Non-destructive testing of semiconductors using acoustic wave method

Claim 1

A contactless method of measuring at least one surface property of a first surface of a semiconductor material using an electrically conductive interdigital transducer and a metal film on the surface of a piezoelectric material, the metal film having a window therein exposing the piezoelectric material surface, comprising: placing the first surface of the semiconductor material on the metal film having a window therein so that the first surface of the semiconductor material is exposed through the window and is facing the exposed piezoelectric material; applying an rf pulse to the transducer to generate a surface acoustic wave, the surface acoustic wave producing an electric field perpendicular to the first surface which in turn produces transverse acoustic electric voltage in the semiconductor material adjacent its first surface; applying a dc voltage between a second surface of the semiconductor material spaced from said first surface thereof, and the metal film on the piezoelectric material which has the window, to change a surface potential of the first surface; and plotting a characteristic curve of the transverse acoustoelectric voltage versus the dc voltage which characteristic curve can be utilized to measure the at least one surface property.

Claim 4

A device for measuring at least one surface property of a first surface of a semiconductor material comprising: a layer of piezoelectric material having a surface; an interdigital transducer made of electrically conducting mateial disposed on the surface of the piezoelectric material; a layer of thin metal film on the surface of the piezoelectric material defining a window exposing at least a portion of the surface of the piezoelectric material, the metal film being out of contact with said transducer; a wafer of semiconductor material having the first surface for which the at least one surface property is to be measured, disposed over said window with the first surface of the wafer facing the exposed surface of the piezoelectric material, the wafer having a second opposite surface; a conductive electrode adjacent said second surface of said wafer; a ground connection connected to said metal film; an rf pulse generator connected to said interdigital transducer for providing a pulse of rf energy to said interdigital transducer to produce a surface acoustic wave in the piezoelectric material which propagates across said piezoelectric material surface and said window to produce a perpendicular electric field which extends into the first surface of said wafer; dc voltage means having one terminal connected to ground connection of said metal film on the piezoelectric surface and an other terminal connected to said conductive electrode on the second surface of said wafer for producing a dc voltage to alter a surface potential at the first surface of said wafer; voltage measuring means connected to said dc voltage means for measuring the dc voltage; and transverse acoustical electric voltage measuring means for measuring the transverse acoustical electrical voltage across the semiconductor wafer.

Claim 5

A device for measuring at least one surface property of a first surface of a semiconductor material comprising: a layer of piezoelectric material having a surface; an interdigital transducer made of electrically conducting mateial disposed on the surface of the piezoelectric material; a layer of thin metal film on the surface of the piezoelectric material defining a window exposing at least a portion of the surface of the piezoelectric material, the metal film being out of contact with said transducer; a wafer of semiconductor material having the first surface for which the at least one surface property is to be measured, disposed over said window with the first surface of the wafer facing the exposed surface of the piezoelectric material, the wafer having a second opposite surface; a conductive electrode adjacent said second surface of said wafer; a ground connection connected to said metal film; an rf pulse generator connected to said interdigital transducer for providing a pulse of rf energy to said interdigital transducer to produce a surface acoustic wave in the piezoelectric material which propagates across said piezoelectric material surface and said window to produce a perpendicular electric field which extends into the first surface of said wafer; dc voltage means having one terminal connected to ground connection of said metal film on the piezoelectric surface and an other terminal connected to said conductive electrode on the second surface of said wafer for producing a dc voltage to alter a surface potential at the first surface of said wafer; voltage measuring means connected to said dc voltage means for measuring the dc voltage; and transverse acoustical electric voltage measuring means for measuring the transverse acoustical electrical voltage across the semiconductor wafer.