US4544625A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Photosensitive resin composition and photosensitive element
Assignee: Resonac Corp
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Filing: 1984-02-03
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Granted: 1985-10-01
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Expires: 2004-02-03
Abstract
Abstract A photosensitive resin composition comprising (a) 20 to 75 parts by weight of an urethane diacrylate or dimethacrylate compound obtained by reacting trimethylhexamethylene diisocyanate with an acrylic or methacrylic monoester of a dihydric alcohol, (b) 20 to 75 parts by weight of a linear polymeric compound having a glass transition temperature of about 40° to 150° C., (c) a sensitizer and/or a sensitizer system which generate free radicals owing to actinic light, and (d) an acrylic or methacrylic ester containing a phosphoric acid group in the molecule in an amount of 0.01 to 5% by weight based on the total weight of components (a) and (b) is excellent in heat resistance, resistance to thermal shock and solvent resistance, and is suitable for forming a soldering mask. Further, a photosensitive element produced by forming a layer of the above-mentioned composition on a support gives a protective coating film excellent in heat resistance, resistance to thermal shock and solvent resistance, and is particularly suitable for a soldering mask.
Inventors
- 👤 Toshiaki Ishimaru
- 👤 Katsushige Tsukada
- 👤 Nobuyuki Hayashi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 12:55
CPC Classifications
G; G03; G03F; G03F7/00; G03F7/004; G03F7/027; B; B23; B23K; B23K35/00; B23K35/22; B23K35/224; C; C08; C08F; C08F299/00; C08F299/02; C08F299/06; C08F299/065; C08G; C08G18/00; C08G18/06; C08G18/28; C08G18/67; C08G18/671; C08G18/672; H; H05; H05K; H05K3/00; H05K3/22; H05K3/28; H05K3/285; H05K3/287; H05K2203/00; H05K2203/07; H05K2203/0779; H05K2203/0783; Y; Y10; Y10S; Y10S430/00; Y10S430/162
Claims Analysis
Total Claims: 21
Claim 1
Independent Claim
209 words
A photosensitive resin composition for forming a solder mask comprising (a) 20 to 75 parts by weight of an urethane diacrylate or urethane dimethacrylate compound that has a molecular weight of 600 or less and that is obtained by reacting, (i) trimethylhexamethylene diisocyanate and (ii) an acrylic or methacrylic monoester of a dihydric alcohol which has 1 to 8 carbon atoms, (b) 20 to 75 parts by weight of a linear polymeric compound having a glass transition temperature of about 40° to 150° C., (c) a sensitizer and/or a sensitizer system which generate free radicals owing to actinic light in an amount of 0.5 to 10% by weight based on the total weight of the urethane diacrylate or urethane dimethacrylate compound (a) and the linear polymeric compound (b), and (d) an acrylic or methacrylic ester containing a phosphoric acid group in the molecule represented by the formula: ##STR5## wherein R 3 is an organic group containing an acryloyl or methacryloyl group; and R 4 is hydrogen or an organic group containing an alkyl group or an acryloyl or methacryloyl group, in an amount of 0.01 to 5% by weight based on the total weight of the urethane diacrylate or urethane dimethacrylate compound (a) and the linear polymeric compound (b).
Claim 2
Dependent Claim
209 words
A photosensitive resin composition for forming a solder mask comprising (a) 20 to 75 parts by weight of an urethane diacrylate or urethane dimethacrylate compound that has a molecular weight of 600 or less and that is obtained by reacting, (i) trimethylhexamethylene diisocyanate and (ii) an acrylic or methacrylic monoester of a dihydric alcohol which has 1 to 8 carbon atoms, (b) 20 to 75 parts by weight of a linear polymeric compound having a glass transition temperature of about 40° to 150° C., (c) a sensitizer and/or a sensitizer system which generate free radicals owing to actinic light in an amount of 0.5 to 10% by weight based on the total weight of the urethane diacrylate or urethane dimethacrylate compound (a) and the linear polymeric compound (b), and (d) an acrylic or methacrylic ester containing a phosphoric acid group in the molecule represented by the formula: ##STR5## wherein R 3 is an organic group containing an acryloyl or methacryloyl group; and R 4 is hydrogen or an organic group containing an alkyl group or an acryloyl or methacryloyl group, in an amount of 0.01 to 5% by weight based on the total weight of the urethane diacrylate or urethane dimethacrylate compound (a) and the linear polymeric compound (b).
