Apparatus for the cooling of electronic assemblies or components

Claim 2

Apparatus for the cooling of electronic assemblies or components arranged in slide-in circuits located one above the other in a rack, the apparatus of the type including means for providing a cooling air supply to the individual slide-in circuits from their respective underside, the air leaving the respective slide-in circuit as warm air after having been heated therein, the apparatus comprising: an underside and at least one side of the rack and the back of the rack configured to form a channel arrangement, the channel arrangement is connected to receive the cooling air supply communicating with a port provided on the rack underside and which is also in communication with the open undersides of all slide-in circuits for the uptake of cooling air; and the channel arrangement comprising channels individually leading from the cooling air supply to the underside of the individual slide-in circuits.

Claim 3

Apparatus for the cooling of electronic assemblies or components arranged in slide-in circuits located one above the other in a rack, the apparatus of the type including means for providing a cooling air supply to the individual slide-in circuits from their respective underside, the air leaving the respective slide-in circuit as warm air after having been heated therein, the apparatus comprising: an underside and at least one side of the rack and the back of the rack configured to form a channel arrangement, the channel arrangement is connected to receive the cooling air supply communicating with a port provided on the rack underside and which is also in communication with the open undersides of all slide-in circuits for the uptake of cooling air; the channel arrangement serving at the same time to receive cables leading both from and to the slide-in circuits; and the channel arrangement comprising channels individually leading from the cooling air supply to the undersides of the individual slide-in circuits.

Claim 4

Apparatus for the cooling of electronic assemblies or components arranged in slide-in circuits located one above the other in a rack, the apparatus of the type including means for providing a cooling air supply to the individual slide-in circuits from their respective underside, the air leaving the respective slide-in circuit as warm air after having been heated therein, the apparatus comprising: an underside and at least one side of the rack and the back of the rack configured to form a channel arrangement, the channel arrangement is connected to receive the cooling air supply communicating with a port provided on the rack underside and which is also in communication with the open undersides of all slide-in circuits for the uptake of cooling air; the channel arrangement serving at the same time to receive cables leading both from and to the slide-in circuits; and the channel arrangement comprising channels individually leading from the cooling air supply to the undersides of the individual slide-in circuits.

Claim 5

Apparatus according to claim 2, wherein all channels have substantially equal cross-sectional areas.

Claim 6

Apparatus according to claim 2, wherein the individual channels have cross-sectional areas corresponding to the cooling air requirement of the slide-in circuits connected therein.

Claim 7

Apparatus according to claim 2, characterized in that each slide-in compartment has two airtight side plates which are connected together by an airtight cover plate and by an airtight back plate.

Claim 8

Apparatus according to claim 2, characterized in that each slide-in compartment has on its top side an airtight cover plate extending obliquely upward.

Claim 9

Apparatus according to claim 2, characterized in that at least the cover plate of the respective slide-in compartment comprises a plastic material.

Claim 10

Apparatus according to claim 2, further comprising at least one blower is contained in the cooling air supply system.