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Patent US4624045A successfully refreshed from Google Patents.
US4624045A
Expired / Lapsed
US
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Method of making thin film device
Assignee: Panasonic Holdings Corp
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Filing: 1985-03-27
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Granted: 1986-11-25
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Expires: 2005-03-27
Abstract
Abstract A thin film device such as an amorphous thin film solar battery is easily made with high integration by use of metal-diffused regions in the thin film as an electrical connection region across the thickness of the thin film. By use of such metal-diffused regions 24, 24 . . . for connection between transparent stripe shaped electrodes 21', 21'. . . disposed between glass substrate 20 and amorphous silicon thin film 23 and stripe shaped metal electrodes 25, 25 . . . on the top surface of the thin film 23, series connected solar battery cells can be made with a small number of process steps.
Inventors
- 👤 Shinichiro Ishihara
- 👤 Takashi Hirao
- 👤 Koshiro Mori
- 👤 Masaharu Ono
- 👤 Masatoshi Kitagawa
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 11:17
CPC Classifications
H; H10; H10F; H10F77/00; H10F77/20; H10F77/206; H10F77/211; H10F19/00; H10F19/30; H10F19/31; H10F19/35; H10F71/00; H10F71/10; H10F71/103; H10W; H10W20/00; H10W20/20; Y; Y02; Y02E; Y02E10/00; Y02E10/50; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
171 words
A method for forming an array of series-connected thin film devices comprising the steps of: forming a plurality of spaced apart conductive first electrodes on an insulative substrate, forming a corresponding plurality of diffusion metal sources each of which is in contact with a respective one of said first electrodes, selective portions of the surface of said diffusion metal sources being oxidized to selectively prevent diffusion therefrom, forming a thin film of semiconductive material on said conductive first electrodes and insulative substrate, diffusing metal from each of said diffusion metal sources into said thin film thereby to produce diffused regions in said thin film at the same time as said forming of said thin film in a manner such that said diffused regions reach the remote surface of said thin film during said forming of said thin film, and forming a plurality of spaced apart conductive second electrodes on the surface of said thin film and said diffused regions, thereby forming electrical connections between said first electrodes and said second electrodes.
Claim 2
Independent Claim
171 words
A method for forming an array of series-connected thin film devices comprising the steps of: forming a plurality of spaced apart conductive first electrodes on an insulative substrate, forming a corresponding plurality of diffusion metal sources each of which is in contact with a respective one of said first electrodes, selective portions of the surface of said diffusion metal sources being oxidized to selectively prevent diffusion therefrom, forming a thin film of semiconductive material on said conductive first electrodes and insulative substrate, diffusing metal from each of said diffusion metal sources into said thin film thereby to produce diffused regions in said thin film at the same time as said forming of said thin film in a manner such that said diffused regions reach the remote surface of said thin film during said forming of said thin film, and forming a plurality of spaced apart conductive second electrodes on the surface of said thin film and said diffused regions, thereby forming electrical connections between said first electrodes and said second electrodes.
Claim 3
Independent Claim
189 words
A method for forming an array of series-connected thin film devices comprising the steps of: forming a plurality of spaced apart conductive first electrodes on an insulative substrate, forming a corresponding plurality of diffusion metal sources each of which is in contact with a respective one of said first electrodes, each of said diffusion metal sources being an evaporated aluminum film whose surface is selectively oxidized to selectively prevent diffusion therefrom, forming a thin film of amorphous silicon on said conductive first electrodes and insulative substrate, diffusing aluminum from each of said aluminum diffusion sources into said thin film thereby to produce diffused regions in said thin film at the same time as said forming of said thin film in a manner such that said diffused regions reach the remote surface of said thin film during said forming of said thin film while keeping said insulative substrate at a temperature of between 180° and 300° C., and forming a plurality of spaced apart conductive second electrodes on the surface of said thin film and said diffused regions, thereby forming electrical connections between said first electrodes and said second electrodes.
Claim 4
Independent Claim
189 words
A method for forming an array of series-connected thin film devices comprising the steps of: forming a plurality of spaced apart conductive first electrodes on an insulative substrate, forming a corresponding plurality of diffusion metal sources each of which is in contact with a respective one of said first electrodes, each of said diffusion metal sources being an evaporated aluminum film whose surface is selectively oxidized to selectively prevent diffusion therefrom, forming a thin film of amorphous silicon on said conductive first electrodes and insulative substrate, diffusing aluminum from each of said aluminum diffusion sources into said thin film thereby to produce diffused regions in said thin film at the same time as said forming of said thin film in a manner such that said diffused regions reach the remote surface of said thin film during said forming of said thin film while keeping said insulative substrate at a temperature of between 180° and 300° C., and forming a plurality of spaced apart conductive second electrodes on the surface of said thin film and said diffused regions, thereby forming electrical connections between said first electrodes and said second electrodes.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1989-11-24 | 1990-05-26 | 1990-11-25 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1993-11-24 | 1994-05-26 | 1994-11-25 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1997-11-24 | 1998-05-26 | 1998-11-25 | $7700.00 | Window Closed / Lapsed |