US4581102A — Copper-base alloy cleaning solution

Claim 1

Independent Claim 42 words

A solution for removing surface oxides from non-silicon containing copper base alloys, said solution consisting essentially of from about 5 v/o to about 15 v/o hydrofluoric acid, from about 25 v/o to about 50 v/o sulfuric acid and the balance essentially water.

Claim 2

Dependent Claim 42 words

A solution for removing surface oxides from non-silicon containing copper base alloys, said solution consisting essentially of from about 5 v/o to about 15 v/o hydrofluoric acid, from about 25 v/o to about 50 v/o sulfuric acid and the balance essentially water.

Claim 3

Dependent Claim 24 words

The solution of claim 1 wherein said solution is maintained at a temperature in the range of about 50° C. to about 65° C.

Claim 4

Dependent Claim 24 words

The solution of claim 1 wherein said solution is maintained at a temperature in the range of about 40° C. to about 80° C.

Claim 5

Dependent Claim 70 words

A process for removing oxide particles from a material formed from a non-silicon containing copper base alloy, said process comprising immersing said material in a solution containing from about 1 v/o to about 50 v/o hydrofluoric acid and from about 5 v/o to about 50 v/o of at least one of sulfuric acid and hydrochloric acid for a time in the range of about 1 second to about 2 minutes.

Claim 6

Dependent Claim 70 words

A process for removing oxide particles from a material formed from a non-silicon containing copper base alloy, said process comprising immersing said material in a solution containing from about 1 v/o to about 50 v/o hydrofluoric acid and from about 5 v/o to about 50 v/o of at least one of sulfuric acid and hydrochloric acid for a time in the range of about 1 second to about 2 minutes.

Claim 7

Dependent Claim 24 words

The process of claim 4 further comprising: maintaining said solution at a temperature in the range of about 40° C. to about 80° C.

Claim 8

Dependent Claim 24 words

The process of claim 4 further comprising: maintaining said solution at a temperature in the range of about 50° C. to about 65° C.

Claim 9

Dependent Claim 31 words

The process of claim 4 wherein said immersing step comprises immersing said material in said solution for a time period in the range of about 10 seconds to about 40 seconds.

Claim 10

Dependent Claim 65 words

A process for removing oxide particles from a material formed from a non-silicon containing copper base alloy, said process comprising immersing a material formed at least in part from a copper-beryllium alloy in a solution containing from about 1 v/o to about 50 v/o hydrofluoric acid and from about 5 v/o to about 50 v/o of at least one of sulfuric acid and hydrochloric acid.

Claim 11

Dependent Claim 65 words

A process for removing oxide particles from a material formed from a non-silicon containing copper base alloy, said process comprising immersing a material formed at least in part from a copper-beryllium alloy in a solution containing from about 1 v/o to about 50 v/o hydrofluoric acid and from about 5 v/o to about 50 v/o of at least one of sulfuric acid and hydrochloric acid.

Claim 12

Dependent Claim 22 words

The process of claim 8 wherein said material comprises a strip of copper-beryllium alloy having at least one gold stripe bonded thereto.

Claim 13

Dependent Claim 75 words

A process for removing oxide particles from a material formed from a non-silicon containing copper base alloy, said process comprising immersing a material formed from a copper base alloy consisting essentially of from 0.05% to 0.15% zirconium and the balance essentially copper in a solution containing from about 1 v/o to about 50 v/o hydrofluoric acid and from about 5 v/o to about 50 v/o of at least one of sulfuric acid and hydrochloric acid.

Claim 14

Dependent Claim 75 words

A process for removing oxide particles from a material formed from a non-silicon containing copper base alloy, said process comprising immersing a material formed from a copper base alloy consisting essentially of from 0.05% to 0.15% zirconium and the balance essentially copper in a solution containing from about 1 v/o to about 50 v/o hydrofluoric acid and from about 5 v/o to about 50 v/o of at least one of sulfuric acid and hydrochloric acid.

Claim 15

Dependent Claim 55 words

A process for removing oxide particles from a material formed from a non-silicon containing copper base alloy, said process comprising immersing said material in a solution consisting essentially of from about 5 v/o to about 15 v/o hydrfluoric acid and from about 25 v/o to about 50 v/o sulfuric acid and the balance essentially water.

Claim 16

Dependent Claim 55 words

A process for removing oxide particles from a material formed from a non-silicon containing copper base alloy, said process comprising immersing said material in a solution consisting essentially of from about 5 v/o to about 15 v/o hydrfluoric acid and from about 25 v/o to about 50 v/o sulfuric acid and the balance essentially water.

Claim 17

Dependent Claim 85 words

A process for reducing the force needed to pull a copper-base alloy strip material through a tube forming die, said process comprising: immersing said copper alloy strip material in a solution at a temperature in the range of about 40° C. to about 80° C., said solution containing from about 1 v/o to about 50 v/o hydrofluoric acid and from about 5 v/o to about 50 v/o of at least one of sulfuric acid and hydrochloric acid; and pulling said strip material through said die.

Claim 18

Dependent Claim 85 words

A process for reducing the force needed to pull a copper-base alloy strip material through a tube forming die, said process comprising: immersing said copper alloy strip material in a solution at a temperature in the range of about 40° C. to about 80° C., said solution containing from about 1 v/o to about 50 v/o hydrofluoric acid and from about 5 v/o to about 50 v/o of at least one of sulfuric acid and hydrochloric acid; and pulling said strip material through said die.

Claim 19

Dependent Claim 31 words

The process of claim 12 wherein said immersing step comprises: immersing said strip material in said solution for a time in the range of about 1 sec. to about 2 minutes.

Claim 20

Dependent Claim 31 words

The process of claim 12 wherein said immersing step comprises: immersing said strip material in said solution for a time in the range of about 10 sec. to about 40 sec.

Claim 21

Dependent Claim 58 words

The process of claim 12 wherein said immersing step comprises: immersing said strip material in a solution at a temperature in the range of about 50° C. to about 65° C., said solution consisting essentially of from about 5% to about 15% hydrofluoric acid and from about 25% to about 50% sulfuric acid and the balance essentially water.

Annuity Stage	Window Opens	Payment Deadline	Surcharge Period Until	Estimated Fee	Status
3.5 Years (Year 4)	1989-04-07	1989-10-07	1990-04-08	$2000.00	Window Closed / Lapsed
7.5 Years (Year 8)	1993-04-07	1993-10-07	1994-04-08	$3760.00	Window Closed / Lapsed
11.5 Years (Year 12)	1997-04-07	1997-10-07	1998-04-08	$7700.00	Window Closed / Lapsed

Copper-base alloy cleaning solution

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