Patent US4585502A successfully refreshed from Google Patents.
US4585502A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Process for producing printed circuit board
Assignee: Lincstech Circuit Co Ltd
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Filing: 1985-02-14
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Granted: 1986-04-29
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Expires: 2005-02-14
Abstract
Abstract A process for producing a printed circuit board characterized by forming a thermosetting resin layer on internal walls of through holes before an electroless plating treatment can produce printed circuit boards having high reliability without causing blow-holes on the through hole walls.
Inventors
- 👤 Nobuo Uozu
- 👤 Hiroyoshi Yokoyama
- 👤 Yoichi Matsuda
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-27 11:31
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/40; H05K3/42; H05K3/422; H05K3/425; H05K3/426; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/09581; H05K2203/00; H05K2203/07; H05K2203/0703; H05K2203/0709; H05K2203/14; H05K2203/1407; H05K3/10; H05K3/18; H05K3/181; H05K3/182; H05K3/184; H05K3/38; H05K3/386; H05K3/387; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49144; Y10T29/49155; Y10T29/49165
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
70 words
In a process for producing a printed circuit board by forming a circuit on an insulating substrate having through holes by electroless plating, the improvement comprising forming an adhesive layer containing a catalyst for plating on one side or both sides of the insulating substrate, forming through holes in the substrate, and forming a thermosetting resin layer on the internal walls of the through holes before an electroless plating treatment.
Claim 2
Dependent Claim
70 words
In a process for producing a printed circuit board by forming a circuit on an insulating substrate having through holes by electroless plating, the improvement comprising forming an adhesive layer containing a catalyst for plating on one side or both sides of the insulating substrate, forming through holes in the substrate, and forming a thermosetting resin layer on the internal walls of the through holes before an electroless plating treatment.
Claim 3
Dependent Claim
16 words
A process according to claim 1, wherein the thermosetting resin layer contains a catalyst for plating.
Claim 4
Dependent Claim
31 words
A process according to claim 1, wherein the thermosetting resin layer contains no catalyst for plating, and after a thermosetting resin layer is formed, a catalyst for plating is adhered thereto.
Claim 5
Dependent Claim
34 words
A process according to claim 1, wherein the thermosetting resin layer is formed from an emulsion comprising as its main constituent an epoxy resin, a urethane resin, a polyester resin or a mixture thereof.
Claim 6
Dependent Claim
36 words
A process according to claim 2, wherein the catalyst for plating is a compound selected from the group consisting of Pd, Pt, Wi, Co, Fe, Cu, Mn, Cr, Mo, W, Ti, Sn, Ag and mixtures thereof.
Claim 7
Dependent Claim
22 words
A process according to claim 2, wherein after the thermosetting resin layer is formed, a catalyst for plating is further adhered thereto.
Claim 8
Dependent Claim
27 words
A process according to claim 2, wherein the thermosetting resin layer is formed by curing by using hot air having a velocity of 5 m/sec or less.
Claim 9
Dependent Claim
36 words
A process according to claim 2, wherein the catalyst for plating is a palladium compound and the palladium concentation is 0.005 to 0.5 part by weight per 100 parts by weight of the solid resin content.
Claim 10
Dependent Claim
38 words
A process according to claim 2, wherein the catalyst for plating is a mixture of palladium chloride and stannous chloride and the amount of stannous chloride is 5 to 40 times as much as that of palladium chloride.
Claim 11
Dependent Claim
29 words
A process according to claim 1, wherein the thermosetting resin layer is formed by using a thermosetting resin liquid having a solid content of 0.3 to 5% by weight.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1989-04-28 | 1989-10-28 | 1990-04-29 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1993-04-28 | 1993-10-28 | 1994-04-29 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1997-04-28 | 1997-10-28 | 1998-04-29 | $7700.00 | Window Closed / Lapsed |