Substrate holder for molecular beam epitaxy apparatus

Claim 2

A holder for holding a semiconductor substrate to place said substrate in a molecular beam epitaxy apparatus, said epitaxy apparatus including heating means for heating said substrate, said substrate having a first surface for epitaxial growth, a second surface opposite to the first surface and directed towards said heating means, and a side surface contiguous to both of the first and second surfaces, said holder comprising: a supporting member having an inside surface defining a space for receiving said substrate and a flange portion radially projecting inwardly from said inside surface to cover a peripheral portion of said space and to engage a circumferential portion of the first surface of said substrate, said flange portion thereby maintaining said substrate within said space.

Claim 3

A holder as claimed in claim 1, wherein said heat conductor member is made of a material comprising pyrolytic graphite.

Claim 4

A holder as claimed in claim 1, wherein said heat conductor member is made of a material comprising sintered graphite.

Claim 5

A holder as claimed in claim 1, wherein said flange portion is integral with said inside surface.

Claim 6

A holder for holding a semiconductor substrate to place said substrate in a molecular beam epitaxy apparatus, said epitaxy apparatus including heating means for heating said substrate, said substrate having a first surface for epitaxial growth, a second surface opposite to the first surface and directed towards said heating means, and a side surface contiguous to both of the first and second surfaces, said holder comprising: a supporting member having an inside surface defining a space for receiving said substrate and a flange portion radially projecting inwardly from said inside surface to cover a peripheral portion of said space and to engage a circumferential portion of the first surface of said substrate, said flange portion being detachable from said inside surface, said flange portion thereby maintaining said substrate within said space; and a heat conductor member juxtaposed to the second surface of the substrate kept in said space.

Claim 7

A holder for holding a semiconductor substrate to place said substrate in a molecular beam epitaxy apparatus, said epitaxy apparatus including heating means for heating said substrate, said substrate having a first surface for epitaxial growth, a second surface opposite to the first surface and directed towards said heating means, and a side surface contiguous to both of the first and second surfaces, said holder comprising: a supporting member having an inside surface defining a space for receiving said substrate and a flange portion radially projecting inwardly from said inside surface to cover a peripheral portion of said space and to engage a circumferential portion of the first surface of said substrate, said flange portion being detachable from said inside surface, said flange portion thereby maintaining said substrate within said space; and a heat conductor member juxtaposed to the second surface of the substrate kept in said space.

Claim 8

A holder as claimed in claim 1, further comprising a heat conductor member juxtaposed to the second surface of the substrate kept in said space.

Claim 9

A holder as claimed in claim 6, wherein said heat conductor member is received in said space and juxtaposed to the second surface of said substrate.

Claim 10

A holder as claimed in claim 7, wherein said heat conductor member has a peripheral surface close to said inside surface.

Claim 11

A holder for holding a semiconductor substrate to place said substrate in a molecular beam epitaxy apparatus, said epitaxy apparatus including heating means for heating said substrate, said substrate having a first surface for epitaxial growth, a second surface opposite to the first surface and directed towards said heating means, and a side surface contiguous to both of the first and second surfaces, said holder comprising: a supporting member having an inside surface defining a space for receiving said substrate and a flange portion radially projecting inwardly from said inside surface to cover a peripheral portion of said space and to engage a circumferential portion of the first surface of said substrate, said supporting member further comprises a shoulder portion radially inwardly projected from said inside surface of said supporting member, said flange portion thereby maintaining said substrate within said space; and a heat conductor member received in said space and juxtaposed to the second surface of the substrate kept in said space, said heat conductor member having a peripheral surface close to said inside surface.

Claim 12

A holder for holding a semiconductor substrate to place said substrate in a molecular beam epitaxy apparatus, said epitaxy apparatus including heating means for heating said substrate, said substrate having a first surface for epitaxial growth, a second surface opposite to the first surface and directed towards said heating means, and a side surface contiguous to both of the first and second surfaces, said holder comprising: a supporting member having an inside surface defining a space for receiving said substrate and a flange portion radially projecting inwardly from said inside surface to cover a peripheral portion of said space and to engage a circumferential portion of the first surface of said substrate, said supporting member further comprises a shoulder portion radially inwardly projected from said inside surface of said supporting member, said flange portion thereby maintaining said substrate within said space; and a heat conductor member received in said space and juxtaposed to the second surface of the substrate kept in said space, said heat conductor member having a peripheral surface close to said inside surface.

Claim 13

A holder as claimed in claim 9, wherein said shoulder portion is integral with said inside surface.

Claim 14

A holder as claimed in claim 9, wherein said shoulder portion is detachable from said inside surface.

Claim 15

A holder as claimed in claim 1, wherein said flange portion is circularly extended along said inside surface.

Claim 16

A holder as claimed in claim 12, wherein said flange portion is in face-to-face contact with said substrate.

Claim 17

A holder as claimed in claim 12, wherein said flange portion is in line-to-line contact with said substrate.

