Formaldehyde-free autocatalytic electroless copper plating

Claim 2

In a composition for the electroless deposition of copper comprising in aqueous alkaline medium, a source of copper ions, an effective amount of a complexor to keep the copper ions in solution and a reducing agent; the improvement comprising, as said reducing agent, a source of glyoxylate ions, the amounts of complexor and glyoxylate being sufficient to allow copper deposition from the composition, with the proviso that, the complexor is capable of forming a complex with copper which is stronger than a copper-oxalate complex and when the complexor is tartrate, the molar ratio of tartrate to copper is at least 6:1.

Claim 3

A composition as claimed in claim 1, wherein the source of copper is a soluble copper salt that is compatible with the composition.

Claim 4

A composition as claimed in claim 1, wherein the source of copper provides a concentration of copper within the range of from 0.5 to 40 g/l (0.0078 to 0.63 molar).

Claim 5

A composition as claimed in claim 1, wherein the complexor is one of the following general formulae: ##STR4## where R is an alkyl group having from two to four carbon atoms, R 1 is a lower alkylene radical and n is a positive integer.

Claim 6

A composition as claimed in claim 1, wherein the complexor is EDTP or EDTA.

Claim 7

A composition as claimed in claim 1, wherein the molar ratio of copper ion to complexor concentrations falls within the range of from 1:0.7 up to the limit of solubility of the complexor.

Claim 8

A composition as claimed in claim 1, wherein hydroxyl ions are present to maintain an alkaline pH above 10.5.

Claim 9

A composition as claimed in claim 1, wherein the source of glyoxylate ions is glyoxylic acid, dihydroxy acetic acid, a dihaloacetic acid, the bisulphite adduct of glyoxylic acid.

Claim 10

A composition as claimed in claim 1, wherein the source of glyoxylate ions is present in such an amount that the available glyoxylic acid will be present in the bath in an amount of from 0.01 to 1.5 molar.

Claim 11

A composition as claimed in claim 1, comprising at least one plating rate controller, stabiliser or mixtures thereof.

Claim 12

In a process for the electroless deposition of copper on a substrate, the process comprising contacting the substrate with a composition comprising, in aqueous alkaline medium, a source of copper ions, an effective amount of a complexor to keep the copper ions in solution, and a reducing agent; the improvement comprising, as said reducing agent, a source of glyoxylate ions, the amounts of complexor and glyoxylate being sufficient to allow copper deposition from the composition, with the proviso that, the complexor is capable of forming a complex with copper which is stronger than a copper-oxalate complex and when the complexor is tartrate, the molar ratio of tartrate to copper is at least 6:1.

Claim 13

In a process for the electroless deposition of copper on a substrate, the process comprising contacting the substrate with a composition comprising, in aqueous alkaline medium, a source of copper ions, an effective amount of a complexor to keep the copper ions in solution, and a reducing agent; the improvement comprising, as said reducing agent, a source of glyoxylate ions, the amounts of complexor and glyoxylate being sufficient to allow copper deposition from the composition, with the proviso that, the complexor is capable of forming a complex with copper which is stronger than a copper-oxalate complex and when the complexor is tartrate, the molar ratio of tartrate to copper is at least 6:1.

Claim 14

A process as claimed in claim 11, wherein the complexor is one of the following general formulae: ##STR5## where R is an alkyl group having from two to four carbon atoms, R 1 is a lower alkylene radical and n is a positive integer.

Claim 15

A process as claimed in claim 11, which is carried out at a temperature of from 20° to 85° C.

Claim 16

A process as claimed in claim 11, wherein the composition is agitated during use.

Claim 17

A process as claimed in claim 14, wherein the agitation is air agitation.

Claim 18

A process as claimed in claim 11, wherein the substrate is sensitized prior to the deposition of electroless copper on it.

Claim 19

A process as claimed in claim 16, wherein the sensitization is achieved by the adsorption of a catalysing metal onto the surface of the substrate.

Claim 22

A method as claimed in claim 18, wherein one or more plating rate controllers, stabilisers or mixtures thereof are also added.

Claim 23

A substrate which has been plated with copper by a process as claimed in claim 11.