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US4568571A
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Process for the adhesion-activation of polyamide substrates for electroless metallization
Assignee: Bayer AG
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Filing: 1984-10-26
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Granted: 1986-02-04
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Expires: 2004-10-26
Abstract
Abstract A mild activation process for the adhesion-activation of polyamide mouldings for electroless metallization comprises treating the substrates, successively or simultaneously, with the solution of a mixture of CaCl 2 , LiCl and/or MgCl 2 with AlCl 3 , FeCl 3 and/or TiCl 4 in a lower alcohol and with an activator solution based on inorganic complex compounds of the formula M.sup.n+ [E.sup.m+ Hal.sub.z.sup.- ] in which M represents two hydrogen or alkali metal atoms or one alkaline earth metal atom, Hal represents a halogen, preferably Cl, and E represents a noble metal atom of the 1st or 8th subgroup of the periodic table, having the valency m and the coordination number z (z-m=n), or with customary colloidal or ionic systems of these noble metals.
Inventors
- 👤 Kirkor Sirinyan
- 👤 Gerhard D. Wolf
- 👤 Rudolf Merten
- 👤 Ulrich VON Gizycki
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-06 09:11
CPC Classifications
C; C08; C08J; C08J7/00; C08J7/12; C23; C23C; C23C18/00; C23C18/16; C23C18/18; C23C18/20; C23C18/28; C08J2377/00; H; H05; H05K; H05K1/00; H05K1/02; H05K1/03; H05K1/0313; H05K1/032; H05K1/0346; H05K3/00; H05K3/10; H05K3/18; H05K3/181; H05K3/38; H05K3/381
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
142 words
Process for the adhesion-activation of substrate surfaces of polyamide mouldings for electroless metallisation, characterised in that the substrates are treated, successively or simultaneously, with (a) the solution of a mixture of CaCl 2 , LiCl and/or MgCl 2 with AlCl 3 , FeCl 3 and/or TiCl 4 in a lower alcohol and (b) with an activator solution based on (1) inorganic complex compounds of the formula M.sup.n+ [E.sup.m+ Hal.sub.z.sup.- ] in which M represents two hydrogen or alkali metal atoms or one alkaline earth metal atom, Hal represents a halogen, preferably Cl, and E represents a noble metal atom of the 1st or 8th subgroup of the periodic table, having the valency m and the coordination number z, with z-m=n, or (2) colloidal systems of these noble metals or (3) non-complex salts of these noble metals of the formula E.sup.m+ Hal.sub.p.sup.- (p=m)
Claim 2
Dependent Claim
142 words
Process for the adhesion-activation of substrate surfaces of polyamide mouldings for electroless metallisation, characterised in that the substrates are treated, successively or simultaneously, with (a) the solution of a mixture of CaCl 2 , LiCl and/or MgCl 2 with AlCl 3 , FeCl 3 and/or TiCl 4 in a lower alcohol and (b) with an activator solution based on (1) inorganic complex compounds of the formula M.sup.n+ [E.sup.m+ Hal.sub.z.sup.- ] in which M represents two hydrogen or alkali metal atoms or one alkaline earth metal atom, Hal represents a halogen, preferably Cl, and E represents a noble metal atom of the 1st or 8th subgroup of the periodic table, having the valency m and the coordination number z, with z-m=n, or (2) colloidal systems of these noble metals or (3) non-complex salts of these noble metals of the formula E.sup.m+ Hal.sub.p.sup.- (p=m)
Claim 3
Dependent Claim
19 words
Process according to claim 1, characterised in that the substrates thus treated are introduced directly into the metallising baths.
Claim 4
Dependent Claim
18 words
Process according to claim 1, characterised in that a mixture of CaCl 2 and AlCl 3 is used.
Claim 5
Dependent Claim
24 words
Process according to claim 1, characterised in that the pretreatment is carried out with a solution of CaCl 2 and AlCl 3 in methanol.
Claim 6
Dependent Claim
23 words
Process according to claim 1, characterised in that the pretreated substrates are treated in an ammonia-alkaline metallising bath containing aminoborane or containing formalin.
Claim 7
Dependent Claim
18 words
Process according to claim 1, characterised in that the activator solutions used are those based on complex compounds.
Claim 8
Dependent Claim
19 words
Process according to claim 1, characterised in that Pd, Pt, Au or Ag are used as the noble metals.
References Cited (Backward Citations)
EP0081129A1
Cited
US4493861A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1989-02-03 | 1989-08-05 | 1990-02-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1993-02-03 | 1993-08-05 | 1994-02-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1997-02-03 | 1997-08-05 | 1998-02-04 | $7700.00 | Window Closed / Lapsed |