Claim 3
Dependent Claim
45 words
A composition according to claim 1, wherein the urethane diacrylate or dimethacrylate compound (a) is represented by the following formula: ##STR6## wherein R 1 is H or CH 3 ; R 2 is a residue of a dihydric a-lcohol; and X is a trimethylhexamethylene group.
Claim 4
Dependent Claim
27 words
A composition according to claim 1, wherein the acrylic or methacrylic monoester of a dihydric alcohol (ii) is hydroxyethyl acrylate, hydroxyethyl methacrylate, hydroxypropyl acrylate or hydroxypropyl methacrylate.
Claim 5
Dependent Claim
17 words
A composition according to claim 1, wherein the linear polymeric compound (b) is a vinyl series copolymer.
Claim 6
Dependent Claim
23 words
A composition according to claim 1, wherein the linear polymeric compound (b) contains bromine atoms in an amount up to 40% by weight.
Claim 7
Dependent Claim
28 words
A composition according to claim 4, wherein the linear polymeric compound (b) contains 5 to 65% by weight of tribromophenyl acrylate or tribromophenyl methacrylate as a copolymer component.
Claim 8
Dependent Claim
19 words
A composition according to claim 1, which additionally contains antimony trioxide in an amount up to 5% by weight.
Claim 9
Dependent Claim
225 words
A photosensitive element for forming a solder mask comprising (I) a layer of a photosensitive resin composition comprising (a) 20 to 75 parts by weight of a urethane diacrylate or urethane dimethacrylate compound that has a molecular weight of 600 or less and that is obtained by reacting, (i) trimethylhexamethylene diisocyanate, and (ii) an acrylic or methacrylic monoester of a dihydric alcohol which has 1 to 8 carbon atoms, (b) 20 to 75 parts by weight of a linear polymeric compound having a glass transition temperature of about 40° to 150° C., (c) a sensitizer and/or a sensitizer system which generate free radicals owing to actinic light in an amount of 0.5 to 10% by weight based on the total weight of the urethane diacrylate or urethane dimethacrylate compound (a) and the linear polymeric compound (b), and (d) an acrylic or methacrylic ester containing a phosphoric acid group in the molecule represented by the formula: ##STR7## wherein R 3 is an organic group containing an acryloyl or methacryloyl group; and R 4 is hydrogen or an organic group containing an alkyl group or an acryloyl or methacryloyl group, in an amount of 0.01 to 5% by weight based on the total weight of the urethane diacrylate or urethane dimethacrylate compound (a) and the linear polymeric compound (b), and (II) a support film supporting said layer.
Claim 10
Dependent Claim
225 words
A photosensitive element for forming a solder mask comprising (I) a layer of a photosensitive resin composition comprising (a) 20 to 75 parts by weight of a urethane diacrylate or urethane dimethacrylate compound that has a molecular weight of 600 or less and that is obtained by reacting, (i) trimethylhexamethylene diisocyanate, and (ii) an acrylic or methacrylic monoester of a dihydric alcohol which has 1 to 8 carbon atoms, (b) 20 to 75 parts by weight of a linear polymeric compound having a glass transition temperature of about 40° to 150° C., (c) a sensitizer and/or a sensitizer system which generate free radicals owing to actinic light in an amount of 0.5 to 10% by weight based on the total weight of the urethane diacrylate or urethane dimethacrylate compound (a) and the linear polymeric compound (b), and (d) an acrylic or methacrylic ester containing a phosphoric acid group in the molecule represented by the formula: ##STR7## wherein R 3 is an organic group containing an acryloyl or methacryloyl group; and R 4 is hydrogen or an organic group containing an alkyl group or an acryloyl or methacryloyl group, in an amount of 0.01 to 5% by weight based on the total weight of the urethane diacrylate or urethane dimethacrylate compound (a) and the linear polymeric compound (b), and (II) a support film supporting said layer.
Claim 11
Dependent Claim
55 words
A photosensitive element according to claim 8, wherein the urethane diacrylate or dimethacrylate compound (a) in the layer (I) of the photosensitive resin composition is represented by the following formula: ##STR8## wherein R 1 is H or CH 3 ; R 2 is a residue of a dihydric alcohol; and X is a trimethylhexamethylene group.
Claim 12
Dependent Claim
36 words
A photosensitive element according to claim 8, wherein the acrylic or methacrylic monoester of dihydric alcohol (ii) in the layer (I) of the photosensitive resin composition is hydroxyethyl acrylate, hydroxyethyl methacrylate, hydroxypropyl acrylate or hydroxypropyl methacrylate.
