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US4618389A
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Process for bonding heat curable silicone rubber to a substrate using an aqueous primer composition
Assignee: Wacker Chemical Corp
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Filing: 1985-01-14
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Granted: 1986-10-21
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Expires: 2005-01-14
Abstract
Abstract A process for bonding heat curable silicone rubber to a variety of substrates using an aqueous primer composition containing an alkenyltrihydrocarbonoxysilane and an aqueous miscible solvent selected from the group consisting of aliphatic alcohols, glycol ethers, ketones and esters.
Inventors
- 👤 Michael K. Agodoa
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 03:17
CPC Classifications
C; C08; C08J; C08J5/00; C08J5/12; C09; C09D; C09D4/00; C08J2383/00; C08J2383/04; Y; Y10; Y10T; Y10T428/00; Y10T428/31504; Y10T428/31652; Y10T428/31663
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
209 words
An improved method for bonding a heat curable silicone rubber composition to a substrate which comprises applying a heat curable silicone rubber composition to a substrate and thereafter curing the silicone rubber composition at an elevated temperature, the improvement which comprises coating the substrate prior to the application of the silicone rubber composition with an aqueous primer composition consisting essentially of from 0.5 to 20 percent by weight based on the weight of the primer composition of an 1 alkenyltrihydrocarbonoxysilane having the formula RSi[(OR").sub.n OR'].sub.3 where R is an alkenyl radical having from 2 to 6 carbon atoms, R' is a monovalent hydrocarbon radical having from 1 to 10 carbon atoms, R" is a divalent hydrocarbon radical having from 1 to 6 carbon atoms and n is a number of from 0 to 4, an aqueous miscible solvent which is present in an amount of from 10 to 25 percent by weight based on the weight of the aqueous primer composition and having a boiling point up to 180° C., water in an amount of from 55 to 82 percent based on the weight of the aqueous primer composition and an organic acid in an amount sufficient to provide a pH below 7, and thereafter drying the coated substrate.
Claim 2
Dependent Claim
209 words
An improved method for bonding a heat curable silicone rubber composition to a substrate which comprises applying a heat curable silicone rubber composition to a substrate and thereafter curing the silicone rubber composition at an elevated temperature, the improvement which comprises coating the substrate prior to the application of the silicone rubber composition with an aqueous primer composition consisting essentially of from 0.5 to 20 percent by weight based on the weight of the primer composition of an 1 alkenyltrihydrocarbonoxysilane having the formula RSi[(OR").sub.n OR'].sub.3 where R is an alkenyl radical having from 2 to 6 carbon atoms, R' is a monovalent hydrocarbon radical having from 1 to 10 carbon atoms, R" is a divalent hydrocarbon radical having from 1 to 6 carbon atoms and n is a number of from 0 to 4, an aqueous miscible solvent which is present in an amount of from 10 to 25 percent by weight based on the weight of the aqueous primer composition and having a boiling point up to 180° C., water in an amount of from 55 to 82 percent based on the weight of the aqueous primer composition and an organic acid in an amount sufficient to provide a pH below 7, and thereafter drying the coated substrate.
Claim 3
Dependent Claim
12 words
The improved method of claim 1, wherein n is equal to 0.
Claim 4
Dependent Claim
28 words
The improved method of claim 1, wherein the aqueous miscible solvent is selected from aliphatic alcohols having from 1 to 4 carbon atoms, glycol ethers, ketones and esters.
Claim 5
Dependent Claim
23 words
The improved method of claim 1, wherein the heat curable silicone rubber composition contains an organopolysiloxane gum, filler and a peroxide curing agent.
Claim 6
Dependent Claim
53 words
The improved method of claim 1, wherein the silicone rubber composition contains an organopolysiloxane having at least two SiC-bonded aliphatically unsaturated groups per molecule, an organosilicon compound having at least three Si-bonded hydrogen atoms per molecule and a catalyst which promotes the addition of the Si-bonded hydrogen to the SiC-bonded aliphatically unsaturated groups.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1989-10-20 | 1990-04-21 | 1990-10-21 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1993-10-20 | 1994-04-21 | 1994-10-21 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1997-10-20 | 1998-04-21 | 1998-10-21 | $7700.00 | Window Closed / Lapsed |