Patent US4617097A successfully refreshed from Google Patents.
← Back to Patent Explorer
US4617097A Expired / Lapsed US ⏱️ 0.0 years remaining

Process and electrolyte for electroplating tin, lead or tin-lead alloys

Assignee: Shipley Co Inc
•
Filing: 1985-09-20
•
Granted: 1986-10-14
•
Expires: 2005-09-20
📄 Original PDF 🌐 Google Patents 🔄 Sync Now

Abstract

Abstract A process and bath for electroplating tin, lead and tin-lead alloys. Improved brightness, solderability and broader current density ranges are achieved by the use in the baths of a soluble alkylene oxide condensate to provide a cloud point of the bath above about 90° F., a soluble bismuth compound, an aromatic aldehyde and acetaldehyde. Tin and lead are supplied to the bath as salts of alkyl or alkylol sulfonic acids with sufficient free alkyl or alkylol sulfonic acid to provide a bath pH of less than 3.

Inventors

  • 👤 Fred I. Nobel
  • 👤 Barnet D. Ostrow
  • 👤 David N. Schram

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-04 08:49
CPC Classifications
C; C25; C25D; C25D3/00; C25D3/02; C25D3/56; C25D3/30; C25D3/32; C25D3/34; C25D3/36; C25D3/60; H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3465; H05K3/3473