Claim 13
Dependent Claim
27 words
A photosensitive element according to claim 8, wherein the linear polymeric compound (b) in the layer (I) of the photosensitive resin composition is a vinyl series copolymer.
Claim 14
Dependent Claim
33 words
A photosensitive element according to claim 8, wherein the linear polymeric compound (b) in the layer (I) of the photosensitive resin composition contains bromine atoms in an amount up to 40% by weight.
Claim 15
Dependent Claim
38 words
A photosensitive element according to claim 11, wherein the linear polymeric compound (b) in the layer (I) of the photosensitive resin composition contains 5 to 65% by weight of tribromophenyl acrylate or tribromophenyl methacrylate as a polymerization component.
Claim 16
Dependent Claim
28 words
A photosensitive element according to claim 8, wherein the layer (I) of the photosensitive resin composition additionally contains antimony trioxide in an amount up to 5% by weight.
Claim 17
Dependent Claim
24 words
A photosensitive element according to claim 8, wherein the layer (I) of the photosensitive resin composition has a thickness of 20 to 200 μm.
Claim 18
Dependent Claim
29 words
A photosensitive element according to claim 8, wherein the support film (II) is a polyester film, a polyimide film, a polyamide-imide film, a polypropylene film or a polystyrene film.
Claim 19
Dependent Claim
23 words
A photosensitive element according to claim 8, which further laminates a releasable covering film on the layer (I) of the photosensitive resin composition.
Claim 20
Dependent Claim
239 words
A process for forming a solder mask by employing a photosensitive resin composition in the construction of said solder mask wherein the photosensitive resin conposition is applied to a support film as a photosensitive layer, said photosensitive resin composition comprising (a) 20 to 75 parts by weight of an urethane diacrylate or urethane dimethacrylate compound that has a molecular weight of 600 or less and that is obtained by reacting, (i) trimethylhexamethylene diisocyanate and (ii) an acrylic or methacrylic monoester of a dihydric alcohol which has 1 to 8 carbon atoms, (b) 20 to 75 parts by weight of a linear polymeric compound having a glass transition temperature of about 40° to 150° C., (c) a sensitizer and/or a sensitizer system which generate free radicals owing to actinic light in an amount of 0.5 to 10% by weight based on the total weight of the urethane diacrylate or urethane dimethacrylate compound (a) and the linear polymeric compound (b), and (d) an acrylic or methacrylic ester containing a phosphoric acid group in the molecule represented by the formula: ##STR9## wherein R 3 is an organic group containing an acryloyl or methacryloyl group; and R 4 is hydrogen or an organic group containing an alkyl group or an acryloyl or methacryloyl group, in an amount of 0.01 to 5% by weight based on the total weight of the urethane diacrylate or urethane dimethacrylate compound (a) and the linear polymeric compound (b).
Claim 21
Dependent Claim
239 words
A process for forming a solder mask by employing a photosensitive resin composition in the construction of said solder mask wherein the photosensitive resin conposition is applied to a support film as a photosensitive layer, said photosensitive resin composition comprising (a) 20 to 75 parts by weight of an urethane diacrylate or urethane dimethacrylate compound that has a molecular weight of 600 or less and that is obtained by reacting, (i) trimethylhexamethylene diisocyanate and (ii) an acrylic or methacrylic monoester of a dihydric alcohol which has 1 to 8 carbon atoms, (b) 20 to 75 parts by weight of a linear polymeric compound having a glass transition temperature of about 40° to 150° C., (c) a sensitizer and/or a sensitizer system which generate free radicals owing to actinic light in an amount of 0.5 to 10% by weight based on the total weight of the urethane diacrylate or urethane dimethacrylate compound (a) and the linear polymeric compound (b), and (d) an acrylic or methacrylic ester containing a phosphoric acid group in the molecule represented by the formula: ##STR9## wherein R 3 is an organic group containing an acryloyl or methacryloyl group; and R 4 is hydrogen or an organic group containing an alkyl group or an acryloyl or methacryloyl group, in an amount of 0.01 to 5% by weight based on the total weight of the urethane diacrylate or urethane dimethacrylate compound (a) and the linear polymeric compound (b).
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
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| 3.5 Years (Year 4) | 1988-09-30 | 1989-04-01 | 1989-10-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1992-09-30 | 1993-04-01 | 1993-10-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1996-09-30 | 1997-04-01 | 1997-10-01 | $7700.00 | Window Closed / Lapsed |