Method of manufacturing semiconductor device having a pressure sensor

Claim 1

In a method of manufacturing a semiconductor device wherein diffused resistors for a pressure sensor are formed in a front surface of a semiconductor crystal body, a rear surface of which is thereafter etched partly so as to put a part of the body into a membrane portion; a method of manufacturing a semiconductor device having a pressure sensor characterized in that, in advance of the etching step, a buried layer which has an impurity concentration higher than that of the semiconductor body and which has the gradient of the impurity concentration is provided in said semiconductor body, whereupon said body is partly etched from its rear surface while an etching rate is being controlled by the high concentration buried layer.

Claim 7

A method of manufacturing a semiconductor device having a pressure sensor and at least one active element, comprising the steps of: (1) preparing a first conductivity type semiconductor substrate which has first and second major surfaces; (2) introducing a first conductivity type impurity into selected parts of said first major surface, to form first and second buried layers which are isolated from each other; (3) introducing a second conductivity type impurity into selected parts of said first major surface, to form a third buried layer which overlies said first buried layer and which is broader than said first buried layer and a fourth buried layer which is spaced from said third buried layer; (4) forming a second conductivity type semiconductor layer on said first major surface by epitaxial growth; (5) introducing the first conductivity type impurity into the selected part of the front surface of said semiconductor layer, to form an isolation semiconductor region which reaches said second buried layer; (6) introducing the first conductivity type impurity into selected parts of the major surface of said semiconductor layer which is surrounded with said first semiconductor region and which is located over said first buried layer, to form a plurality of semiconductor resistor layers which are used as said pressure sensor; (7) introducing the first conductivity type impurity into selected parts of said major surface of said semiconductor layer which is located over said fourth buried layer, to form semiconductor regions which are used as said active element; (8) forming metal wiring layers which are connected to said semiconductor resistor layers and the active element semiconductor regions; and (9) etching said semiconductor substrate selectively from said second major surface so as to reach said first buried layer, to form a diaphragm.

Claim 8

A method of manufacturing a semiconductor device having a pressure sensor and at least one active element, comprising the steps of: (1) preparing a first conductivity type semiconductor substrate which has first and second major surfaces; (2) introducing a first conductivity type impurity into selected parts of said first major surface, to form first and second buried layers which are isolated from each other; (3) introducing a second conductivity type impurity into selected parts of said first major surface, to form a third buried layer which overlies said first buried layer and which is broader than said first buried layer and a fourth buried layer which is spaced from said third buried layer; (4) forming a second conductivity type semiconductor layer on said first major surface by epitaxial growth; (5) introducing the first conductivity type impurity into the selected part of the front surface of said semiconductor layer, to form an isolation semiconductor region which reaches said second buried layer; (6) introducing the first conductivity type impurity into selected parts of the major surface of said semiconductor layer which is surrounded with said first semiconductor region and which is located over said first buried layer, to form a plurality of semiconductor resistor layers which are used as said pressure sensor; (7) introducing the first conductivity type impurity into selected parts of said major surface of said semiconductor layer which is located over said fourth buried layer, to form semiconductor regions which are used as said active element; (8) forming metal wiring layers which are connected to said semiconductor resistor layers and the active element semiconductor regions; and (9) etching said semiconductor substrate selectively from said second major surface so as to reach said first buried layer, to form a diaphragm.