Claims Analysis

Total Claims: 24
Claim 1
Independent Claim 143 words
A method for preparing an electrolyte for electroplating tin, lead or tin-lead alloys which comprises: adding to a suitable solvent a predetermined amount of a soluble divalent tin compound, a soluble divalent lead compound, or both, and a soluble alkyl or alkylol sulfonic acid in an amount sufficient to provide a solution having a pH of less than about 3; adding to said solution, a sufficient amount of a soluble alkylene oxide condensate compound having at least about 8 moles of alkylene oxide to provide an electrolyte having a cloud point above about 90° F. to improve the cathode efficiency during electroplating and to produce tin, lead or tin-lead alloy electrodeposits having good solderability; and adding to said solution a sufficient amount of a soluble bismuth compound to improve the low current density range for electroplating or the brightness of the resultant electrodeposits.
Claim 2
Independent Claim 143 words
A method for preparing an electrolyte for electroplating tin, lead or tin-lead alloys which comprises: adding to a suitable solvent a predetermined amount of a soluble divalent tin compound, a soluble divalent lead compound, or both, and a soluble alkyl or alkylol sulfonic acid in an amount sufficient to provide a solution having a pH of less than about 3; adding to said solution, a sufficient amount of a soluble alkylene oxide condensate compound having at least about 8 moles of alkylene oxide to provide an electrolyte having a cloud point above about 90° F. to improve the cathode efficiency during electroplating and to produce tin, lead or tin-lead alloy electrodeposits having good solderability; and adding to said solution a sufficient amount of a soluble bismuth compound to improve the low current density range for electroplating or the brightness of the resultant electrodeposits.
Claim 3
Dependent Claim 29 words
The method of claim 1 which further comprises adding to said electrolyte a sufficient amount of an aromatic aldehyde to improve the brightness of the deposit produced by electroplating.
Claim 4
Dependent Claim 25 words
The method of claim 2 which further comprises adding to said electrolyte a sufficient amount of acetaldehyde to improve the high current density electroplating range.
Claim 5
Dependent Claim 47 words
A method for electroplating tin, lead, or tin-lead alloys upon a substrate which comprises: preparing an electrolyte according to the method of claim 3; immersing at least a portion of a substrate into said electrolyte; and electroplating a predetermined tin, lead, or tn-lead alloy upon said substrate.
Claim 6
Dependent Claim 47 words
A method for electroplating tin, lead, or tin-lead alloys upon a substrate which comprises: preparing an electrolyte according to the method of claim 2; immersing at least a portion of a substrate into said electrolyte; and electroplating a predetermined tin, lead, or tin-lead alloy upon said substrate.
Claim 7
Dependent Claim 25 words
The method of claim 1 which further comprises adding to said electrolyte a sufficient amount of acetaldehyde to improve the high current density electroplating range.
Claim 8
Dependent Claim 47 words
A method for electroplating tin, lead, or tin-lead alloys upon a substrate which comprises: preparing an electrolyte according to the method of claim 6; immersing at least a portion of a substrate into said electrolyte; and electroplating a predetermined tin, lead, or tin-lead alloy upon said substrate.
Claim 9
Dependent Claim 47 words
A method for electroplating tin, lead, or tin-lead alloys upon a substrate which comprises: preparing an electrolyte according to the method of claim 1; immersing at least a portion of a substrate into said electrolyte; and electroplating a predetermined tin, lead, or tin-lead alloy upon said substrate.
Claim 10
Dependent Claim 101 words
An electrolyte for electroplating tin, lead, or tin-lead alloys which comprises: a soluble divalent tin compound, a soluble divalent lead compound, or both; a soluble alkyl or alkylol sulfonic acid in an amount sufficient to provide a solution having a pH less than about 3; a sufficient amount of a solution soluble alkylene oxide condensate compound having at least about 8 moles of alkylene oxide to provide an electrolyte having a cloud point above about 90° F.; and a soluble bismuth compound in a sufficient amount to extend the current density range for electroplating or the brightness of the resultant electrodeposits.
Claim 11
Dependent Claim 101 words
An electrolyte for electroplating tin, lead, or tin-lead alloys which comprises: a soluble divalent tin compound, a soluble divalent lead compound, or both; a soluble alkyl or alkylol sulfonic acid in an amount sufficient to provide a solution having a pH less than about 3; a sufficient amount of a solution soluble alkylene oxide condensate compound having at least about 8 moles of alkylene oxide to provide an electrolyte having a cloud point above about 90° F.; and a soluble bismuth compound in a sufficient amount to extend the current density range for electroplating or the brightness of the resultant electrodeposits.
Claim 12
Dependent Claim 10 words
The electrolyte of claim 9 further comprising an aromatic aldehyde.
Claim 13
Dependent Claim 8 words
The electrolyte of claim 10 further comprising acetaldehyde.
Claim 14
Dependent Claim 37 words
A method for electroplating tin, lead, or tin-lead alloys which comprises: immersing at least a portion of a substrate into the electrolyte of claim 11; and electroplating a predetermined tin, lead or tin-lead alloy upon said substrate.
Claim 15
Dependent Claim 37 words
A method for electroplating tin, lead, or tin-lead alloys which comprises: immersing at least a portion of a substrate into the electrolyte of claim 10; and electroplating a predetermined tin, lead or tin-lead alloy upon said substrate.
Claim 16
Dependent Claim 8 words
The electrolyte of claim 10 further comprising acetaldehyde.
Claim 17
Dependent Claim 37 words
A method for electroplating tin, lead, or tin-lead alloys which comprises: immersing at least a portion of a substrate into the electrolyte of claim 14; and electroplating a predetermined tin, lead or tin-lead alloy upon said substrate.
Claim 18
Dependent Claim 37 words
A method for electroplating tin, lead, or tin-lead alloys which comprises: immersing at least a portion of a substrate into the electrolyte of claim 9; and electroplating a predetermined tin, lead or tin-lead alloy upon said substate.
Claim 19
Independent Claim 154 words
A method for preparing an electrolyte for electroplating tin, lead or tin-lead alloys which comprises: adding to a suitable solvent a predetermined amount of a soluble divalent tin compound, a soluble divalent lead compound, or both, and a soluble alkyl or alkylol sulfonic acid in an amount sufficient to provide a solution having a pH of less than about 3; adding to said solution, a sufficient amount of a soluble alkylene oxide condensate compound having at least about 8 moles of alkylene oxide to provide an electrolyte having a cloud point above about 90° F. to improve the cathode efficiency during electroplating and to produce tin, lead or tin-lead alloy electrodeposits having good solderability; adding to said solution a sufficient amount of an aromatic aldehyde to improve the brightness of the deposit produced by electroplating; and adding to said solution a sufficient amount of acetaldehyde to improve the high current density range for electroplating.
Claim 20
Independent Claim 154 words
A method for preparing an electrolyte for electroplating tin, lead or tin-lead alloys which comprises: adding to a suitable solvent a predetermined amount of a soluble divalent tin compound, a soluble divalent lead compound, or both, and a soluble alkyl or alkylol sulfonic acid in an amount sufficient to provide a solution having a pH of less than about 3; adding to said solution, a sufficient amount of a soluble alkylene oxide condensate compound having at least about 8 moles of alkylene oxide to provide an electrolyte having a cloud point above about 90° F. to improve the cathode efficiency during electroplating and to produce tin, lead or tin-lead alloy electrodeposits having good solderability; adding to said solution a sufficient amount of an aromatic aldehyde to improve the brightness of the deposit produced by electroplating; and adding to said solution a sufficient amount of acetaldehyde to improve the high current density range for electroplating.
Claim 21
Dependent Claim 47 words
A method for electroplating tin, lead, or tin-lead alloys upon a substrate which comprises: preparing an electrolyte according to the method of claim 17; immersing at least a portion of a substrate into said electrolyte; and electroplating a predetermined tin lead, or tin-lead alloy upon said substrate.
Claim 22
Dependent Claim 111 words
An electrolyte for electroplating tin, lead, or tin-lead alloys which comprises: a soluble divalent tin compound, a soluble divalent lead compound, or both; a soluble alkyl or alkylol sulfonic acid in an amount sufficient to provide a solution having a pH less than about 3; a sufficient amount of a solution soluble alkylene oxide condensate compound having at least about 8 moles of alkylene oxide to provide an electrolyte having a cloud point above about 90° F.; an aromatic aldehyde in a sufficient amount to improve the brightness of the deposit produced by electroplating; and acetaldehyde in a sufficient amount to extend the high current density range for producing bright deposits.
Claim 23
Dependent Claim 111 words
An electrolyte for electroplating tin, lead, or tin-lead alloys which comprises: a soluble divalent tin compound, a soluble divalent lead compound, or both; a soluble alkyl or alkylol sulfonic acid in an amount sufficient to provide a solution having a pH less than about 3; a sufficient amount of a solution soluble alkylene oxide condensate compound having at least about 8 moles of alkylene oxide to provide an electrolyte having a cloud point above about 90° F.; an aromatic aldehyde in a sufficient amount to improve the brightness of the deposit produced by electroplating; and acetaldehyde in a sufficient amount to extend the high current density range for producing bright deposits.
Claim 24
Dependent Claim 37 words
A method for electroplating tin, lead or tin-lead alloys which comprises: immersing at least a portion of a substrate into the electrolyte of claim 19; and electroplating a predetermined tin, lead or tin-lead alloy upon said substrate.

References Cited (Backward Citations)

GB555929A Cited
US2525942A Cited
US3663384A Cited
US3905878A Cited
US4000047A Cited
DD122265A1 Cited
US4132610A Cited
US4388158A Cited
US4384930A Cited
US4459185A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1989-10-13 1990-04-14 1990-10-14 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1993-10-13 1994-04-14 1994-10-14 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1997-10-13 1998-04-14 1998-10-14 $7700.00 Window Closed / Lapsed

Assigned Categories & Tags

No categories assigned to this patent yet.

Assign Category Tag