Patent US4568879A successfully refreshed from Google Patents.
US4568879A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Marking apparatus
Assignee: NEC Corp
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Filing: 1982-04-19
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Granted: 1986-02-04
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Expires: 2002-04-19
Abstract
Abstract A marking apparatus has an arm with a seat section for enabling the arm to be mounted on a support plate, in the proximity at one of its ends. A main body of an actuating section is fixedly secured to one surface of the arm in the proximity of its other end. The main body of the actuating section has a function of placing a "defective mark" on a defective semiconductor chip, in response to a signal applied thereto.
Inventors
- 👤 Seiichi Nakamura
- 👤 Isao Nishigaya
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 03:15
CPC Classifications
G; G01; G01R; G01R31/00; G01R31/28; G01R31/316; G01R1/00; G01R1/02; G01R1/06; G01R1/067; G01R1/073; G01R1/07307; G01R1/07342
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
282 words
A prober comprising a support plate having a measurement gap space and having a flat upper surface, a table for loading a semiconductor wafer, said table being positioned under said measurement gap space, first means for applying electric power for testing semiconductor chips in said semiconductor wafer, second means located above said measurement gap space for supplying said electric power to said first means, marking apparatus for marking a defective semiconductor chip in said semiconductor wafer, said marking apparatus including an arm having a flat bottom surface fixed onto said flat upper surface of said support plate at a first portion of said flat bottom surface and extending over said measurement gap space, an actuator suspended from a second portion of said flat bottom surface of said arm and positioned within said measurement gap space above said semiconductor wafer and at a level which is lower than the level of said arm, and a marker for applying a mark to said defective semiconductor chip, said marker being coupled to and actuated by said actuator, said marker being positioned within said measurement gap space and located at a level lower than the level of said arm, said first means including a probe card positioned between said actuator of said marking apparatus and said table for loading said semiconductor wafer and having a plurality of probes adapted to contact with electrodes of said semiconductor chips, said first means further including conductor members electrically contacted with said respective probes of said probe card, each of said conductor members being extended in the vertical direction from the contacted portion with said probe to a level which is above said arm and coupled to said second means.
Claim 2
Dependent Claim
282 words
A prober comprising a support plate having a measurement gap space and having a flat upper surface, a table for loading a semiconductor wafer, said table being positioned under said measurement gap space, first means for applying electric power for testing semiconductor chips in said semiconductor wafer, second means located above said measurement gap space for supplying said electric power to said first means, marking apparatus for marking a defective semiconductor chip in said semiconductor wafer, said marking apparatus including an arm having a flat bottom surface fixed onto said flat upper surface of said support plate at a first portion of said flat bottom surface and extending over said measurement gap space, an actuator suspended from a second portion of said flat bottom surface of said arm and positioned within said measurement gap space above said semiconductor wafer and at a level which is lower than the level of said arm, and a marker for applying a mark to said defective semiconductor chip, said marker being coupled to and actuated by said actuator, said marker being positioned within said measurement gap space and located at a level lower than the level of said arm, said first means including a probe card positioned between said actuator of said marking apparatus and said table for loading said semiconductor wafer and having a plurality of probes adapted to contact with electrodes of said semiconductor chips, said first means further including conductor members electrically contacted with said respective probes of said probe card, each of said conductor members being extended in the vertical direction from the contacted portion with said probe to a level which is above said arm and coupled to said second means.
Claim 3
Dependent Claim
19 words
The prober of claim 1, in which said actuator includes a solenoid coil, and said marker includes a needle.
Claim 4
Dependent Claim
36 words
The marking apparatus of claim 1, in which said arm has two ends fixed to said support plate and a central portion of said arm is fixedly secured to said support plate between said two ends.
Claim 5
Dependent Claim
27 words
The marking apparatus of claim 1, in which said arm has one end fixed to said support plate and has another end fixedly secured to said actuator.
Claim 6
Dependent Claim
14 words
The marking apparatus of claim 1, in which said actuator has a solenoid coil.
Claim 7
Dependent Claim
24 words
The marking apparatus of claim 5 in which said marker has a marking off needle for scratching the surface of said defective semiconductor chip.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1989-02-03 | 1989-08-05 | 1990-02-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1993-02-03 | 1993-08-05 | 1994-02-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1997-02-03 | 1997-08-05 | 1998-02-04 | $7700.00 | Window Closed / Lapsed |