US4612210A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Process for planarizing a substrate
Assignee: International Business Machines Corp
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Filing: 1985-07-25
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Granted: 1986-09-16
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Expires: 2005-07-25
Abstract
Abstract A surface coating of high glass temperature and superior mechanical properties along with excellent planarization and gap filling is used to coat substrates. The coating comprises a polyamide alkyl ester from a pyromellitic alkyl diester and a para-linked aromatic diamine dissolved in a solvent containing at least 10% of a co-solvent boiling above 220° C.
Inventors
- 👤 Donald C. Hofer
- 👤 Debra B. LaVergne
- 👤 Robert J. Twieg
- 👤 Willi Volksen
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-06 10:26
CPC Classifications
H; H10; H10P; H10P14/00; H10P14/60; H10P14/68; H10P14/683; H10P14/687; H10P14/63; H10P14/6326; H10P14/6342; Y; Y10; Y10T; Y10T428/00; Y10T428/31504; Y10T428/31721
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
68 words
A process for covering a substrate with a planarizing coating, said process comprising (1) dissolving in a solvent containing at least 10% of a co-solvent boiling above 220° C., a polyamide alkyl ester formed from a pyromellitic alkyl diester and a para-linked aromatic diamine, (2) coating the substrate with the resulting solution and (3) curing the coating into a planarized layer which fills the gaps in the substrate.
Claim 2
Dependent Claim
68 words
A process for covering a substrate with a planarizing coating, said process comprising (1) dissolving in a solvent containing at least 10% of a co-solvent boiling above 220° C., a polyamide alkyl ester formed from a pyromellitic alkyl diester and a para-linked aromatic diamine, (2) coating the substrate with the resulting solution and (3) curing the coating into a planarized layer which fills the gaps in the substrate.
Claim 3
Dependent Claim
15 words
A process as claimed in claim 1 wherein the high boiling co-solvent is N-cyclohexylpyrrolidone (NCHP).
Claim 4
Dependent Claim
17 words
A process as claimed in claim 1 wherein the polyamide alkyl ester is poly(4,4'-phenoxyphenylene pyromellitamide ethyl diester).
Claim 5
Dependent Claim
18 words
A process as claimed in claim 1 wherein the polyamide alkyl ester is poly(hexafluoroisopropylidine diphenoxyphenylene pyromellitamide ethyl diester).
Claim 6
Dependent Claim
15 words
A process as claimed in claim 1 in which the substrate is a semi-conductor chip.
Claim 7
Dependent Claim
15 words
A process as claimed in claim 1 in which the substrate is a silicon chip.
Claim 8
Dependent Claim
16 words
A process as claimed in claim 1 in which the substrate is a ceramic packaging module.
Claim 9
Dependent Claim
15 words
A process as claimed in claim 1 in which the polyamide alkyl ester is oligomeric.
References Cited (Backward Citations)
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1989-09-15 | 1990-03-17 | 1990-09-16 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1993-09-15 | 1994-03-17 | 1994-09-16 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1997-09-15 | 1998-03-17 | 1998-09-16 | $7700.00 | Window Closed / Lapsed |