High density chip socket

Claim 1

An interconnection device comprising: a socket body formed of electrically insulative material, the body having a top portion and a bottom wall, a generally planar seating surface formed in the top portion, the surface extending in an X and Y direction, a pattern of recesses formed in the body extending from the seating surface to the bottom wall, a respective pin receiving aperture formed in the bottom wall in communication with each recess, an electrically conductive coiled contact spring having first and second ends received in each recess with the first end seated on the bottom wall, an electrically conductive pin extending from the first end of each contact spring through a respective aperture, the second end of the contact spring in its at rest position extending above the planar seating surface in a Z direction, a generally plate like module having a plurality of electrically conductive pads formed on a bottom surface of the module, the pads arranged in a pattern matching that of the recesses, the module receivable on the generally planar seating surface, reference surface means to assure proper location of the module relative to the socket body so that the pattern of electrically conductive pads is aligned with the pattern of recesses, and means to lock the module tightly against the planar seating surface with the springs depressed and in electrically conductive relationship with the pads, characterized in that the coiled springs are conical in configuration, the first end of the coiled springs forming the base of the conical configuration and being closely conformed to the wall surfaces defining the recesses in which the springs are received, whereby movement of the contact springs is limited essentially to the Z direction for greater accuracy in alignment of the contact springs with the conductive pads.