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Method for reducing leakage currents in semiconductor devices

Assignee: MICRO USPD Inc
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Filing: 1984-07-24
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Granted: 1985-11-05
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Expires: 2004-07-24
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Abstract

Abstract A method for reducing leakage currents in passivated semiconductor devices includes subjecting the passivation layer to a corona discharge for reducing or eliminating the inversion layer produced by the characteristic passivation layer charge.

Inventors

  • 👤 Philip L. Hower
  • 👤 Eric K. Li

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-09 03:28
CPC Classifications
H; H10; H10P; H10P95/00; H10W; H10W74/00; H10W74/01; H10W74/10; H10W74/131; H10W74/134; H10W90/00; H10W90/701; H10W90/721; H10W90/724; Y; Y10; Y10S; Y10S438/00; Y10S438/91; Y10S438/958

Claims Analysis

Total Claims: 16
Claim 1
Independent Claim 99 words
A method of reducing leakage currents from ions in nonpassivated portions within a multilayer semiconductor device comprising the steps of: passivating a portion of the surface of said multilayer semiconductor device; generating a corona discharge at a V+ potential which produces ions which drift from said corona discharge to a V- potential; placing said multilayer semiconductor device between said V+ and V- potentials to urge the ions to drift to said passivated portion, wherein the leakage currents from nonpassivated portions are reduced by neutralizing the ions within said multilayer semiconductor device by said ions resulting from said corona discharge.
Claim 2
Independent Claim 99 words
A method of reducing leakage currents from ions in nonpassivated portions within a multilayer semiconductor device comprising the steps of: passivating a portion of the surface of said multilayer semiconductor device; generating a corona discharge at a V+ potential which produces ions which drift from said corona discharge to a V- potential; placing said multilayer semiconductor device between said V+ and V- potentials to urge the ions to drift to said passivated portion, wherein the leakage currents from nonpassivated portions are reduced by neutralizing the ions within said multilayer semiconductor device by said ions resulting from said corona discharge.
Claim 3
Dependent Claim 12 words
The method of claim 1, wherein said passivated portion comprises a moat.
Claim 4
Dependent Claim 76 words
The method of claim 2, further comprising the steps of: providing a semiconductor device in wafer form with at least one active region and a non-alkaline glass passivation portion, the passivation portion being formed in a last high temperature process step in the wafer fabrication in which the glass temperature is raised to the firing temperature of the glass, no further processing steps employing conditions resulting in charge creation; and heating the device above ambient temperature.
Claim 5
Dependent Claim 71 words
The method of claim 2, further comprising the steps of: providing a semiconductor device with at least one active region and a nonalkaline glass passivation portion, the passivation portion being formed in a last high temperature process step in device formation in which the glass temperature is raised to the firing temperature of the glass, no further processing steps employing conditions resulting in charge creation; heating the device above ambient temperature.
Claim 6
Dependent Claim 26 words
The method of claim 4 wherein the temperature to which the passivation layer is heated is below that charge creation temperature associated with the cooling time.
Claim 7
Dependent Claim 52 words
The method of claim 4 wherein the corona discharge results in the reduction of the inversion layer caused by the charge acquired by the passivation layer and wherein the reduction in the inversion layer is detected by a shift in the bulk and surface generation to that associated with bulk generation alone.
Claim 8
Dependent Claim 18 words
The method of claim 2 and further including the step of heating the semiconductor device during corona discharge.
Claim 9
Dependent Claim 22 words
The method of claim 7 and further including the steps of cooling said semiconductor device and maintaining said corona discharge during cooling.
Claim 10
Dependent Claim 43 words
The method of claim 2, wherein said multilayer semiconductor comprises a top and a bottom layer, each having a moat thereon, said method further comprising the steps of: inverting said multilayer semiconductor; and replacing said multilayer semiconductor between said V+ and V- potentials.
Claim 11
Dependent Claim 13 words
The method of claim 1, wherein said V- potential comprises a ground plane.
Claim 12
Dependent Claim 19 words
The method of claim 1, further including the step of: electrically connecting said multilayer semiconductor to said V- potential.
Claim 13
Dependent Claim 33 words
The method of claim 11, wherein said step of electrically connecting said multilayer semiconductor comprises electrically connecting the surface of the layer of said multilayer semiconductor which is distal from said passivated portion.
Claim 14
Dependent Claim 71 words
The method of claim 1, further including the step of: passivating a portion of the device with non-alkaline glass in a last high temperature process step in which the temperature of the glass is raised to the firing temperature of the glass in which no further processing step employs conditions which result in charge creation, and subjecting the passivated portion of the device to appropriately charged ions from a corona discharge.
Claim 15
Dependent Claim 28 words
The method of claim 13 and further including the step of heating the semiconductor device during the time that the passivation layer is subjected to appropriately charged ions.
Claim 16
Dependent Claim 28 words
The method of claim 14 and further including the steps of cooling said semiconductor device and subjecting said device to said ions during cooling of said semiconductor device.

References Cited (Backward Citations)

US2221338A Cited
US3879183A Cited
US3895127A Cited
US4007294A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1988-11-04 1989-05-06 1989-11-05 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1992-11-04 1993-05-06 1993-11-05 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1996-11-04 1997-05-06 1997-11-05 $7700.00 Window Closed / Lapsed

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