Abstract Novel coupling compositions for improving adhesion between an organic elastomer and an inorganic substrate comprise (A) an ethylenically unsaturated silane, having bonded to silicon, at least one hydroxy group and/or alkoxy group reactive with the inorganic substrate and at least one ethylenically unsaturated group polymerizable with the organic elastomeric matrix; (B) an organosiloxane oligomer, having bonded to silicon, at least one hydroxy and/or alkoxy group reactive with said inorganic substrate; and (C) optionally, an ethylenically unsaturated organosiloxane oligomer, having bonded to silicon, at least one ethylenically unsaturated group polymerizable with said organic elastomeric matrix. The novel curable compositions contain the novel coupling compositions, an organic elastomer, an inorganic filler, and a peroxide crosslinking agent. The novel cured compositions are produced by heating the novel curable composition to a temperature above the decomposition temperature of the peroxide thereby inducing crosslinking of the organic elastomer. The novel electrical cable comprises a conductor having a coating of insulation which comprises the novel cured composition.
An electrical cable comprising a conductor and a coating of insulation on said conductor said coating comprising a cured composition comprising: (1) an organic elastomer; (2) an inorganic filler; (3) a coupling composition comprising: (a) 5 to 95 wt. % of an ethylenically unsaturated silane selected from the group consisting of vinyltriethoxysilane, vinyltrimethoxysilane and gamma-methacryloxypropyltrimethoxysilane; (b) 95 to 5 wt. % of a methyl ethoxy siloxane fluid having an average molecular weight of about 500, having an ethoxy content of 35 to 55 wt. %, and having the formula: C.sub.2 H.sub.5 O[(CH).sub.3 (C.sub.2 H.sub.5 O)SiO].sub.x C.sub.2 H.sub.5 in which x is an integer of about 10; and (c) 0 to 10 wt. % of methylvinyl siloxane fluid having the formula: C.sub.12 H.sub.25 O[(CH.sub.3)(CH.sub.2 ═CH)SiO].sub.y C.sub.12 H.sub.25 wherein y is an integer of 4 to 20; and (4) a peroxide capable of crosslinking said organic elastomer.
Claim 2
Dependent Claim
145 words
An electrical cable comprising a conductor and a coating of insulation on said conductor said coating comprising a cured composition comprising: (1) an organic elastomer; (2) an inorganic filler; (3) a coupling composition comprising: (a) 5 to 95 wt. % of an ethylenically unsaturated silane selected from the group consisting of vinyltriethoxysilane, vinyltrimethoxysilane and gamma-methacryloxypropyltrimethoxysilane; (b) 95 to 5 wt. % of a methyl ethoxy siloxane fluid having an average molecular weight of about 500, having an ethoxy content of 35 to 55 wt. %, and having the formula: C.sub.2 H.sub.5 O[(CH).sub.3 (C.sub.2 H.sub.5 O)SiO].sub.x C.sub.2 H.sub.5 in which x is an integer of about 10; and (c) 0 to 10 wt. % of methylvinyl siloxane fluid having the formula: C.sub.12 H.sub.25 O[(CH.sub.3)(CH.sub.2 ═CH)SiO].sub.y C.sub.12 H.sub.25 wherein y is an integer of 4 to 20; and (4) a peroxide capable of crosslinking said organic elastomer.
Claim 3
Dependent Claim
50 words
The electrical cable of claim 1 wherein the coupling composition comprises: (a) 65 to 75 wt. % vinyltriethoxysilane and (b) 35 to 25 wt. % of said methyl ethoxy siloxane fluid; and wherein the cured composition was cured by heating to a temperature above the decomposition temperature of said peroxide.
Claim 4
Dependent Claim
50 words
The electrical cable of claim 1 wherein the coupling composition comprises: (a) 60 to 70 wt. % vinyltrimethoxysilane and (b) 35 to 25 wt. % of said methyl ethoxy silane fluid; and wherein the cured composition was cured by heating to a temperature above the decomposition temperature of said peroxide.
Claim 5
Dependent Claim
50 words
The electrical cable of claim 1 wherein the coupling composition comprises: (a) 45 to 55 wt. % gamma-methacryloxypropyltrimethoxysilane and (b) 55 to 45 wt. % of said methyl ethoxy silicone fluid; and wherein the cured composition was cured by heating to a temperature above the decomposition temperature of said peroxide.