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US4548685A Expired / Lapsed US ⏱️ 0.0 years remaining

Process for electrolytically removing metal deposit from a non-plated surface of a single surface-plated metal strip

Assignee: Nippon Steel Corp
•
Filing: 1984-08-23
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Granted: 1985-10-22
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Expires: 2004-08-23
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Abstract

Abstract In a process for electrolytically removing metal deposit from a non-plated surface of a single surface-plated metal strip, by bringing, within an electrolytic liquid, a single surface-plated metal strip which serves as an anode plate, into a location at which the non-plated surface of the anode single surface-plated metal strip faces in parallel to and is spaced from a cathode plate, and by applying a principal voltage between the anode metal strip and said cathode plate to electrolytically remove metal deposit from the non-plated surface; whereby undesirable stripping of portions of the plated metal layer in side edge portions of the plated surface of the metal strip is prevented by arranging supplementary anode plates within the electrolytic liquid in such a manner that the supplementary anode plates face in parallel to and are spaced from side edge portions of the plated surface of the anode metal strip, and then, while the principal voltage is applied between the anode metal strip and the cathode plate, a supplementary voltage is applied between the supplementary anode plates and the metal strip, the electric potential of each supplementary anode plate being higher than that of the metal strip.

Inventors

  • 👤 Yukimasa Suemitsu
  • 👤 Kazutsugu Nakajima
  • 👤 Ryoichi Naka
  • 👤 Hiroo Goshi

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-31 06:59
CPC Classifications
C; C25; C25F; C25F5/00; C25F7/00; Y; Y10; Y10S; Y10S204/00; Y10S204/07

Claims Analysis

Total Claims: 5
Claim 1
Independent Claim 212 words
A process for electrolytically removing metal deposit from a non-plated surface of a single surface-plated metal strip, comprising; bringing, within an electrolytic liquid, a single surface-plated metal strip which serves as an anode plate, into a location at which the non-plated surface of said anode single surface-plated metal strip faces in parallel to and is spaced from a cathode plate, and applying a principal voltage between said anode metal strip and said cathode plate and electrolytically removing metal deposit from said non-plated surface; which process is characterized in that said electrolytic liquid consists of an aqueous solution containing NaH 2 PO 4 .2H 2 O and a pair of supplementary anode plates are arranged, within said electrolytic liquid, in locations such that said supplementary anode plates face in parallel to and are spaced from side edge portions of the plated surface of said anode metal strip, and, while the principal voltage is applied between said anode metal strip and said cathode plate, a supplementary voltage is applied between said supplementary anode plates and said metal strip, the electric potential of said supplementary anode plates being higher than that of said metal strip, thereby preventing undersirable stripping of portions of the plated metal layer in said side edge portions of said plated surface.
Claim 2
Dependent Claim 212 words
A process for electrolytically removing metal deposit from a non-plated surface of a single surface-plated metal strip, comprising; bringing, within an electrolytic liquid, a single surface-plated metal strip which serves as an anode plate, into a location at which the non-plated surface of said anode single surface-plated metal strip faces in parallel to and is spaced from a cathode plate, and applying a principal voltage between said anode metal strip and said cathode plate and electrolytically removing metal deposit from said non-plated surface; which process is characterized in that said electrolytic liquid consists of an aqueous solution containing NaH 2 PO 4 .2H 2 O and a pair of supplementary anode plates are arranged, within said electrolytic liquid, in locations such that said supplementary anode plates face in parallel to and are spaced from side edge portions of the plated surface of said anode metal strip, and, while the principal voltage is applied between said anode metal strip and said cathode plate, a supplementary voltage is applied between said supplementary anode plates and said metal strip, the electric potential of said supplementary anode plates being higher than that of said metal strip, thereby preventing undersirable stripping of portions of the plated metal layer in said side edge portions of said plated surface.
Claim 3
Dependent Claim 41 words
The process as claimed in claim 1, wherein the principal voltage applied between said anode metal strip and said cathode plate causes a principal electric current to be created at a current density of from 30 to 100 A/dm 2 .
Claim 4
Dependent Claim 36 words
The process as claimed in claim 1, wherein the supplementary voltage applied between said supplementary anode plates and said metal strip results in the creation of a supplementary electric current of from 150 to 300 A.
Claim 5
Dependent Claim 15 words
The process as claimed in claim 1, wherein said metal strip is a steel strip.

References Cited (Backward Citations)

US3970537A Cited
US3959099A Cited
US3988216A Cited
US4464232A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1988-10-21 1989-04-22 1989-10-22 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1992-10-21 1993-04-22 1993-10-22 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1996-10-21 1997-04-22 1997-10-22 $7700.00 Window Closed / Lapsed

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