Patent US4603374A successfully refreshed from Google Patents.
US4603374A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Packaging module for a semiconductor wafer
Assignee: NXP USA Inc
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Filing: 1984-07-03
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Granted: 1986-07-29
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Expires: 2004-07-03
Abstract
Abstract A package for housing a semiconductor wafer includes a case having a plurality of thermal conductive pads disposed on an inner surface thereof for supporting the wafer. A printed circuit board is equipped with a plurality of contact pins and further includes a plurality of electrically conductive plastic pads which engage contact pads on the wafer when the printed circuit board is disposed on the wafer. The remainder of the cavity within the case is filled with a sealant such as epoxy. If desired, additional electronic components may be positioned on the printed circuit board.
Inventors
- 👤 J. Paul Wasielewski
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-26 17:17
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/20; H10W40/25; H10W40/251; B; B29; B29C; B29C39/00; B29C39/02; B29C39/10; B29C70/00; B29C70/68; B29C70/78; B29K; B29K2063/00; B29L; B29L2031/00; B29L2031/34; B29L2031/3406
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
87 words
A packaging module which houses a semiconductor wafer having a front side and back side with a plurality of contact regions on said front side, comprising: a case having a base; a plurality of thermal conductive pads disposed on said base supporting said wafer; a printed circuit board equipped with a plurality of contact pins; and a plurality of electrically conductive plastic pads disposed on said printed circuit board and positioned so as to contact said contact regions on said printed circuit board disposed on said wafer.
Claim 2
Dependent Claim
87 words
A packaging module which houses a semiconductor wafer having a front side and back side with a plurality of contact regions on said front side, comprising: a case having a base; a plurality of thermal conductive pads disposed on said base supporting said wafer; a printed circuit board equipped with a plurality of contact pins; and a plurality of electrically conductive plastic pads disposed on said printed circuit board and positioned so as to contact said contact regions on said printed circuit board disposed on said wafer.
Claim 3
Dependent Claim
23 words
A module according to claim 1 wherein said case includes a cavity, of which said base forms a part, for receiving said wafer.
Claim 4
Dependent Claim
11 words
A module according to claim 2 wherein said case is metal.
Claim 5
Dependent Claim
13 words
A module according to claim 3 wherein said case is nickel plated copper.
Claim 6
Dependent Claim
11 words
A module according to claim 2 wherein said case is plastic.
Claim 7
Dependent Claim
11 words
A module according to claim 2 wherein said case is ceramic.
Claim 8
Dependent Claim
13 words
A module according to claim 2 wherein said thermal conductive pads are plastic.
Claim 9
Dependent Claim
13 words
A module according to claim 7 wherein said electrically conductive pads are plastic.
Claim 10
Dependent Claim
24 words
A module according to claim 2 further including a body of sealant in said cavity to encase said wafer and said printed circuit board.
Claim 11
Dependent Claim
12 words
A module according to claim 9 wherein said sealant is a epoxy.
Claim 12
Dependent Claim
20 words
A module according to claim 2 further including adhesive means within said cavity receiving and securing said printed circuit board.
Claim 13
Dependent Claim
84 words
A wafer packaging module, comprising: a case having a base; a plurality of thermal conductive pads disposed on said base; a semiconductor wafer having a plurality of contact regions thereon disposed within said case on said plurality of thermal conductive pads; a printed circuit board equipped with a plurality of contact pins; and a plurality of electrically conductive plastic pads disposed on said printed circuit board and positioned so as to contact said contact regions on said printed circuit board disposed on said wafer.
Claim 14
Dependent Claim
84 words
A wafer packaging module, comprising: a case having a base; a plurality of thermal conductive pads disposed on said base; a semiconductor wafer having a plurality of contact regions thereon disposed within said case on said plurality of thermal conductive pads; a printed circuit board equipped with a plurality of contact pins; and a plurality of electrically conductive plastic pads disposed on said printed circuit board and positioned so as to contact said contact regions on said printed circuit board disposed on said wafer.
Claim 15
Dependent Claim
13 words
A module according to claim 12 wherein said thermal conductive pads are plastic.
Claim 16
Dependent Claim
13 words
A module according to claim 13 wherein said electrically conductive pads are plastic.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1989-07-28 | 1990-01-27 | 1990-07-29 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1993-07-28 | 1994-01-27 | 1994-07-29 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1997-07-28 | 1998-01-27 | 1998-07-29 | $7700.00 | Window Closed / Lapsed |