US4571685A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Production system for manufacturing semiconductor devices
Assignee: NEC Electronics Corp
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Filing: 1983-06-22
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Granted: 1986-02-18
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Expires: 2003-06-22
Abstract
Abstract A production system for manufacturing semiconductor devices comprises apparatus for making a semiconductor wafer during a first process step. A plurality of semiconductor devices, or semiconductor chips are arranged and incorporated in the wafer. A second apparatus processes the semiconductor material in a second process step during production. An inspection apparatus provides an automatic inspection function between the first and the second process steps. The inspection result is automatically estimated by the inspection apparatus, with respect to a specification value and a central value within the specification value. The inspection apparatus is connected to a third apparatus for carrying out at least one further manufacturing step after the second process step. Accordingly, if the estimate of the inspection apparatus is within the specification value, but out of adjustment with respect to the central value. An instruction signal can be automatically sent to either the second or the third manufacturing apparatus, to compensate in the direction of the central value.
Inventors
- 👤 Mototaka Kamoshida
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 23:00
CPC Classifications
H; H10; H10P; H10P74/00; H10P72/00; H10P72/04; H10P72/0451; H10P72/0468; H10P72/0471; H10P72/06; H10P72/0604; H10P72/0612; H10P74/23
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
356 words
A method of manufacturing semiconductor devices in a production line having a first manufacturing apparatus; a second manufacturing apparatus; an inspection apparatus located between said first and second manufacturing apparatus; a first transfer means located between said first masnufacturing apparatus and said inspection apparatus; a second transfer means located between said inspection apparatus and said second manufacturing apparatus; a control unit coupled to said inspection apparatus and said second manufacturing apparatus, said control units storing therein a specification range and a central range within said specification range; said method comprising the steps of automatically carrying out a first process step on a semiconductor wafer in said first manufacturing apparatus to form a feature in said semiconductor wafer; automatically transferring said semiconductor wafer from said first manufacturing apparatus to said inspection apparatus by use of said first transfer means; automatically inspecting said feature in said semiconductor which is formed by said first manufacturing apparatus; sending a first information signal indicating an inspected value of said feature to said control unit; estimating said inspected value in said control unit to determine whether said inspected value is outside said specification range, within said specification range but outside said central value, or within both said specification and central values; sending a second information signal from said control unit to said second manufacturing apparatus when said inspected value is within said specification range, but outside said central range; automatically transferring said semiconductor wafer from said inspection apparatus to said second manufacturing apparatus by use of said second transfer means when said inspected value is within both said specification and central ranges or within said specification range, but outside said central range; and automatically carrying out a second process step on said semiconductor wafer in said second manufacturing apparatus under a first condition when said inspected value of said semiconductor wafer is within both specification and central ranges and under a second condition when said inspected value of said semiconductor wafer is within said specification range, but outside said central range; said second condition being changed from said first condition by said second information to compensate a deviation from said central range.
Claim 2
Independent Claim
356 words
A method of manufacturing semiconductor devices in a production line having a first manufacturing apparatus; a second manufacturing apparatus; an inspection apparatus located between said first and second manufacturing apparatus; a first transfer means located between said first masnufacturing apparatus and said inspection apparatus; a second transfer means located between said inspection apparatus and said second manufacturing apparatus; a control unit coupled to said inspection apparatus and said second manufacturing apparatus, said control units storing therein a specification range and a central range within said specification range; said method comprising the steps of automatically carrying out a first process step on a semiconductor wafer in said first manufacturing apparatus to form a feature in said semiconductor wafer; automatically transferring said semiconductor wafer from said first manufacturing apparatus to said inspection apparatus by use of said first transfer means; automatically inspecting said feature in said semiconductor which is formed by said first manufacturing apparatus; sending a first information signal indicating an inspected value of said feature to said control unit; estimating said inspected value in said control unit to determine whether said inspected value is outside said specification range, within said specification range but outside said central value, or within both said specification and central values; sending a second information signal from said control unit to said second manufacturing apparatus when said inspected value is within said specification range, but outside said central range; automatically transferring said semiconductor wafer from said inspection apparatus to said second manufacturing apparatus by use of said second transfer means when said inspected value is within both said specification and central ranges or within said specification range, but outside said central range; and automatically carrying out a second process step on said semiconductor wafer in said second manufacturing apparatus under a first condition when said inspected value of said semiconductor wafer is within both specification and central ranges and under a second condition when said inspected value of said semiconductor wafer is within said specification range, but outside said central range; said second condition being changed from said first condition by said second information to compensate a deviation from said central range.
Claim 3
Dependent Claim
31 words
The method of claim 1 further comprising a step of sending a third information signal of estimated results of said inspected value from said control unit to said first manufacturing apparatus.
Claim 4
Dependent Claim
27 words
The method of claim 1 in which said first process step is forming a gate electrode and said second process step is forming source and drain regions.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1989-02-17 | 1989-08-19 | 1990-02-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1993-02-17 | 1993-08-19 | 1994-02-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1997-02-17 | 1997-08-19 | 1998-02-18 | $7700.00 | Window Closed / Lapsed |