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US4565610A Expired / Lapsed US ⏱️ 0.0 years remaining

Bath and process for plating lead and lead/tin alloys

Assignee: Shipley Co Inc
•
Filing: 1985-04-15
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Granted: 1986-01-21
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Expires: 2005-04-15
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Abstract

Abstract This invention relates to the electrodeposition of tin, lead and particularly tin-lead alloys from an electroplating bath comprising a lead and/or tin alkylsulfonate, an alkylsulfonic acid in a sufficient amount to impart a pH below about 3 to the bath, and various additives to improve the brightness of the deposits, the useful current density ranges, and/or the solderability of tin-lead alloy deposits including quaternary nitrogen wetting agents containing a fatty acid radical, alkylene oxides, pyridine compounds, aromatic aldehydes, acetaldehyde and/or a bismuth compound.

Inventors

  • 👤 Fred I. Nobel
  • 👤 Barnet Ostrow
  • 👤 David N. Schram

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-03 11:17
CPC Classifications
C; C25; C25D; C25D3/00; C25D3/02; C25D3/30; C25D3/32; C25D3/34; C25D3/36; C25D3/56; C25D3/60; H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3465; H05K3/3473

Claims Analysis

Total Claims: 11
Claim 1
Independent Claim 64 words
An electroplating bath for the electrodeposition of lead and lead-tin alloys comprising an aqueous solution containing the metal or metals as a lower alkylsulfonate salt, a soluble alkylsulfonic acid in a sufficient amount to give a pH below about 3 to the bath, an aromatic aldehyde and a soluble bismuth compound in a sufficient amount to extend current density range for producing bright deposits.
Claim 2
Dependent Claim 64 words
An electroplating bath for the electrodeposition of lead and lead-tin alloys comprising an aqueous solution containing the metal or metals as a lower alkylsulfonate salt, a soluble alkylsulfonic acid in a sufficient amount to give a pH below about 3 to the bath, an aromatic aldehyde and a soluble bismuth compound in a sufficient amount to extend current density range for producing bright deposits.
Claim 3
Dependent Claim 18 words
The bath of claim 1 containing acetaldehyde in a sufficient amount to extend the useful current density range.
Claim 4
Dependent Claim 62 words
An electroplating bath for the electrodeposition of lead-tin alloys comprising an aqueous solution containing lead and tin as soluble alkyl-sulfonates, a sufficient amount of a soluble alkylsulfonic acid salt to impart a pH value below about 3 to said bath, and an aromatic aldehyde and a soluble bismuth compound in a sufficient amount to extend current density range for producing bright deposits.
Claim 5
Dependent Claim 62 words
An electroplating bath for the electrodeposition of lead-tin alloys comprising an aqueous solution containing lead and tin as soluble alkyl-sulfonates, a sufficient amount of a soluble alkylsulfonic acid salt to impart a pH value below about 3 to said bath, and an aromatic aldehyde and a soluble bismuth compound in a sufficient amount to extend current density range for producing bright deposits.
Claim 6
Dependent Claim 18 words
The bath of claim 3 containing acetaldehyde in a sufficient amount to extend the useful current density range.
Claim 7
Dependent Claim 21 words
A method for electroplating lead-tin alloys wnhich comprises immersing a substrate to be plated into the electroplating bath of claim 4.
Claim 8
Dependent Claim 21 words
A method for electroplating lead-tin alloys which comprises immersing a substrate to be plated into the electroplating bath of claim 3.
Claim 9
Independent Claim 73 words
A method for electroplating lead and lead-tin alloys which comprises immersing a substrate to be plated into an electroplating bath comprising an aqueous solution containing lead and tin as soluble alkyl-sulfonates, a sufficient amount of a soluble alkylsulfonic acid salt to impart a pH value below about 3 to said bath, and an aromatic aldehyde and a soluble bismuth compound in a sufficient amount to extend current density range for producing bright deposits.
Claim 10
Independent Claim 73 words
A method for electroplating lead and lead-tin alloys which comprises immersing a substrate to be plated into an electroplating bath comprising an aqueous solution containing lead and tin as soluble alkyl-sulfonates, a sufficient amount of a soluble alkylsulfonic acid salt to impart a pH value below about 3 to said bath, and an aromatic aldehyde and a soluble bismuth compound in a sufficient amount to extend current density range for producing bright deposits.
Claim 11
Dependent Claim 23 words
The method of claim 7 wherein the electroplating bath further comprises acetaldehyde in a sufficient amount to extend the useful current density range.

References Cited (Backward Citations)

GB555929A Cited
US2525942A Cited
US3663384A Cited
US3905878A Cited
US4000047A Cited
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USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1989-01-20 1989-07-22 1990-01-21 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1993-01-20 1993-07-22 1994-01-21 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1997-01-20 1997-07-22 1998-01-21 $7700.00 Window Closed / Lapsed

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