Pressure transducer

Claim 2

A transducer having a first sensing diaphragm and a second sensing diaphram each configured such that a first pressure (Pl) is applied to the first diaphragm and a second pressure (P2) is applied to the second diaphragm, and wherein both diaphragms are formed on a diaphragm wafer and means defining an enclosed common fluid cavity fluidly open to each diaphragm responsive to such pressure, said cavity being filled with a substantially non-compressible fluid such that deflection of the diaphragms is representative of the pressure differential (P1-P2), the first and second diaphragms being formed on the one substantially flat face of the diaphragm wafer.

Claim 3

A transducer according to claim 1 further comprising sensing means coupled to at least one of the diaphragms for measuring the differential pressure Pl-P2.

Claim 4

A transducer in accord with claim 2 wherein said fluid comprises a fluid with a low thermal coefficient of expansion.

Claim 5

A transducer in accord with claim 2 wherein the sensing means comprises a sensor selected from the group consisting of resistance bridge, a resistance, a piezoelectric sensor, or a piezoresistance sensor.

Claim 6

A transducer in accord with claim 1 wherein the diaphragm wafer is formed from a material which is selected from a group consisting of silcon, quartz or sapphire.

Claim 7

A transducer having a first sensing diaphragm and a second sensing diaphragm each configured such that a first pressure (Pl) is applied to the first diaphragm and a second pressure (P2) is applied to the second diaphragm, and wherein both diaphragms are formed on a diaphragm wafer and wherein each diaphragm responsive to such pressure respectively also affects a fluid in an enclosed common fluid cavity such that deflection of the diaphragms is representative of the pressure differential (Pl-P2), the first and the second diaphragms being formed on one substantially flat face of the diaphragm wafer sensing means coupled to at least one of the diaphragms for measuring the differential pressure (Pl-P2), and an overpressure stop wafer means disposed on and bonded to the diaphragm wafer and for cooperating with the diaphragm wafer to form the common fluid cavity, and having support means for providing an overpressure stop for each of the diaphragms.

Claim 8

A transducer having a first sensing diaphragm and a second sensing diaphragm each configured such that a first pressure (Pl) is applied to the first diaphragm and a second pressure (P2) is applied to the second diaphragm, and wherein both diaphragms are formed on a diaphragm wafer and wherein each diaphragm responsive to such pressure respectively also affects a fluid in an enclosed common fluid cavity such that deflection of the diaphragms is representative of the pressure differential (Pl-P2), the first and the second diaphragms being formed on one substantially flat face of the diaphragm wafer sensing means coupled to at least one of the diaphragms for measuring the differential pressure (Pl-P2), and an overpressure stop wafer means disposed on and bonded to the diaphragm wafer and for cooperating with the diaphragm wafer to form the common fluid cavity, and having support means for providing an overpressure stop for each of the diaphragms.

Claim 9

A transducer according to claim 6 wherein the support means is a recess defined in the overpressure stop wafer having a substantially flat surface thereon for providing an overpressure stop for said diaphragms.

Claim 10

A transducer according to claim 7 wherein the sensing means further comprises a layer of electrically conductive material disposed on at least one of the diaphragms, and at least one layer of electrically conductive material disposed on the overpressure stop wafer proximate to such diaphragm for providing at least one capacitor responsive to deflection of said diaphragm.

Claim 11

A transducer according to claim 8 wherein said fluid comprises a noncompressible liquid having a high dielectric constant.

Claim 12

A transducer having a first sensing diaphragm and a second sensing diaphragm each configured such that a first pressure (Pl) is applied to the first diaphragm and a second pressure (P2) is applied to the second diaphragm, and wherein both diaphragms are formed on a diaphragm wafer and wherein each diaphragm responsive to such pressure respectively also affects a fluid in an enclosed common fluid cavity filled with a substantially non-compressive fluid such that deflection of the diaphragms is representative of the pressure differential (Pl-P2), the diaphragm wafer having one substantially flat face, and separated recess means defined in the opposite face of the diaphragm wafer means from the one flate face to form separate reduced thickness locations defining the first and the second diaphragms.

Claim 13

A transducer having a first sensing diaphragm and a second sensing diaphragm each configured such that a first pressure (Pl) is applied to the first diaphragm and a second pressure (P2) is applied to the second diaphragm, and wherein both diaphragms are formed on a diaphragm wafer and wherein each diaphragm responsive to such pressure respectively also affects a fluid in an enclosed common fluid cavity filled with a substantially non-compressive fluid such that deflection of the diaphragms is representative of the pressure differential (Pl-P2), the diaphragm wafer having one substantially flat face, and separated recess means defined in the opposite face of the diaphragm wafer means from the one flate face to form separate reduced thickness locations defining the first and the second diaphragms.