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Method of burnishing malleable films on semiconductor substrates

Assignee: RCA Corp
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Filing: 1984-05-14
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Granted: 1986-09-02
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Expires: 2004-05-14
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Abstract

Abstract An improved burnishing method suitable for planarizing bonding pads on fragile semiconductor devices is disclosed. The method comprises imparting scratches of predetermined depth and spacing onto a glass slide. The bonding pad surface is contacted to the scratched glass surface under a desired pressure and a relative motion is established therebetween. The motion is continued until a smooth, defect-free bonding pad surface has been provided.

Inventors

  • 👤 Frank Z. Hawrylo

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-03 18:58
CPC Classifications
B; B24; B24B; B24B39/00; B24B39/06; B23; B23K; B23K20/00; B23K20/24; H; H10; H10W; H10W20/00; H10W20/01; H10W20/031; H10W20/062; Y; Y10; Y10T; Y10T29/00; Y10T29/47

Claims Analysis

Total Claims: 8
Claim 1
Independent Claim 68 words
A method of burnishing a malleable film on a semiconductor substrate to provide a smooth, defect-free surface comprising: imparting scratches of a desired depth and spacing into a first major surface of a smooth glass plate; contacting the first major surface of the glass plate to the malleable film and establishing relative motion therebetween; continuing said motion under a desired pressure until a defect-free film surface is provided.
Claim 2
Independent Claim 68 words
A method of burnishing a malleable film on a semiconductor substrate to provide a smooth, defect-free surface comprising: imparting scratches of a desired depth and spacing into a first major surface of a smooth glass plate; contacting the first major surface of the glass plate to the malleable film and establishing relative motion therebetween; continuing said motion under a desired pressure until a defect-free film surface is provided.
Claim 3
Dependent Claim 19 words
The method of claim 1 wherein the malleable film is a bonding pad of gold or an alloy thereof.
Claim 4
Dependent Claim 31 words
The method of claim 1 wherein a reflective coating is applied to a second major surface of the glass slide opposite the scratches to allow visual observation of the burnishing process.
Claim 5
Dependent Claim 16 words
The method of claim 1 wherein the scratches are between about 75 and 250 micrometers apart.
Claim 6
Dependent Claim 23 words
The method of claim 1 wherein the scratches are at least 250 Angstroms in depth but not more than 1000 Angstroms in depth.
Claim 7
Dependent Claim 25 words
The method of claim 1 wherein between about 55 and 310 kg/cm 2 of pressure is applied to the substrate and bonding pad during burnishing.
Claim 8
Dependent Claim 21 words
The method of claim 1 wherein the motion is continued to extend the malleable films toward an edge of the substrate.

References Cited (Backward Citations)

US3613107A Cited
US3676214A Cited
US3883946A Cited
US3946334A Cited
US4179852A Cited
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USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1989-09-01 1990-03-03 1990-09-02 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1993-09-01 1994-03-03 1994-09-02 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1997-09-01 1998-03-03 1998-09-02 $7700.00 Window Closed / Lapsed

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