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US4622058A
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Formation of a multi-layer glass-metallized structure formed on and interconnected to multi-layered-metallized ceramic substrate
Assignee: International Business Machines Corp
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Filing: 1986-03-25
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Granted: 1986-11-11
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Expires: 2006-03-25
Abstract
Abstract In the fabrication of an interconnection package for a plurality of semiconductors or integrated circuit chips wherein a multi-layered glass or glass-ceramic superstructure with a multi-layered distribution of planar conductors is formed by a process forming vertical conductive interconnection or studs between planar conductor layers, by pre-forming a via configuration in each glass or glass-ceramic layer at the interconnection points followed by depositing the conductive studs therein. The via configuration is formed by defining a desired pattern of vias, and ablating the vias through the top of and through the glass or glass-ceramic layer, using an ultraviolet laser. The vias may be stepped-shoulder or counter-bored by using a two mask operation.
Inventors
- 👤 Pamela A. Leary-Renick
- 👤 Rangaswamy Srinivasan
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 15:48
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/0011; H05K3/0017; H05K3/0026; H05K3/0029; H10; H10W; H10W70/00; H10W70/60; H10W70/611; H10W70/67; H10W70/68; H10W70/685; H10W99/00; H05K1/00; H05K1/02; H05K1/03; H05K1/0306; H05K1/11; H05K1/115; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/096; H05K2201/09818; H05K2201/09845; H05K2203/00; H05K2203/05; H05K2203/0548; H05K2203/0557; H05K3/46; H05K3/4644; H05K3/4664; H05K3/4667; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155; Y10T29/49156
Claims Analysis
Total Claims: 36
Claim 1
Independent Claim
163 words
A method for forming vias in a structure, wherein said structure is selected from the group consisting of glass and glass-ceramics, comprising: superimposing over said structure an inert first mask having a pattern of first apertures therethrough; masking said structure with said first mask and employing said first apertures thereof to partially ablate vias by radiating an ultraviolet laser through the top of and into said structure in the areas opposite said first apertures, with the bottom of said vias spaced a distance fom the bottom of said structure; replacing said first mask with a second mask having a pattern of second apertures extending therethrough, said pattern of second apertures corresponding to said pattern of said first mask with said second pattern of apertures being substantially smaller than and concentric with said first apertures; and employing said second apertures to completely ablate through said structure by radiating an ultraviolet laser upon areas opposite said second apertures to form vias having stepped-shoulder counter-bored configurations.
Claim 2
Independent Claim
163 words
A method for forming vias in a structure, wherein said structure is selected from the group consisting of glass and glass-ceramics, comprising: superimposing over said structure an inert first mask having a pattern of first apertures therethrough; masking said structure with said first mask and employing said first apertures thereof to partially ablate vias by radiating an ultraviolet laser through the top of and into said structure in the areas opposite said first apertures, with the bottom of said vias spaced a distance fom the bottom of said structure; replacing said first mask with a second mask having a pattern of second apertures extending therethrough, said pattern of second apertures corresponding to said pattern of said first mask with said second pattern of apertures being substantially smaller than and concentric with said first apertures; and employing said second apertures to completely ablate through said structure by radiating an ultraviolet laser upon areas opposite said second apertures to form vias having stepped-shoulder counter-bored configurations.
Claim 3
Dependent Claim
24 words
The method of claim 1 wherein said structure is formed on a dissimilar substrate, and said vias are formed to extend to said substrate.
Claim 4
Dependent Claim
69 words
The method of claim 1 wherein said structure is formed on a substrate comprised of a multi-layered ceramic having a pattern of a plurality of spaced and interconnected conductive planes and including a patterned conductive plane on the surface of said substrate adjacent to said structure with portions thereof selectively exposed by said vias and forming a conductive second pattern on said structure including conductive interconnections in said vias.
Claim 5
Dependent Claim
65 words
The method of claim 3 including coating said structure with a second structure selected from the group consisting of glass and glass-ceramices forming a second set of vias having a stepped-shouldered counter-bored configuration in said second structure extending to selected portions of said conductive second pattern; and forming a conductive third pattern on said second structure including conductive interconnection in said second set of vias.
Claim 6
Dependent Claim
57 words
The method of claim 4 further comprising the steps of coating said second structure with subsequent structures, forming sets of vias in each of said subsequent structures in accordance with claim 1, said sets of vias extending to conductive patterns on the structures below each subsequent structure, and forming conductive interconnection in each subsequent set of vias.
