Patent US4552422A successfully refreshed from Google Patents.
US4552422A
Expired / Lapsed
US
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Modular receptacle pin grid array
Assignee: TE Connectivity Corp
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Filing: 1983-03-14
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Granted: 1985-11-12
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Expires: 2003-03-14
Abstract
Abstract A modular receptacle housing is formed by four identical housing modules of molded rigid insulative material, which modules are interlocked to form a single housing. Each housing module carries a plurality of receptacle terminals. The arrangement of modules can readily be adopted to accommodate a wide variety of pin counts and configurations.
Inventors
- 👤 Benny M. Bennett
- 👤 Robert F. Meehan
- 👤 Dale R. Zell
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 16:37
CPC Classifications
H; H05; H05K; H05K7/00; H05K7/02; H05K7/10; H05K7/1053; H05K7/1076; H05K7/1084
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
175 words
A modular receptacle receiving a high density array of pin terminals from an integrated chip carrier, the receptacle having a mating face and an opposite directed mounting face with a plurality of terminal passages extending there between in parallel spaced rows, a like plurality of receptacle terminals, each terminal mounted in a respective passage and having a receptacle pin engaging portion directed toward said mating face, and a mounting portion extending from the mounting face contacting a conductive portion of a circuit board characterized in that said receptacle is formed by four intermating modules of insulative material, each module having a longer outer side and a shorter inner side connected at opposite ends, by stepped end profiles, each step of each end profile corresponding to a row of passages, and a keying block recessed from said mating face and extending from the inner side of each said module whereby said modules are interfitted by said stepped end profiles with the recessed keying blocks forming a cavity to receive a chip of a chip carrier therein.
Claim 2
Dependent Claim
175 words
A modular receptacle receiving a high density array of pin terminals from an integrated chip carrier, the receptacle having a mating face and an opposite directed mounting face with a plurality of terminal passages extending there between in parallel spaced rows, a like plurality of receptacle terminals, each terminal mounted in a respective passage and having a receptacle pin engaging portion directed toward said mating face, and a mounting portion extending from the mounting face contacting a conductive portion of a circuit board characterized in that said receptacle is formed by four intermating modules of insulative material, each module having a longer outer side and a shorter inner side connected at opposite ends, by stepped end profiles, each step of each end profile corresponding to a row of passages, and a keying block recessed from said mating face and extending from the inner side of each said module whereby said modules are interfitted by said stepped end profiles with the recessed keying blocks forming a cavity to receive a chip of a chip carrier therein.
Claim 3
Dependent Claim
29 words
A modular receptacle according to claim 1 further characterized by at least one keying aperture in each said module positioning to receive a respective keying pin of said carrier.
Claim 4
Dependent Claim
19 words
A modular receptacle according to claim 1 further characterized by said keying blocks interfitting to hold said receptacle together.
Claim 5
Dependent Claim
103 words
Modules forming an integrated circuit receptacle, each said module comprising a unitary member of rigid insulative material having a mating surface and an oppositely directed mounting surface, a plurality of terminal passages extending between said surfaces and aligned in at least one row, a longer outer side and a shorter inner side connected at opposite ends by stepped configurations, each step being associated with a corresponding row of passages, and a keying block extending from the shorter inner side of each said module, whereby four of said modules are assembled to form a single receptacle with said steps and said keying blocks interfitting.
Claim 6
Dependent Claim
103 words
Modules forming an integrated circuit receptacle, each said module comprising a unitary member of rigid insulative material having a mating surface and an oppositely directed mounting surface, a plurality of terminal passages extending between said surfaces and aligned in at least one row, a longer outer side and a shorter inner side connected at opposite ends by stepped configurations, each step being associated with a corresponding row of passages, and a keying block extending from the shorter inner side of each said module, whereby four of said modules are assembled to form a single receptacle with said steps and said keying blocks interfitting.
Claim 7
Dependent Claim
34 words
Modules according to claim 4 further comprising a receptacle terminal in each said passage, each terminal having a receptacle portion directed toward said mating face and a mounting portion extending from said mounting face.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1988-11-11 | 1989-05-13 | 1989-11-12 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1992-11-11 | 1993-05-13 | 1993-11-12 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1996-11-11 | 1997-05-13 | 1997-11-12 | $7700.00 | Window Closed / Lapsed |