Patent US4572853A successfully refreshed from Google Patents.
US4572853A
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Resin encapsulation type semiconductor device
Assignee: Toshiba Corp
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Filing: 1984-02-21
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Granted: 1986-02-25
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Expires: 2004-02-21
Abstract
Abstract There is presented a highly reliable resin encapsulation type semiconductor device excellent in humidity resistance as well as high temperature electrical characteristics. The specific feature consists in the epoxy resin composition employed for encapsulation. This composition comprises an epoxy resin, a novolac resin as curing agent and an organic tertiary phosphine compound as curing accelerator. The resin encapsulation type semiconductor device is markedly small in leak current under hot and humid conditions and has a prolonged life due to difficult deterioration through corrosion of electrodes and aluminum wiring, as compared with those of prior art.
Inventors
- 👤 Hirotoshi Ikeya
- 👤 Shuichi Suzuki
- 👤 Takayuki Oguni
- 👤 Kazutaka Matsumoto
- 👤 Akiko Hatanaka
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-26 20:10
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/40; H10W74/47; H10W74/473; C; C08; C08G; C08G59/00; C08G59/18; C08G59/40; C08G59/62; C08G59/621; C08G59/68; C08G59/688; C08L; C08L63/00; Y; Y10; Y10T; Y10T428/00; Y10T428/23; Y10T428/239; Y10T428/25; Y10T428/252; Y10T428/31504; Y10T428/31511; Y10T428/31515; Y10T428/31525; Y10T428/31652; Y10T428/31667; Y10T428/31678; Y10T428/31688; Y10T428/31942
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
95 words
A resin encapsulation type semiconductor device comprising a semiconductor device encapsulated within a cured epoxy resin composition, said epoxy resin composition comprising (a) an epoxy resin containing a hydrolyzable chlorine in an amount less than 0.1% by weight, (b) a novolac resin containing phenolic hydroxyl groups in a ratio of about 0.5 to about 1.5 relative to the epoxy groups possessed by said epoxy resin, and (c) 0.001 to 20 parts by weight of an organic tertiary phosphine compound per 100 parts by weight of the sum of said epoxy resin and said novolac resin.
Claim 2
Dependent Claim
95 words
A resin encapsulation type semiconductor device comprising a semiconductor device encapsulated within a cured epoxy resin composition, said epoxy resin composition comprising (a) an epoxy resin containing a hydrolyzable chlorine in an amount less than 0.1% by weight, (b) a novolac resin containing phenolic hydroxyl groups in a ratio of about 0.5 to about 1.5 relative to the epoxy groups possessed by said epoxy resin, and (c) 0.001 to 20 parts by weight of an organic tertiary phosphine compound per 100 parts by weight of the sum of said epoxy resin and said novolac resin.
Claim 3
Dependent Claim
16 words
A device according to claim 1, wherein the epoxy resin composition further contains an inorganic filler.
Claim 4
Dependent Claim
17 words
A device according to claim 2, wherein the inorganic filler is silica powders and/or quartz glass powders.
Claim 5
Dependent Claim
24 words
A device according to claim 1, wherein the epoxy resin is a novolac type epoxy resin with an epoxy equivalent of 170 to 300.
Claim 6
Dependent Claim
37 words
A device according to claim 1, wherein the the ratio of the phenolic hydroxyl groups possessed by the novolac resin to the epoxy groups possessed by the epoxy resin is at least 0.5 but less than 1.
Claim 7
Dependent Claim
17 words
A device according to claim 5, wherein said ratio is in the range of 0.77 to 0.95.
Claim 8
Dependent Claim
28 words
A device according to claim 1, wherein the organic tertiary phosphine compound is a triarylphosphine or a bis(diarylphosphino)alkane with an alkane moiety of 1 to 20 carbon atoms.
Claim 9
Dependent Claim
16 words
A device according to claim 7, wherein the organic tertiary phosphine is triphenylphosphine, 1,2-bis(diphenylphosphino)ethane or bis(diphenylphosphino)methane.
Claim 10
Dependent Claim
46 words
A device according to claim 1, wherein the epoxy resin is a novolac type epoxy resin with an epoxy equivalent of 170 to 300 and the organic tertiary phosphine compound is a triarylphosphine or a bis(diarylphosphino)alkane with an alkane moiety of 1 to 20 carbon atoms.
Claim 11
Dependent Claim
75 words
A device according to claim 1, wherein the epoxy resin is a novolac type epoxy resin with an epoxy equivalent of 170 to 300, the organic tertiary phosphine compound is a triarylphosphine or a bis(diarylphosphino)alkane with an alkane moiety of 1 to 20 carbon atoms, and the ratio of the phenolic hydroxyl groups possessed by the novolac resin to the epoxy groups possessed by the epoxy resin is at least 0.5 but less than 1.
Claim 12
Dependent Claim
22 words
A device according to claim 1, wherein the epoxy resin contains chlorine ion in an amount of about 10 ppm or less.
Claim 13
Dependent Claim
17 words
A device according to claim 1, wherein the epoxy resin is a glycidyl ether type epoxy resin.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1989-02-24 | 1989-08-26 | 1990-02-25 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1993-02-24 | 1993-08-26 | 1994-02-25 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1997-02-24 | 1997-08-26 | 1998-02-25 | $7700.00 | Window Closed / Lapsed |