Claim 18

A holder for holding a semiconductor substrate to place said substrate in a molecular beam epitaxy apparatus, said epitaxy apparatus including heating means for heating said substrate, said substrate having a first surface for epitaxial growth, a second surface opposite to the first surface and directed towards said heating means, and a side surface contiguous to both of the first and second surfaces, said holder comprising: a supporting member having an inside surface defining a space for receiving said substrate and a flange portion radially projecting inwardly from said inside surface to cover a peripheral portion of said space and to engage a circumferential portion of the first surface of said substrate, said flange portion thereby maintaining said substrate within said space; and a heat conductor member juxtaposed to the second surface of the substrate kept in said space, said substrate being smaller in size than said space and being kept by said supporting member with a gap left between said inside surface and the side surface, wherein said flange portion comprises a first partial flange radially projecting inwardly from said inside surface, a second partial flange intermediate between said first partial flange and said substrate for engaging with said circumferential portion of said second partial flange, and an extension extended towards said heat conductor member in said gap.

Claim 19

A holder for holding a semiconductor substrate to place said substrate in a molecular beam epitaxy apparatus, said epitaxy apparatus including heating means for heating said substrate, said substrate having a first surface for epitaxial growth, a second surface opposite to the first surface and directed towards said heating means, and a side surface contiguous to both of the first and second surfaces, said holder comprising: a supporting member having an inside surface defining a space for receiving said substrate and a flange portion radially projecting inwardly from said inside surface to cover a peripheral portion of said space and to engage a circumferential portion of the first surface of said substrate, said flange portion thereby maintaining said substrate within said space; and a heat conductor member juxtaposed to the second surface of the substrate kept in said space, said substrate being smaller in size than said space and being kept by said supporting member with a gap left between said inside surface and the side surface, wherein said flange portion comprises a first partial flange radially projecting inwardly from said inside surface, a second partial flange intermediate between said first partial flange and said substrate for engaging with said circumferential portion of said second partial flange, and an extension extended towards said heat conductor member in said gap.

Claim 20

A holder for holding a plurality of semiconductor substrates to place said substrates in a molecular beam epitaxy apparatus, said epitaxy apparatus including heating means for heating said substrates, each of said substrates having a first surface for epitaxial growth and a second surface opposite to the first surface and directed towards said heating means, said holder comprising: a supporting member having a plurality of inside surfaces, defining spaces for receiving the respective substrates, a plurality of flange portions which are radially inwardly projected from the respective inside surfaces to cover peripheral portions of the respective spaces and to engage with circumferential portions of the first surfaces of the respective substrates, said flange portions thereby maintaining said substrates within said spaces, respectively; and a plurality of heat conductor members juxtaposed to the second surfaces of the substrates kept in said spaces, respectively.

Claim 21

A holder for holding a plurality of semiconductor substrates to place said substrates in a molecular beam epitaxy apparatus, said epitaxy apparatus including heating means for heating said substrates, each of said substrates having a first surface for epitaxial growth and a second surface opposite to the first surface and directed towards said heating means, said holder comprising: a supporting member having a plurality of inside surfaces, defining spaces for receiving the respective substrates, a plurality of flange portions which are radially inwardly projected from the respective inside surfaces to cover peripheral portions of the respective spaces and to engage with circumferential portions of the first surfaces of the respective substrates, said flange portions thereby maintaining said substrates within said spaces, respectively; and a plurality of heat conductor members juxtaposed to the second surfaces of the substrates kept in said spaces, respectively.

Claim 22

A holder for holding a plurality of semiconductor substrates to place said substrates in a molecular beam epitaxy apparatus, said epitaxy apparatus including heating means for heating said substrates, each of said substrates having a first surface for epitaxial growth and a second surface opposite to the first surface and directed towards said heating means, said holder comprising: a supporting member having a plurality of inside surfaces, defining spaces for receiving the respective substrates, a plurality of flange portions which are radially inwardly projected from the respective inside surfaces to cover peripheral portions of the respective spaces and to engage with circumferential portions of the first surfaces of the respective substrates, said flange portions thereby maintaining said substrates within said spaces, respectively; and a heat conductor member superposed on said supporting member in common to said substrates and juxtaposed to the second surfaces of the substrates.

Claim 23

A holder for holding a plurality of semiconductor substrates to place said substrates in a molecular beam epitaxy apparatus, said epitaxy apparatus including heating means for heating said substrates, each of said substrates having a first surface for epitaxial growth and a second surface opposite to the first surface and directed towards said heating means, said holder comprising: a supporting member having a plurality of inside surfaces, defining spaces for receiving the respective substrates, a plurality of flange portions which are radially inwardly projected from the respective inside surfaces to cover peripheral portions of the respective spaces and to engage with circumferential portions of the first surfaces of the respective substrates, said flange portions thereby maintaining said substrates within said spaces, respectively; and a heat conductor member superposed on said supporting member in common to said substrates and juxtaposed to the second surfaces of the substrates.