Claim 7
Dependent Claim
12 words
The method of claim 3 wherein said glass is a borosilicate glass.
Claim 8
Dependent Claim
69 words
The method of claim 1 wherein said structure is formed on a substrate comprised of a multi-layered glass-ceramic having a pattern of a plurality of spaced and interconnected conductive planes, and including a patterned conductive plane on the surface of said substrate adjacent to said structure with portions thereof selectively exposed by said vias; and forming a conductive second pattern on said structure including conductive interconnections in said vias.
Claim 9
Independent Claim
58 words
A method for forming vias in a a multi-component glass structure consisting of: defining a pattern of desired via locations on one surface of said structure; ablating vias by directing ultraviolet radiation from an ultraviolet laser onto said pattern of desired via locations; said vias being ablatively photodecomposed through the top of said structure to a predetermined depth.
Claim 10
Independent Claim
58 words
A method for forming vias in a a multi-component glass structure consisting of: defining a pattern of desired via locations on one surface of said structure; ablating vias by directing ultraviolet radiation from an ultraviolet laser onto said pattern of desired via locations; said vias being ablatively photodecomposed through the top of said structure to a predetermined depth.
Claim 11
Dependent Claim
35 words
The method of claim 8 wherein said via locations are defined by masking said structure by superimposing over said structure an inert mask having a pattern of apertures therethrough; said apertures defining the desired pattern.
Claim 12
Dependent Claim
51 words
The method of claim 9 wherein the ablating of said vias by said ultraviolet laser is partial such that vias are ablated through the top of said structure in the areas opposite said mask apertures, with the bottom of said vias spaced a distance from the opposing surface of said structure.
Claim 13
Dependent Claim
65 words
The method of claim 10 wherein subsequent to said partial ablation step, said mask is replaced by a second mask having a pattern of secondary apertures extending therethrough, said pattern of secondary apertures being concentric with the apertures of the mask used in said partial ablation step, said second pattern of apertures being substantially smaller than the pattern of apertures in said partial ablation mask.
Claim 14
Dependent Claim
31 words
The method of claim 11 further comprising the step of ablating through said structure at areas opposite said secondary apertures in said second mask, forming vias having stepped-shoulder counter bored configurations.
Claim 15
Dependent Claim
24 words
The method of claim 12 wherein said structure is formed on a dissimilar substrate, and said vias are formed to extend to said substrate.
Claim 16
Dependent Claim
21 words
The method of claim 8 wherein said vias are ablated by directing radiating said ultraviolet laser upon and through said structure.
Claim 17
Independent Claim
14 words
The method of claims 9 or 14 wherein said structure is a borosilicate glass.
Claim 18
Dependent Claim
28 words
The method of claim 15 including coating said multi-component glass structure with a second multi-component glass structure and; forming a second set of vias in said second structure.
Claim 19
Dependent Claim
24 words
The method of claim 8 wherein said structure is formed on a dissimilar substrate, and said vias are formed to extend to said substrate.
Claim 20
Independent Claim
71 words
The method of claims 17 or 13 wherein said structure is formed on a substrate comprised of a multi-layered ceramic having a pattern of a plurality of spaced and interconnected conductive planes and including a patterned conductive plane on the surface of said substrate adjacent to said structure, with portions thereof selectively exposed by said vias and forming a conductive second pattern on said structure including conductive interconnections in said vias.
Claim 21
Independent Claim
71 words
The method of claims 17 or 13 wherein said structure is formed on a substrate comprised of a multi-layered glass-ceramic having a pattern of a plurality of spaced and interconnected conductive planes and including a patterned conductive plane on the surface of said substrate adjacent to said structure, with portions thereof selectively exposed by said vias and forming a conductive second pattern on said structure including conductive interconnections in said vias.
Claim 22
Dependent Claim
56 words
The method of claim 18 including coating said multi-component glass structure with a second multi-component glass structure and forming a second set of vias in said second structure, extending to selected portions of said conductive second pattern; and forming a conductive third pattern on said second structure including conductive interconnection in said second set of vias.
Claim 23
Dependent Claim
60 words
The method of claim 18 including coating said multi-component glass structure with a second multi-component glass structure and forming a second set of vias having a stepped-shouldered counter-bored configuration in said second structure extending to selected portions of said conductive second pattern; and forming a conductive third pattern on said second structure conductive interconnection in said second set of vias.
Claim 24
Dependent Claim
56 words
The method of claim 19 including coating said multi-component glass structure with a second multi-component glass structure and forming a second set of vias in said second structure, extending to selected portions of said conductive second pattern; and forming a conductive third pattern on said second structure including conductive interconnection in said second set of vias.
