Patent US4582556A successfully refreshed from Google Patents.
US4582556A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Adhesion primers for encapsulating epoxies
Assignee: Olin Corp
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Filing: 1984-05-31
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Granted: 1986-04-15
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Expires: 2004-05-31
Abstract
Abstract A copper plastic laminate is provided having a high bond strength. The copper is selected from the group consisting of copper and copper alloys and has on its surface a uniform glassy-like, substantially pore-free coating of copper phosphate. A plastic encapsulating material containing a mold release agent is adhesively bonded to the copper.
Inventors
- 👤 Sheldon H. Butt
- 👤 Edward F. Smith, III
- 👤 F. Dennis Gyurina
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 23:02
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/40; H10W74/47; H05; H05K; H05K3/00; H05K3/38; H05K3/382; H05K3/385; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121; Y10T428/00; Y10T428/31504; Y10T428/31511
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
81 words
A process of forming a metal plastic composite, comprising the steps of: a. selecting said metal from the group consisting of copper and copper alloys; b. coating the surface of said metal with an adhesion primer comprising a substantially glassy-like, pore-free phosphate coating; c. rinsing said metal; d. drying said metal; and e. adhesively bonding a plastic material comprising an epoxide resin and a mold release agent to the surface of the copper or copper alloy metal having said adhesion primer.
Claim 2
Dependent Claim
81 words
A process of forming a metal plastic composite, comprising the steps of: a. selecting said metal from the group consisting of copper and copper alloys; b. coating the surface of said metal with an adhesion primer comprising a substantially glassy-like, pore-free phosphate coating; c. rinsing said metal; d. drying said metal; and e. adhesively bonding a plastic material comprising an epoxide resin and a mold release agent to the surface of the copper or copper alloy metal having said adhesion primer.
Claim 3
Dependent Claim
24 words
The process as in claim 1 including the step of selecting said plastic material from an epoxide resin formulated as a thermosetting encapsulating epoxy.
Claim 4
Dependent Claim
21 words
The process as in claim 1 including the step of adding inert fillers to said plastic material to provide dimensional stability.
Claim 5
Dependent Claim
23 words
The process as in claim 3 including the step of selecting said mold release agent from a group of low melting temperature organics.
Claim 6
Dependent Claim
25 words
The process as in claim 4 including the step of selecting said mold release agent from the group consisting of silicones, stearates and fatty acids.
Claim 7
Dependent Claim
17 words
The process as in claim 2 further including the step of forming said metal into a leadframe.
Claim 8
Dependent Claim
29 words
The process as in claim 6 further including the step of connecting an electrical or electronic component to said leadframe, whereby said component is encapsulated by said epoxide resin.
Claim 9
Dependent Claim
91 words
The process as in claim 1 wherein said step of coating the surface of said metal includes immersing said metal in a phosphoric acid solution of at least 8 percent concentration and containing from 3.5 grams per liter up to the solubility limit of a material selected from the group consisting of sodium dichromate and potassium dichromate and mixtures thereof for at least 2 seconds to form a substantially pore-free coating of copper phosphate, provided that when the concentration of phosphoric acid is increased, the minimum dichromate concentration is proportionately increased.
Claim 10
Dependent Claim
46 words
The process as in claim 1 wherein the coating step includes immersing said metal in a solution containing an organophosphonic acid and a chromate free oxidizing agent for at least 4 seconds to coat the surface of said metal with a compound of said organophosphonic acid.
References Cited (Backward Citations)
GB771127A
Cited
US3413713A
Cited
US3468824A
Cited
US3541041A
Cited
GB1309299A
Cited
US3677828A
Cited
US3944449A
Cited
US3728178A
Cited
US3728177A
Cited
US3941628A
Cited
US3764399A
Cited
US3941627A
Cited
US3837929A
Cited
US3716427A
Cited
US3853691A
Cited
US3940303A
Cited
US3764400A
Cited
US3833433A
Cited
US3988284A
Cited
GB1510558A
Cited
US4143024A
Cited
US4136119A
Cited
GB2016807A
Cited
US4318740A
Cited
US4264379A
Cited
JPS5714013A
Cited
GB2093754A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1989-04-14 | 1989-10-14 | 1990-04-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1993-04-14 | 1993-10-14 | 1994-04-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1997-04-14 | 1997-10-14 | 1998-04-15 | $7700.00 | Window Closed / Lapsed |