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US4623500A Expired / Lapsed US ⏱️ 0.0 years remaining

Method of mounting a plurality of coupons in molded material and polishing surfaces thereof for cross-sectional analysis of printed circuit boards

Assignee: Buehler Ltd
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Filing: 1985-04-18
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Granted: 1986-11-18
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Expires: 2005-04-18
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Abstract

Abstract Method and apparatus for high volume preparation of cross-sectional specimens of printed circuit boards for microscopic examination, including a method and apparatus for precision mounting of a large number of such cross sections in a single molding sequence for simultaneous polishing of such cross sections in a single polishing operation.

Inventors

  • 👤 James A. Nelson
  • 👤 Robert E. Zimmer

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-09 21:29
CPC Classifications
G; G01; G01N; G01N1/00; G01N1/28; G01N1/32; B; B29; B29C; B29C39/00; B29C39/02; B29C39/10; B29L; B29L2031/00; B29L2031/40; H; H05; H05K; H05K1/00; H05K1/02; H05K1/0266; H05K3/00; H05K3/0011; H05K3/0044

Claims Analysis

Total Claims: 5
Claim 1
Independent Claim 96 words
A method of mounting a plurality of coupons taken from printed circuit board panels for purposes of polishing such coupons, said method comprising, in combination, pinning a plurality of coupons together in spaced relation using a pair of disposable pins which extend through each coupon on the side opposite the cross-sectional surface to be polished so as to form a pinned coupon assembly, placing said pinned assembly in a mold with the cross-sectional surfaces to be polished facing upwardly, and adding molding material to the mold to produce a pinned assembly mounted in a plastic mount.
Claim 2
Independent Claim 96 words
A method of mounting a plurality of coupons taken from printed circuit board panels for purposes of polishing such coupons, said method comprising, in combination, pinning a plurality of coupons together in spaced relation using a pair of disposable pins which extend through each coupon on the side opposite the cross-sectional surface to be polished so as to form a pinned coupon assembly, placing said pinned assembly in a mold with the cross-sectional surfaces to be polished facing upwardly, and adding molding material to the mold to produce a pinned assembly mounted in a plastic mount.
Claim 3
Dependent Claim 27 words
A method as defined in claim 1 where the molding material is added to the mold substantially to the level of the cross-sectional surfaces to be polished.
Claim 4
Dependent Claim 62 words
A method as defined in claim 1 where a plurality of pinned assemblies are placed in respective openings in a sample holder, molding material is added in said openings to cast each pinned assembly in a plastic mount directly in said sample holder, and said sample holder is inverted and attached to a polishing machine for simultaneous polishing of said cross-sectional surfaces.
Claim 5
Dependent Claim 40 words
A method as defined in claim 3 where said sample holder includes at least three adjustable projecting stop members, and said stop members are adjusted to control the amount of material removed from said cross-sectional surfaces during the polishing thereof.

References Cited (Backward Citations)

US2378252A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1989-11-17 1990-05-19 1990-11-18 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1993-11-17 1994-05-19 1994-11-18 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1997-11-17 1998-05-19 1998-11-18 $7700.00 Window Closed / Lapsed

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