US4604160A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for manufacture of printed wiring board
Assignee: Hitachi Ltd
•
Filing: 1985-01-08
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Granted: 1986-08-05
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Expires: 2005-01-08
Abstract
Abstract This invention concerns a method for the manufacture of a printed wiring board which particularly proves useful as a printed coil. This method is characterized by the fact that in the work in process which has undergone the step for formation of a conductor circuit and which has not undergone the step for separation of a plating resist, the plating resist and other insulating substratal material are separated for transfer from the surface of the substrate having the conductor circuit formed thereon. Since this method permits formation of an extremely thin insulating layer and a conductor circuit layer thicker than the insulating layer, it enables production of very thin printed wiring board and printed coil having high circuit density in the surfaces of component layers as well as in the direction of superposition of component layers.
Inventors
- 👤 Kanji Murakami
- 👤 Haruo Akahoshi
- 👤 Mineo Kawamoto
- 👤 Motoyo Wajima
- 👤 Yoichi Matsuda
- 👤 Kyoji Kawakubo
- 👤 Minoru Kanechiku
- 👤 Toyofusa Yoshimura
- 👤 Makoto Matsunaga
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-27 11:48
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/16; H05K1/165; H01; H01F; H01F41/00; H01F41/02; H01F41/04; H01F41/041; H01F41/042; H05K3/00; H05K3/10; H05K3/20; H05K3/205; H05K1/02; H05K1/03; H05K1/0393; H05K2201/00; H05K2201/09; H05K2201/09818; H05K2201/09881; H05K2203/00; H05K2203/01; H05K2203/0147; H05K2203/0152; H05K2203/07; H05K2203/0703; H05K2203/0726; H10; H10P; H10P72/00; H10P72/70; H10P72/74; H10P72/7424; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
116 words
A method for the manufacture of a printed wiring board, characterized by comprising the following steps in the order mentioned: (1) the step of applying a metallic film on a substrate, (2) the step of forming a plating resist on said metallic film except the portion intended for the formation of a conductor circuit, (3) the step of plating said metallic film surface covered with said plating resist thereby forming a conductor circuit, (4) the step of separating said metallic film, said conductor circuit, and the said plating resist jointly from said substrate, (5) the step of transferring them to an insulating substrate, and (6) the step of removing said metallic film so transferred by etching.
Claim 2
Independent Claim
116 words
A method for the manufacture of a printed wiring board, characterized by comprising the following steps in the order mentioned: (1) the step of applying a metallic film on a substrate, (2) the step of forming a plating resist on said metallic film except the portion intended for the formation of a conductor circuit, (3) the step of plating said metallic film surface covered with said plating resist thereby forming a conductor circuit, (4) the step of separating said metallic film, said conductor circuit, and the said plating resist jointly from said substrate, (5) the step of transferring them to an insulating substrate, and (6) the step of removing said metallic film so transferred by etching.
Claim 3
Dependent Claim
24 words
A method according to claim 1, which further comprises a step of coarsening the surface of said metallic film formed in the step (1).
Claim 4
Dependent Claim
23 words
A method according to claim 1, wherein the surface of said insulating substratal material for transfer has adhesive agent applied thereon in advance.
Claim 5
Dependent Claim
25 words
A method according to claim 1, wherein said transfer is effected by applying an insulating substratal material by printing subsequently to the step of separation.
Claim 6
Dependent Claim
19 words
A method according to claim 1, wherein said printed wiring board is in the form of a printed coil.
Claim 7
Independent Claim
136 words
A method for the manufacture of a printed wiring board, characterized by comprising the following steps in the order mentioned: (1) the step of applying a metallic film on a substrate, (2) the step of forming a plating resist on said metallic film except the portion for the formation of a conductor circuit, (3) the step of plating said metallic film surface covered with said plating resist thereby forming a conductor circuit, (4) the step of applying an insulating substratal material to adhere firmly to the surface of said plating resist and that of said conductor circuit, separating said metallic film, said conductor circuit, and said plating resist in conjunction with said insulating substratal material from said substrate, and immediately effecting their transfer, and (5) the step of removing said metallic film so transferred by etching.
Claim 8
Independent Claim
136 words
A method for the manufacture of a printed wiring board, characterized by comprising the following steps in the order mentioned: (1) the step of applying a metallic film on a substrate, (2) the step of forming a plating resist on said metallic film except the portion for the formation of a conductor circuit, (3) the step of plating said metallic film surface covered with said plating resist thereby forming a conductor circuit, (4) the step of applying an insulating substratal material to adhere firmly to the surface of said plating resist and that of said conductor circuit, separating said metallic film, said conductor circuit, and said plating resist in conjunction with said insulating substratal material from said substrate, and immediately effecting their transfer, and (5) the step of removing said metallic film so transferred by etching.
Claim 9
Dependent Claim
24 words
A method according to claim 6, which further comprises a step of coarsening the surface of said metallic film formed in the step (1).
Claim 10
Dependent Claim
23 words
A methd according to claim 6, wherein the surface of said insulating substratal material for transfer has adhesive agent applied thereon in advance.
