US4600684A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Process for forming a negative resist using high energy beam
Assignee: Oki Electric Industry Co Ltd
•
Filing: 1984-01-27
•
Granted: 1986-07-15
•
Expires: 2004-01-27
Abstract
Abstract A negative type resist for high energy beam such as electron beam, X-rays or the like made from quinone diazide ester of an oligomer having a polymerization degree of 1-20, and a process for forming a pattern with the same type resist.
Inventors
- 👤 Yoshio Yamashita
- 👤 Ryuji Kawazu
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 15:29
CPC Classifications
G; G03; G03F; G03F7/00; G03F7/004; G03F7/022; G03F7/023; Y; Y10; Y10S; Y10S430/00; Y10S430/167; Y10S430/168
Claims Analysis
Total Claims: 3
Claim 1
Independent Claim
98 words
A process for forming a pattern on a high energy beam negative type resist comprising the steps of forming a film of a negative type resist consisting essentially of a quinone diazide sulfonic ester of a novolak resin having a polymerization degree of 1-10 on a substrate, selectively irradiating said film with a high energy beam from the group consisting of electron beam and X-ray radiation, and developing the film thus irradiated by using an organic solvent which is an alkyl ketone or an acetic ester to remove portions of the film which have not been selectively irradiated.
Claim 2
Dependent Claim
98 words
A process for forming a pattern on a high energy beam negative type resist comprising the steps of forming a film of a negative type resist consisting essentially of a quinone diazide sulfonic ester of a novolak resin having a polymerization degree of 1-10 on a substrate, selectively irradiating said film with a high energy beam from the group consisting of electron beam and X-ray radiation, and developing the film thus irradiated by using an organic solvent which is an alkyl ketone or an acetic ester to remove portions of the film which have not been selectively irradiated.
Claim 3
Dependent Claim
19 words
The process according to claim 1 wherein the organic solvent further contains at least 0.05% by weight of water.
References Cited (Backward Citations)
US3046120A
Cited
US3502470A
Cited
US3837860A
Cited
SU595694A1
Cited
US4308368A
Cited
US4407926A
Cited
US4365019A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1989-07-14 | 1990-01-13 | 1990-07-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1993-07-14 | 1994-01-13 | 1994-07-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1997-07-14 | 1998-01-13 | 1998-07-15 | $7700.00 | Window Closed / Lapsed |