Patent US4569876A successfully refreshed from Google Patents.
US4569876A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Multi-layered substrate having a fine wiring structure for LSI or VLSI circuits
Assignee: NEC Corp
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Filing: 1984-08-08
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Granted: 1986-02-11
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Expires: 2004-08-08
Abstract
Abstract Good electrical connection between adjacent metal layers in a multi-layered substrate is provided by embedding a conductive material in via-holes in the insulator which separates the adjacent metal layers. This conductive material can be a low temperature sintered metal such as gold, or a conductive organic paste. The presence of the conductive material avoids problems associated with photoresist material that adheres to the side walls of the via-holes during the metallization process.
Inventors
- 👤 Shoji Nakakita
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-27 10:40
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/611; H05; H05K; H05K3/00; H05K3/40; H05K3/4038; H05K3/4053; H05K3/4069; H05K3/46; H05K3/4644; H10W70/01; H10W70/05; H10W70/095; H10W70/67; H10W70/68; H10W70/685; H05K1/00; H05K1/02; H05K1/09; H05K1/092; H05K1/095; H05K2201/00; H05K2201/01; H05K2201/0137; H05K2201/0154; H05K2203/00; H05K2203/14; H05K2203/1461; H05K3/10; H05K3/108; H05K3/38; H05K3/388; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T428/00; Y10T428/24; Y10T428/24273; Y10T428/24281; Y10T428/24289; Y10T428/31504; Y10T428/31678; Y10T428/31681
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
88 words
A high density multi-layered substrate comprising: an insulated substrate; a first metallic conductive layer formed on the insulated substrate; an organic insulated layer having via-holes of the shape of one of a cylinder and a reverse tape disposed over and exposing a portion of said first metallic conductive layer; one of a low temperature sintered metal and an organic conductor embedded in said via holes; and a second metallic layer formed on said organic insulated layer and one of the low temperature sintered metal and the organic conductor.
Claim 2
Dependent Claim
88 words
A high density multi-layered substrate comprising: an insulated substrate; a first metallic conductive layer formed on the insulated substrate; an organic insulated layer having via-holes of the shape of one of a cylinder and a reverse tape disposed over and exposing a portion of said first metallic conductive layer; one of a low temperature sintered metal and an organic conductor embedded in said via holes; and a second metallic layer formed on said organic insulated layer and one of the low temperature sintered metal and the organic conductor.
Claim 3
Dependent Claim
11 words
The substrate of claim 1 wherein said insulated layer comprises polyimide.
Claim 4
Dependent Claim
11 words
The substrate of claim 1 wherein said sintered metal is gold.
Claim 5
Dependent Claim
18 words
The substrate of claim 1 wherein said organic conductor comprises a mixture of gold powder and polyamide acid.
Claim 6
Dependent Claim
11 words
The substrate of claim 1 wherein the via-holes are substantially cylindrical.
Claim 7
Independent Claim
107 words
A method for forming a multi-layered substrate, comprising the steps of: depositing the first layer of metal on a substrate; forming said metal layer into a first predetermined pattern; coating the patterned metal layer with an organic insulator; forming via-holes at predetermined locations in the organic insulator in the shape of one of a cylinder and a reverse taper to expose portions of the patterned metal layer; embedding one of a powderedmetal and a conductive organic paste in said via holes; depositing a second layer of metal on the organic insulator and the powdered metal; patterning said second metal layer in accordance with a second predetermined pattern.
Claim 8
Independent Claim
107 words
A method for forming a multi-layered substrate, comprising the steps of: depositing the first layer of metal on a substrate; forming said metal layer into a first predetermined pattern; coating the patterned metal layer with an organic insulator; forming via-holes at predetermined locations in the organic insulator in the shape of one of a cylinder and a reverse taper to expose portions of the patterned metal layer; embedding one of a powderedmetal and a conductive organic paste in said via holes; depositing a second layer of metal on the organic insulator and the powdered metal; patterning said second metal layer in accordance with a second predetermined pattern.
Claim 9
Dependent Claim
21 words
The method of claim 6 further including the step of heating said powdered metal after it is embedded in said via-holes.
Claim 10
Dependent Claim
24 words
The method of claim 6 wherein the step of forming via-holes at predetermined locations includes forming the via-holes to be substantially cylindrical in configuration.
References Cited (Backward Citations)
US4360570A
Cited
US4381327A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1989-02-10 | 1989-08-12 | 1990-02-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1993-02-10 | 1993-08-12 | 1994-02-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1997-02-10 | 1997-08-12 | 1998-02-11 | $7700.00 | Window Closed / Lapsed |