Claim 11
Dependent Claim
21 words
A method according to claim 6, wherein said insulating substratal material is deposited by printing on the surface of said resist.
Claim 12
Dependent Claim
19 words
A method according to claim 6, wherein said printed wiring board is in the form of a printed coil.
Claim 13
Independent Claim
168 words
A method for the manufacture of a printed coil, characterized by comprising the following steps in the order mentioned: (1) the step of applying a metallic film on a substrate, (2) the step of forming a plating resist on said metallic film except the portion intended for the formation of a conductor circuit, (3) the step of plating said metallic film surface covered with said plating resist thereby forming a conductor circuit, (4) the step of separating said metallic film, said conductor circuit, and said plating resist jointly from said substrate, (5) the step of transferring these separated components to an insulating substrate, (6) the step of removing by etching said metallic film so transferred, thereby producing in consequence of the foregoing steps a printed wiring board having a conductor circuit formed therein in a spiral shape, and (7) the step of alternately superposing circuit resist layers containing the spiral circuit and insulating substrate layers and, at the same time, establishing electric continuity between the adjacent spiral circuits.
Claim 14
Independent Claim
168 words
A method for the manufacture of a printed coil, characterized by comprising the following steps in the order mentioned: (1) the step of applying a metallic film on a substrate, (2) the step of forming a plating resist on said metallic film except the portion intended for the formation of a conductor circuit, (3) the step of plating said metallic film surface covered with said plating resist thereby forming a conductor circuit, (4) the step of separating said metallic film, said conductor circuit, and said plating resist jointly from said substrate, (5) the step of transferring these separated components to an insulating substrate, (6) the step of removing by etching said metallic film so transferred, thereby producing in consequence of the foregoing steps a printed wiring board having a conductor circuit formed therein in a spiral shape, and (7) the step of alternately superposing circuit resist layers containing the spiral circuit and insulating substrate layers and, at the same time, establishing electric continuity between the adjacent spiral circuits.
Claim 15
Dependent Claim
24 words
A method according to claim 11, which further comprises a step of coarsening the surface of said metallic film formed in the step (1).
Claim 16
Dependent Claim
23 words
A method according to claim 11, wherein the surface of said insulating substratal material for transfer has adhesive agent applied thereon in advance.
Claim 17
Dependent Claim
25 words
A method according to claim 11, wherein said transfer is effected by applying an insulating substratal material by printing subsequently to the step of separation.
Claim 18
Independent Claim
187 words
A method for the manufacture of a printed coil, characterized by comprising the following steps in the order mentioned: (1) the step of applying a metallic film on a substrate, (2) the step of forming a plating resist on said metallic film except the portion intended for the formation of a conductor circuit, (3) the step of plating said metallic film surface covered with said plating resist thereby forming a conductor circuit, (4) the step of applying an insulating substratal material to adhere firmly to the surface of said plating resist and that of said conductor circuit, separating said metallic film, said conductor circuit, and said plating resist in conjunction with said insulating material from said substrate, and immediately effecting their transfer, (5) the step of removing by etching said metallic film so transferred, thereby producing in consequence of the foregoing steps a printed wiring board having a conductor circuit formed therein in a spiral shape, and (6) the step of alternately superposing circuit resist layers containing the spiral circuit and insulating substrate layers and, at the same time, establishing electric continuity between the adjacent spiral circuits.
Claim 19
Independent Claim
187 words
A method for the manufacture of a printed coil, characterized by comprising the following steps in the order mentioned: (1) the step of applying a metallic film on a substrate, (2) the step of forming a plating resist on said metallic film except the portion intended for the formation of a conductor circuit, (3) the step of plating said metallic film surface covered with said plating resist thereby forming a conductor circuit, (4) the step of applying an insulating substratal material to adhere firmly to the surface of said plating resist and that of said conductor circuit, separating said metallic film, said conductor circuit, and said plating resist in conjunction with said insulating material from said substrate, and immediately effecting their transfer, (5) the step of removing by etching said metallic film so transferred, thereby producing in consequence of the foregoing steps a printed wiring board having a conductor circuit formed therein in a spiral shape, and (6) the step of alternately superposing circuit resist layers containing the spiral circuit and insulating substrate layers and, at the same time, establishing electric continuity between the adjacent spiral circuits.
Claim 20
Dependent Claim
24 words
A method according to claim 15, which further comprises a step of coarsening the surface of said metallic film formed in the step (1).
Claim 21
Dependent Claim
23 words
A method according to claim 15, wherein the surface of said insulating substratal material for transfer has adhesive agent applied thereon in advance.
Claim 22
Dependent Claim
21 words
A method according to claim 15, wherein said insulating substratal material is deposited by printing on the surface of said resist.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1989-08-04 | 1990-02-03 | 1990-08-05 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1993-08-04 | 1994-02-03 | 1994-08-05 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1997-08-04 | 1998-02-03 | 1998-08-05 | $7700.00 | Window Closed / Lapsed |