Patent US4581102A successfully refreshed from Google Patents.
US4581102A
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Copper-base alloy cleaning solution
Assignee: Olin Corp
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Filing: 1984-08-20
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Granted: 1986-04-08
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Expires: 2004-08-20
Abstract
Abstract The present invention relates to a cleaning solution for removing surface oxides from copper base alloys without significantly etching the copper-base alloy material. The cleaning solution comprises from about 1 v/o to about 50 v/o hydrofluoric acid and from about 5 v/o to about 50 v/o of at least one of sulfuric acid and hydrochloric acid. In a preferred embodiment, the cleaning solution consists essentially of from about 5 v/o to about 15 v/o hydrofluoric acid and from about 25 v/o to about 50 v/o sulfuric acid and the balance essentially water.
Inventors
- 👤 Andrew J. Brock
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 20:53
CPC Classifications
C; C23; C23G; C23G1/00; C23G1/02; C23G1/10; C23G1/103
Claims Analysis
Total Claims: 21
Claim 1
Independent Claim
42 words
A solution for removing surface oxides from non-silicon containing copper base alloys, said solution consisting essentially of from about 5 v/o to about 15 v/o hydrofluoric acid, from about 25 v/o to about 50 v/o sulfuric acid and the balance essentially water.
Claim 2
Dependent Claim
42 words
A solution for removing surface oxides from non-silicon containing copper base alloys, said solution consisting essentially of from about 5 v/o to about 15 v/o hydrofluoric acid, from about 25 v/o to about 50 v/o sulfuric acid and the balance essentially water.
Claim 3
Dependent Claim
24 words
The solution of claim 1 wherein said solution is maintained at a temperature in the range of about 50° C. to about 65° C.
Claim 4
Dependent Claim
24 words
The solution of claim 1 wherein said solution is maintained at a temperature in the range of about 40° C. to about 80° C.
Claim 5
Dependent Claim
70 words
A process for removing oxide particles from a material formed from a non-silicon containing copper base alloy, said process comprising immersing said material in a solution containing from about 1 v/o to about 50 v/o hydrofluoric acid and from about 5 v/o to about 50 v/o of at least one of sulfuric acid and hydrochloric acid for a time in the range of about 1 second to about 2 minutes.
Claim 6
Dependent Claim
70 words
A process for removing oxide particles from a material formed from a non-silicon containing copper base alloy, said process comprising immersing said material in a solution containing from about 1 v/o to about 50 v/o hydrofluoric acid and from about 5 v/o to about 50 v/o of at least one of sulfuric acid and hydrochloric acid for a time in the range of about 1 second to about 2 minutes.
Claim 7
Dependent Claim
24 words
The process of claim 4 further comprising: maintaining said solution at a temperature in the range of about 40° C. to about 80° C.
Claim 8
Dependent Claim
24 words
The process of claim 4 further comprising: maintaining said solution at a temperature in the range of about 50° C. to about 65° C.
Claim 9
Dependent Claim
31 words
The process of claim 4 wherein said immersing step comprises immersing said material in said solution for a time period in the range of about 10 seconds to about 40 seconds.
Claim 10
Dependent Claim
65 words
A process for removing oxide particles from a material formed from a non-silicon containing copper base alloy, said process comprising immersing a material formed at least in part from a copper-beryllium alloy in a solution containing from about 1 v/o to about 50 v/o hydrofluoric acid and from about 5 v/o to about 50 v/o of at least one of sulfuric acid and hydrochloric acid.
Claim 11
Dependent Claim
65 words
A process for removing oxide particles from a material formed from a non-silicon containing copper base alloy, said process comprising immersing a material formed at least in part from a copper-beryllium alloy in a solution containing from about 1 v/o to about 50 v/o hydrofluoric acid and from about 5 v/o to about 50 v/o of at least one of sulfuric acid and hydrochloric acid.
Claim 12
Dependent Claim
22 words
The process of claim 8 wherein said material comprises a strip of copper-beryllium alloy having at least one gold stripe bonded thereto.
Claim 13
Dependent Claim
75 words
A process for removing oxide particles from a material formed from a non-silicon containing copper base alloy, said process comprising immersing a material formed from a copper base alloy consisting essentially of from 0.05% to 0.15% zirconium and the balance essentially copper in a solution containing from about 1 v/o to about 50 v/o hydrofluoric acid and from about 5 v/o to about 50 v/o of at least one of sulfuric acid and hydrochloric acid.
Claim 14
Dependent Claim
75 words
A process for removing oxide particles from a material formed from a non-silicon containing copper base alloy, said process comprising immersing a material formed from a copper base alloy consisting essentially of from 0.05% to 0.15% zirconium and the balance essentially copper in a solution containing from about 1 v/o to about 50 v/o hydrofluoric acid and from about 5 v/o to about 50 v/o of at least one of sulfuric acid and hydrochloric acid.
Claim 15
Dependent Claim
55 words
A process for removing oxide particles from a material formed from a non-silicon containing copper base alloy, said process comprising immersing said material in a solution consisting essentially of from about 5 v/o to about 15 v/o hydrfluoric acid and from about 25 v/o to about 50 v/o sulfuric acid and the balance essentially water.
Claim 16
Dependent Claim
55 words
A process for removing oxide particles from a material formed from a non-silicon containing copper base alloy, said process comprising immersing said material in a solution consisting essentially of from about 5 v/o to about 15 v/o hydrfluoric acid and from about 25 v/o to about 50 v/o sulfuric acid and the balance essentially water.
Claim 17
Dependent Claim
85 words
A process for reducing the force needed to pull a copper-base alloy strip material through a tube forming die, said process comprising: immersing said copper alloy strip material in a solution at a temperature in the range of about 40° C. to about 80° C., said solution containing from about 1 v/o to about 50 v/o hydrofluoric acid and from about 5 v/o to about 50 v/o of at least one of sulfuric acid and hydrochloric acid; and pulling said strip material through said die.
Claim 18
Dependent Claim
85 words
A process for reducing the force needed to pull a copper-base alloy strip material through a tube forming die, said process comprising: immersing said copper alloy strip material in a solution at a temperature in the range of about 40° C. to about 80° C., said solution containing from about 1 v/o to about 50 v/o hydrofluoric acid and from about 5 v/o to about 50 v/o of at least one of sulfuric acid and hydrochloric acid; and pulling said strip material through said die.
Claim 19
Dependent Claim
31 words
The process of claim 12 wherein said immersing step comprises: immersing said strip material in said solution for a time in the range of about 1 sec. to about 2 minutes.
Claim 20
Dependent Claim
31 words
The process of claim 12 wherein said immersing step comprises: immersing said strip material in said solution for a time in the range of about 10 sec. to about 40 sec.
Claim 21
Dependent Claim
58 words
The process of claim 12 wherein said immersing step comprises: immersing said strip material in a solution at a temperature in the range of about 50° C. to about 65° C., said solution consisting essentially of from about 5% to about 15% hydrofluoric acid and from about 25% to about 50% sulfuric acid and the balance essentially water.
References Cited (Backward Citations)
US3598741A
Cited
US3646946A
Cited
US3728155A
Cited
US3794523A
Cited
US3804689A
Cited
US4002489A
Cited
US4009115A
Cited
US3860467A
Cited
US4124407A
Cited
US4105469A
Cited
US4220706A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1989-04-07 | 1989-10-07 | 1990-04-08 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1993-04-07 | 1993-10-07 | 1994-04-08 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1997-04-07 | 1997-10-07 | 1998-04-08 | $7700.00 | Window Closed / Lapsed |