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US4568012A Expired / Lapsed US ⏱️ 0.0 years remaining

Soldering apparatus

Assignee: Toshiba Mechatronics Co Ltd
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Filing: 1982-12-23
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Granted: 1986-02-04
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Expires: 2002-12-23
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Abstract

Abstract A soldering apparatus has a base, and a solder tank and a nozzle arranged in tandem with the base. A partition plate is arranged in the solder tank. The partition plate, a bottom plate disposed at the bottom of the solder tank, and a lower plate covering the bottom of the solder tank define a channel communicating with a portion of the solder tank remote form the nozzle and the interior of the nozzle. A moving magnetic field generating mechanism for exerting a force toward the nozzle to a solder in the channel is arranged in the base to extend along the channel under the partition wall. That portion of the solder tank at the side of the nozzle constitutes a wide portion of the same width as that of the nozzle while the remaining portion of the solder tank constitutes a narrow portion.

Inventors

  • 👤 Fumio Kakuhata
  • 👤 Junzo Taguchi

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-01 06:53
CPC Classifications
B; B23; B23K; B23K3/00; B23K3/06; B23K3/0646; B23K3/0653; B23K2101/00; B23K2101/36; B23K2101/42

Claims Analysis

Total Claims: 11
Claim 1
Independent Claim 224 words
A soldering apparatus comprising: a base; an elongate lower plate mounted on said base and having an elongate hole extending along the lower plate; a nozzle arranged on one end of said lower plate to communicate with said hole and having on a top thereof a horizontal slip-shaped orifice directed upward and toward the other end of said lower plate; a solder tank extending on said lower plate from said nozzle to the other end of said lower plate, said nozzle including a pressure control element extending substantially horizontally, said pressure control element having holes, diameters of said holes at a center of said pressure control element being smaller than diameters of holes remote from said center of said pressure control element; a bottom plate covering the underside of said hole of said lower plate; a partition plate extending in said solder tank from said nozzle to a vicinity of one end of said solder tank at the side of the other end of said lower plate and defining together with said bottom plate a channel communicating at said one end of said solder tank with said nozzle; and a moving magnetic field generating mechanism arranged along said channel in said base for generating a force to flow molten solder in said channel from said one end of said solder tank to said nozzle.
Claim 2
Dependent Claim 224 words
A soldering apparatus comprising: a base; an elongate lower plate mounted on said base and having an elongate hole extending along the lower plate; a nozzle arranged on one end of said lower plate to communicate with said hole and having on a top thereof a horizontal slip-shaped orifice directed upward and toward the other end of said lower plate; a solder tank extending on said lower plate from said nozzle to the other end of said lower plate, said nozzle including a pressure control element extending substantially horizontally, said pressure control element having holes, diameters of said holes at a center of said pressure control element being smaller than diameters of holes remote from said center of said pressure control element; a bottom plate covering the underside of said hole of said lower plate; a partition plate extending in said solder tank from said nozzle to a vicinity of one end of said solder tank at the side of the other end of said lower plate and defining together with said bottom plate a channel communicating at said one end of said solder tank with said nozzle; and a moving magnetic field generating mechanism arranged along said channel in said base for generating a force to flow molten solder in said channel from said one end of said solder tank to said nozzle.
Claim 3
Dependent Claim 102 words
An apparatus according to claim 1, wherein said moving magnetic field generating mechanism comprises a stator iron core having therein coil grooves formed at equal intervals perpendicularly to the longitudinal direction of said channel, and stator coils, each of which is placed in two of said coil grooves spaced apart from each other by a constant distance, which are arranged side by side along the channel at equal intervals and to which alternative currents from a multi-phase power supply are applied according to the phase sequence of said power supply so that magnetic fields generated by said mechanism move toward said nozzle.
Claim 4
Dependent Claim 29 words
An apparatus according to claim 2, wherein said partition plate comprises another iron core which has substantially the same width and length as those of said stator iron core.
Claim 5
Dependent Claim 13 words
An apparatus according to claim 3, wherein said another iron core is solid.
Claim 6
Dependent Claim 21 words
An apparatus according to claim 3, further comprising an upper plate mounted on a rear surface of said another iron core.
Claim 7
Dependent Claim 21 words
An apparatus according to claim 2, further comprising a heat-insulating plate interposed between said bottom plate and said stator iron core.
Claim 8
Dependent Claim 31 words
An apparatus according to claim 2, further comprising a fan mounted on a side wall of said base for supplying cooling air flowing along said coil grooves of said stator core.
Claim 9
Dependent Claim 37 words
An apparatus according to claim 1, wherein said solder tank comprises a wide portion communicating with said nozzle and having the same width as a width of said nozzle, and a narrow portion extending along said channel.
Claim 10
Dependent Claim 28 words
An apparatus according to claim 8, wherein said channel is located immediately below said narrow portion and has a width smaller than a width of said narrow portion.
Claim 11
Dependent Claim 62 words
The apparatus of claim 2 wherein each of said coils has a first portion positioned in a first groove and a second portion positioned in a second groove separted from said first groove by a third groove, whereby a coil adjacent to each of said coils has a first portion in said third groove, whereby all of said coils overlap one another.

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1989-02-03 1989-08-05 1990-02-04 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1993-02-03 1993-08-05 1994-02-04 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1997-02-03 1997-08-05 1998-02-04 $7700.00 Window Closed / Lapsed

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