Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
246 words
A method of manufacturing a semiconductor device comprising the steps of: (a) forming on a top surface of a semiconductor substrate of a first conductivity type an isolation film having a patterned hole, defining an active element region on the substrate, the side walls of said patterned hole being relatively thick; (b) forming a gate insulating film on said active element region of said substrate; (c) forming an electrically conductive layer over said top surface of said semiconductor substrate; (d) forming a first insulating layer on said conductive layer; (e) patterning said first insulating layer and conductive layer using a reactive ion etching process, thereby forming on said active element region a gate electrode with a first insulation film superposed thereon, the continuous side wall of said gate electrode and first insulation film being relatively thick; (f) implanting an impurity ion into said semiconductor substrate using said first insulating layer as a mask, thereby forming an impurity diffused region of a second conductivity type in said semiconductor substrate; (g) forming a second insulating layer over said top surface of said semiconductor substrate; (h) applying a reactive ion etching process to said second insulating layer, thereby forming a contact hole in said second insulating layer leading to said impurity diffused region, while leaving part of said second insulating layer on said side walls of said isolation film, gate electrode and first insulating layer; and (i) forming an electrically conductive film in contact with said impurity diffused region.
Claim 2
Independent Claim
246 words
A method of manufacturing a semiconductor device comprising the steps of: (a) forming on a top surface of a semiconductor substrate of a first conductivity type an isolation film having a patterned hole, defining an active element region on the substrate, the side walls of said patterned hole being relatively thick; (b) forming a gate insulating film on said active element region of said substrate; (c) forming an electrically conductive layer over said top surface of said semiconductor substrate; (d) forming a first insulating layer on said conductive layer; (e) patterning said first insulating layer and conductive layer using a reactive ion etching process, thereby forming on said active element region a gate electrode with a first insulation film superposed thereon, the continuous side wall of said gate electrode and first insulation film being relatively thick; (f) implanting an impurity ion into said semiconductor substrate using said first insulating layer as a mask, thereby forming an impurity diffused region of a second conductivity type in said semiconductor substrate; (g) forming a second insulating layer over said top surface of said semiconductor substrate; (h) applying a reactive ion etching process to said second insulating layer, thereby forming a contact hole in said second insulating layer leading to said impurity diffused region, while leaving part of said second insulating layer on said side walls of said isolation film, gate electrode and first insulating layer; and (i) forming an electrically conductive film in contact with said impurity diffused region.
Claim 3
Dependent Claim
35 words
A manufacturing method according to claim 1, wherein said isolation film is formed by that a polysilicon layer is formed over the major surface of said substrate, and that the polysilicon layer is locally oxidized.
Claim 4
Dependent Claim
19 words
A manufacturing method according to claim 1, wherein said element separating film has a thickness of about 5,000 Å.
Claim 5
Dependent Claim
30 words
A manufacturing method according to claim 1, wherein said gate electrode has a thickness of about 4,000 Å and said first insulation film has a thickness of about 4,000 Å.