wherein the plating layer comprises AlSi containing 0.5 to 1% silicon.
Claim 10
Dependent Claim
17 words
Support substrate according to claim 3, wherein the plating layer comprises AlSi containing 0.5 to 1% silicon.
Claim 11
Dependent Claim
17 words
Support substrate according to claim 4, wherein the plating layer comprises AlSi containing 0.5 to 1% silicon.
Claim 12
Dependent Claim
17 words
Support substrate according to claim 5, wherein the plating layer comprises AlSi containing 0.5 to 1% silicon.
Claim 13
Dependent Claim
17 words
Support substrate according to claim 6, wherein the plating layer comprises AlSi containing 0.5 to 1% silicon.
Claim 14
Dependent Claim
47 words
Support substrate according to claim 1, wherein the base portion has a thickness of about 0.2 to 0.9 mm; said nickel layer has a thickness of about 0.002 to 0.03 mm; and the plating layer has a thickness in the order of about 0.004 to 0.015 mm.
Claim 15
Dependent Claim
56 words
Support substrate according to claim 13, in which the base portion comprises a copper alloy; wherein, in accordance with the invention, a layer of oxygen-free copper is positioned between the layer of nickel and said base portion comprising copper alloy; and wherein said oxygen-free intermediate copper layer has a thickness between about 0.005 to 0.01 mm.
References Cited (Backward Citations)
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US3576415A
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US4000842A
Cited
US4151545A
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1989-11-24 | 1990-05-26 | 1990-11-25 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1993-11-24 | 1994-05-26 | 1994-11-25 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1997-11-24 | 1998-05-26 | 1998-11-25 | $7700.00 | Window Closed / Lapsed |