Claim 25
Dependent Claim
61 words
The method of claim 19 including coating said multi-component glass structure with a second multi-component glass structure and forming a second set of vias having a stepped-shouldered counter-bored configuration in said second structure extending to selected portions of said conductive second pattern; and forming a conductive third pattern on said second structure, including conductive interconnection in said second set of vias.
Claim 26
Dependent Claim
56 words
The method of claim 23 further comprising the steps of coating said second multi-component glass structure with subsequent multi-component glass structures, forming sets of vias in each of said subsequent structures, said sets of vias extending to conductive patterns on the structures below each subsequent structure, and forming conductive interconnection in each subsequent set of vias.
Claim 27
Independent Claim
123 words
A method for forming vias in a multi-component glass structure comprising: masking said structure by superimposing over said structure an inert mask having a pattern of apertures therethrough; said apertures defining the desired pattern; partially ablating vias by directing ultraviolet radiation from an ultraviolet laser onto said pattern of apertures; replacing said mask with a second mask having a pattern of secondary apertures extending therethrough, said pattern of secondary apertures being concentric with the apertures of the mask used in said partial ablation step, said second pattern of apertures being substantially smaller than the pattern of apertures in said partial ablation mask; ablating through said structure at areas opposite said secondary apertures in said second mask, forming vias having stepped-shoulder counter bored configurations.
Claim 28
Independent Claim
123 words
A method for forming vias in a multi-component glass structure comprising: masking said structure by superimposing over said structure an inert mask having a pattern of apertures therethrough; said apertures defining the desired pattern; partially ablating vias by directing ultraviolet radiation from an ultraviolet laser onto said pattern of apertures; replacing said mask with a second mask having a pattern of secondary apertures extending therethrough, said pattern of secondary apertures being concentric with the apertures of the mask used in said partial ablation step, said second pattern of apertures being substantially smaller than the pattern of apertures in said partial ablation mask; ablating through said structure at areas opposite said secondary apertures in said second mask, forming vias having stepped-shoulder counter bored configurations.
Claim 29
Dependent Claim
26 words
The method of claim 25, wherein said multi-component glass structure is formed on a dissimilar substrate, and said vias are formed to extend to said substrate.
Claim 30
Dependent Claim
71 words
The method of claim 26 wherein said multi-component glass structure is formed on a substrate comprised on a multi-layered ceramic having a pattern of a plurality of spaced and interconnected conductive planes and including a patterned conductive plane on the surface of said substrate adjacent to said structure, with portions thereof selectively exposed by said vias and forming a conductive second pattern on said structure including conductive interconnections in said vias.
Claim 31
Dependent Claim
71 words
The method of claim 27 wherein said multi-component glass structure is formed on a substrate comprised of a multi-layered glass-ceramic having a pattern of a plurality of spaced and interconnected conductive planes and including a patterned conductive plane on the surface of said substrate adjacent to said structure, with portions thereof selectively exposed by said vias and forming a conductive second pattern on said structure including conductive interconnections in said vias.
Claim 32
Dependent Claim
56 words
The method of claim 28 including coating said multi-component glass structure with a second multi-component glass structure and forming a second set of vias in said second structure, extending to selected portions of said conductive second pattern; and forming a conductive third pattern on said second structure including conductive interconnection in said second set of vias.
Claim 33
Dependent Claim
60 words
The method of claim 29 including coating said multi-component glass structure with a second multi-component glass structure and forming a second set of vias having a stepped-shouldered counter-bored configuration in said second structure extending to selected portions of said conductive second pattern; and forming a conductive third pattern on said second structure conductive interconnection in said second set of vias.
Claim 34
Dependent Claim
56 words
The method of claim 30 further comprising the steps of coating said second multi-component glass structure with subsequent multi-component glass structures, forming sets of vias in each of said subsequent structures, said sets of vias extending to conductive patterns on the structures below each subsequent structure, and forming conductive interconnection in each subsequent set of vias.
Claim 35
Dependent Claim
12 words
The method of claim 7 wherein said glass is a borosilicate glass.
Claim 36
Dependent Claim
18 words
The method of claim 4 wherein the first said and said second structures are comprised of borosilicate glass.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1989-11-10 | 1990-05-12 | 1990-11-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1993-11-10 | 1994-05-12 | 1994-11-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1997-11-10 | 1998-05-12 | 1998-11-11 | $7700.00 | Window Closed / Lapsed |